BR112013022101A2 - conjunto de placa de circuito - Google Patents

conjunto de placa de circuito

Info

Publication number
BR112013022101A2
BR112013022101A2 BR112013022101A BR112013022101A BR112013022101A2 BR 112013022101 A2 BR112013022101 A2 BR 112013022101A2 BR 112013022101 A BR112013022101 A BR 112013022101A BR 112013022101 A BR112013022101 A BR 112013022101A BR 112013022101 A2 BR112013022101 A2 BR 112013022101A2
Authority
BR
Brazil
Prior art keywords
circuit board
layer
board set
conductive layer
dielectric layer
Prior art date
Application number
BR112013022101A
Other languages
English (en)
Inventor
Pascal Pavao
Original Assignee
Koninkl Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Nv filed Critical Koninkl Philips Nv
Publication of BR112013022101A2 publication Critical patent/BR112013022101A2/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/04—Resilient mountings, e.g. shock absorbers 
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F21V15/015—Devices for covering joints between adjacent lighting devices; End coverings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

conjunto de placa de circuito métodos e aparelhos relativos a uma placa de circuito que possui uma camada dielétrica (140a/b, 240a/b, 340, 440, 340b, 440b) sobre o seu topo e/ou fundo. é fornecida uma placa de circuito que possui uma camada de núcleo (110, 210, 310, 410) e pelo menos uma camada condutora (130a/b, 132a/b, 232a/b, 330, 430) posicionada sobre um primeiro lado da mencionada camada de núcleo (110, 210, 310, 410). é fornecida uma camada dielétrica externa (140a/b, 240a/b, 340, 440, 340b, 440b) sobre uma camada mais externa dentre a pelo menos uma camada condutora (130a/b, 132a/b, 232a/b, 330, 430). a camada dielétrica (140a/b, 240a/b, 340, 440, 440b) inclui uma série de aberturas (334a, 336a, 445a) que fornecem acesso a pelo menos uma das almofadas de conexão e trajetos que estão em contato elétrico com uma ou mais da (s) camada (s) condutora (s) (130a/b, 132a/b, 230a/b, 232a/b, 330, 430).
BR112013022101A 2011-03-03 2012-02-28 conjunto de placa de circuito BR112013022101A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161448819P 2011-03-03 2011-03-03
PCT/IB2012/050916 WO2012117345A1 (en) 2011-03-03 2012-02-28 Circuit board assembly

Publications (1)

Publication Number Publication Date
BR112013022101A2 true BR112013022101A2 (pt) 2016-12-06

Family

ID=45992567

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013022101A BR112013022101A2 (pt) 2011-03-03 2012-02-28 conjunto de placa de circuito

Country Status (7)

Country Link
US (1) US9046250B2 (pt)
EP (1) EP2681977A1 (pt)
JP (1) JP6235344B2 (pt)
CN (1) CN103404240B (pt)
BR (1) BR112013022101A2 (pt)
RU (1) RU2605757C2 (pt)
WO (1) WO2012117345A1 (pt)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM506378U (zh) * 2014-10-15 2015-08-01 Paragon Sc Lighting Tech Co 用於提供照明的發光結構及用於承載發光二極體的電路基板
CN204372713U (zh) * 2015-02-10 2015-06-03 北京京东方多媒体科技有限公司 一种背光源模组及显示装置
WO2019106549A1 (en) * 2017-11-30 2019-06-06 Corvi Led Private Limited Light assembly module and light assembly module system

Family Cites Families (21)

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US5081563A (en) 1990-04-27 1992-01-14 International Business Machines Corporation Multi-layer package incorporating a recessed cavity for a semiconductor chip
US6103992A (en) * 1996-11-08 2000-08-15 W. L. Gore & Associates, Inc. Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
WO2005077033A2 (en) * 2004-02-09 2005-08-25 Bruce Industries, Inc. Led burning prevention
US7201497B2 (en) * 2004-07-15 2007-04-10 Lumination, Llc Led lighting system with reflective board
KR100593945B1 (ko) * 2005-05-30 2006-06-30 삼성전기주식회사 고출력 ｌｅｄ 패키지 및 그 제조방법
WO2007004572A1 (ja) * 2005-06-30 2007-01-11 Matsushita Electric Works, Ltd. 発光装置
DE102005032489B3 (de) 2005-07-04 2006-11-16 Schweizer Electronic Ag Leiterplatten-Mehrschichtaufbau mit integriertem elektrischem Bauteil und Herstellungsverfahren
KR100653249B1 (ko) * 2005-12-07 2006-12-04 삼성전기주식회사 메탈코어, 패키지 기판 및 그 제작방법
US7806574B2 (en) * 2006-04-16 2010-10-05 Albeo Technologies, Inc. Thermal management of LED-based lighting systems
CN103298243B (zh) * 2006-07-14 2016-05-11 斯塔布科尔技术公司 具有构成电路一部分的核心层的增层印刷线路板衬底
JP4992342B2 (ja) * 2006-08-23 2012-08-08 三菱電機株式会社 プリント配線板の製造方法
US8148647B2 (en) * 2006-08-23 2012-04-03 Mitsubishi Electric Corporation Printed circuit board and method of manufacturing the same
RU70342U1 (ru) * 2007-03-22 2008-01-20 Трансрегиональное потребительское общество "ЕвроАзиатская сервисная корпорация" Светодиодная матрица
KR100957411B1 (ko) * 2008-02-05 2010-05-11 엘지이노텍 주식회사 발광 장치
US7637630B2 (en) 2008-04-22 2009-12-29 Ruud Lighting, Inc. Integrated shield-gasket member in LED apparatus
US7845829B2 (en) * 2008-05-20 2010-12-07 Abl Ip Holding Llc Enclosures for LED circuit boards
US8360599B2 (en) 2008-05-23 2013-01-29 Ilumisys, Inc. Electric shock resistant L.E.D. based light
TWI389228B (zh) * 2009-01-23 2013-03-11 Everlight Electronics Co Ltd 電子元件
KR101027422B1 (ko) * 2009-06-08 2011-04-11 주식회사 이그잭스 엘이디 어레이 기판
US8292449B2 (en) * 2009-07-24 2012-10-23 Remote Ocean Systems, Inc. Modular lamp for illuminating a hazardous underwater environment

Also Published As

Publication number Publication date
EP2681977A1 (en) 2014-01-08
US20130329427A1 (en) 2013-12-12
CN103404240B (zh) 2017-09-08
JP6235344B2 (ja) 2017-11-22
RU2605757C2 (ru) 2016-12-27
JP2014515176A (ja) 2014-06-26
US9046250B2 (en) 2015-06-02
WO2012117345A1 (en) 2012-09-07
CN103404240A (zh) 2013-11-20
RU2013144389A (ru) 2015-04-10

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Legal Events

Date Code Title Description
B25A Requested transfer of rights approved

Owner name: PHILIPS LIGHTING HOLDING B.V. (NL)

B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 6A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]