BR112013023721A2 - máquina e método para o processamento de material de peças a serem trabalhadas com um raio laser - Google Patents

máquina e método para o processamento de material de peças a serem trabalhadas com um raio laser

Info

Publication number
BR112013023721A2
BR112013023721A2 BR112013023721A BR112013023721A BR112013023721A2 BR 112013023721 A2 BR112013023721 A2 BR 112013023721A2 BR 112013023721 A BR112013023721 A BR 112013023721A BR 112013023721 A BR112013023721 A BR 112013023721A BR 112013023721 A2 BR112013023721 A2 BR 112013023721A2
Authority
BR
Brazil
Prior art keywords
worked
machine
parts
laser beam
material processing
Prior art date
Application number
BR112013023721A
Other languages
English (en)
Other versions
BR112013023721B1 (pt
Inventor
Andreas Siewert
Artjom Jfuchs
Ingo Schramm
Jörg Thieme
Manfred Barz
Original Assignee
Ipg Photonics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ipg Photonics Corp filed Critical Ipg Photonics Corp
Publication of BR112013023721A2 publication Critical patent/BR112013023721A2/pt
Publication of BR112013023721B1 publication Critical patent/BR112013023721B1/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/706—Protective screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
BR112013023721A 2011-03-16 2012-02-01 máquina e método para o processamento de material de peças a serem trabalhadas com um raio laser BR112013023721B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011001322A DE102011001322A1 (de) 2011-03-16 2011-03-16 Maschine und Verfahren zur Materialbearbeitung von Werkstücken mit einem Laserstrahl
PCT/EP2012/051623 WO2012123167A1 (de) 2011-03-16 2012-02-01 Maschine und verfahren zur materialbearbeitung von werkstücken mit einem laserstrahl

Publications (2)

Publication Number Publication Date
BR112013023721A2 true BR112013023721A2 (pt) 2016-12-13
BR112013023721B1 BR112013023721B1 (pt) 2018-08-28

Family

ID=45688447

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013023721A BR112013023721B1 (pt) 2011-03-16 2012-02-01 máquina e método para o processamento de material de peças a serem trabalhadas com um raio laser

Country Status (9)

Country Link
US (1) US9321129B2 (pt)
EP (2) EP2686131B1 (pt)
JP (1) JP6029600B2 (pt)
KR (2) KR20140022821A (pt)
CN (1) CN103459084B (pt)
BR (1) BR112013023721B1 (pt)
DE (1) DE102011001322A1 (pt)
MX (1) MX340966B (pt)
WO (1) WO2012123167A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108472764B (zh) * 2016-01-12 2020-04-24 美仕克机械有限公司 用于激光切割机的保护系统
JP6884184B2 (ja) * 2019-09-25 2021-06-09 株式会社牧野フライス製作所 ウォータジェットレーザ加工機
DE102019129503A1 (de) * 2019-10-31 2021-05-06 Oswald Elektromotoren Gmbh Handgeführtes Laserbearbeitungsgerät zur Bearbeitung eines Werkstücks und Trichter für ein handgeführtes Laserbearbeitungsgerät
DE102020200114A1 (de) * 2020-01-08 2021-07-08 Volkswagen Aktiengesellschaft Verfahren zur Sicherheitsabschaltung bei einem Laserprozess
DE102021108496A1 (de) 2021-04-06 2022-10-06 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung und Verfahren zur Ermittlung einer Standzeit eines Werkstückprüflings bei Laserbestrahlung
DE102021133851A1 (de) 2021-12-20 2023-06-22 Messer Cutting Systems Gmbh Vorrichtung für die thermische Bearbeitung eines Werkstücks mit Laserstrahlung sowie dafür geeignete Schutzhaube
DE102022205579A1 (de) 2022-06-01 2023-12-07 Trumpf Lasersystems For Semiconductor Manufacturing Gmbh Schwingungsüberwachte Laseroptik

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6032555B2 (ja) * 1979-09-28 1985-07-29 株式会社日立製作所 レ−ザビ−ム溶接回転ヘツド
US4752668A (en) * 1986-04-28 1988-06-21 Rosenfield Michael G System for laser removal of excess material from a semiconductor wafer
JPH0435029Y2 (pt) * 1986-07-10 1992-08-19
JPH03258479A (ja) * 1990-03-06 1991-11-18 Mitsubishi Electric Corp レーザ加工装置
DE4109567C3 (de) * 1991-03-22 1997-03-13 Precitec Gmbh Einrichtung zur Bearbeitung eines Werkstücks mit Hilfe eines Laserstrahls
DE19615633C1 (de) * 1996-04-20 1997-04-30 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum handgeführten Bearbeiten von Werkstücken mittels Bestrahlung, insbesondere mittels Laserstrahlung
DE19629037C1 (de) * 1996-07-18 1997-07-31 Erwin Martin Heberer Wandelement für eine einen Arbeits- oder Wirkungsbereich umgebende Schutzvorrichtung gegen Laserstrahlen einer Laserquelle
DE19636458C1 (de) * 1996-09-07 1998-04-02 Schweistechnische Lehr Und Ver Manuell zu positionierende und zu betätigende Einrichtung zum Laserstrahlschweißen
JP3385176B2 (ja) * 1997-03-31 2003-03-10 三菱電機株式会社 レーザ装置用蛇腹およびレーザビーム照射検出装置およびレーザビーム照射自動対処装置
DE19817629C2 (de) * 1998-03-31 2002-05-29 Klaus Luig Laserbearbeitungsvorrichtung zum Fügen und/oder Beschichten von Werkstücken sowie Verfahren zum Fügen und/oder Beschichten von Werkstücken
WO1999056907A1 (de) * 1998-04-30 1999-11-11 Synova S.A. Materialbearbeitungsvorrichtung mit einem in einen flüssigkeitsstrahl eingekoppelten laserstrahl
US6335208B1 (en) * 1999-05-10 2002-01-01 Intersil Americas Inc. Laser decapsulation method
JP2001219269A (ja) * 2000-02-07 2001-08-14 Hitachi Ltd 水中加工装置及びその加工方法
DE10017284C1 (de) * 2000-04-06 2001-06-21 Daimler Chrysler Ag Wandelement für eine Schutzvorrichtung gegen Laserstrahlung
DE10059246C2 (de) * 2000-11-29 2003-02-06 Eads Deutschland Gmbh Schutzeinrichtung für ein handgeführtes Laser-Materialbearbeitungsgerät, sowie handgeführtes Gerät und Verfahren zur Laser-Materialbearbeitung, insbesondere zur Laserbeschriftung
DE10257112A1 (de) * 2002-12-05 2004-06-24 Hänsch, Dirk, Dr. Laserstrahlbearbeitungsvorrichtung zum Fügen und/oder Beschichten von Kunststoffen
JP2004322125A (ja) * 2003-04-23 2004-11-18 Dainippon Printing Co Ltd レーザ加工機用押え装置
GB2414954B (en) * 2004-06-11 2008-02-06 Exitech Ltd Process and apparatus for ablation
JP2006315356A (ja) * 2005-05-16 2006-11-24 Hitachi Metals Ltd 樹脂被覆鋼管の接続部の被覆装置
DE102006053579A1 (de) * 2006-11-10 2008-05-15 Jenoptik Automatisierungstechnik Gmbh Laserschutzvorrichtung mit Sicherheitsabschaltung
JP2008155246A (ja) * 2006-12-22 2008-07-10 Sumitomo Electric Ind Ltd レーザ加工機
EP2185309B1 (de) * 2007-08-08 2011-01-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung Laserschutzwandelelement für eine umhausung bei laserbearbeitungsanlagen
DE202007012255U1 (de) 2007-08-31 2009-01-08 Ingenieurbüro Goebel GmbH Vorrichtung zur Erkennung von optischer Strahlung
EP2149421B1 (de) 2008-07-30 2011-11-30 IPG Photonics Corporation Laser-Schweißwerkzeug mit einem Faserlaser

Also Published As

Publication number Publication date
JP6029600B2 (ja) 2016-11-24
KR20160125521A (ko) 2016-10-31
EP2686131B1 (de) 2018-01-17
MX2013010502A (es) 2013-10-17
EP3308898A1 (de) 2018-04-18
CN103459084A (zh) 2013-12-18
KR20140022821A (ko) 2014-02-25
BR112013023721B1 (pt) 2018-08-28
US9321129B2 (en) 2016-04-26
EP2686131A1 (de) 2014-01-22
MX340966B (es) 2016-08-02
US20140209585A1 (en) 2014-07-31
CN103459084B (zh) 2016-01-06
WO2012123167A1 (de) 2012-09-20
JP2014511766A (ja) 2014-05-19
DE102011001322A1 (de) 2012-09-20

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Legal Events

Date Code Title Description
B15K Others concerning applications: alteration of classification

Ipc: B23K 26/12 (2014.01), B23K 26/08 (2014.01), B23K 2

B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 01/02/2012, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 10A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2655 DE 23-11-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.