BR112014019033A8 - método de fabricação de um circuito flexível de múltiplas camadas - Google Patents

método de fabricação de um circuito flexível de múltiplas camadas

Info

Publication number
BR112014019033A8
BR112014019033A8 BR112014019033A BR112014019033A BR112014019033A8 BR 112014019033 A8 BR112014019033 A8 BR 112014019033A8 BR 112014019033 A BR112014019033 A BR 112014019033A BR 112014019033 A BR112014019033 A BR 112014019033A BR 112014019033 A8 BR112014019033 A8 BR 112014019033A8
Authority
BR
Brazil
Prior art keywords
conductive layer
multilayer circuit
flexible multilayer
substrate
substrates
Prior art date
Application number
BR112014019033A
Other languages
English (en)
Other versions
BR112014019033B1 (pt
Inventor
Johnston Philip
Original Assignee
Trackwise Designs Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trackwise Designs Ltd filed Critical Trackwise Designs Ltd
Publication of BR112014019033A8 publication Critical patent/BR112014019033A8/pt
Publication of BR112014019033B1 publication Critical patent/BR112014019033B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/04—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band
    • B30B5/06—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band co-operating with another endless band
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1027—Pressing using at least one press band
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

método de fabricação um circuito flexível de múltiplas camadas um método de fabricação de um circuito flexível de múltiplas camadas compreende fornecer primeiros e segundos substratos flexíveis, cada compreendendo uma camada condutora e uma camada isolante. a camada condutora do primeiro substrato é uma camada condutora padronizada. o primeiro e segundo substratos são laminados em conjunto utilizando uma prensa de correia dupla através da qual os substratos movem em um processo contínuo. o método pode incluir a padronização da camada condutora do primeiro substrato e/ou a camada condutora do segundo substrato utilizando um método de gravação que inclui a exposição de uma resistência de película seca na camada condutora para um padrão através da realização de uma pluralidade de exposições de áreas adjacentes e/ou de sobreposição.
BR112014019033-0A 2012-02-02 2013-01-24 Método de fabricação de um circuito flexível de múltiplas camadas BR112014019033B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB201201806A GB2498994B (en) 2012-02-02 2012-02-02 Method of making a flexible circuit
GB1201806.5 2012-02-02
PCT/GB2013/050147 WO2013114080A1 (en) 2012-02-02 2013-01-24 Method of making a flexible circuit

Publications (2)

Publication Number Publication Date
BR112014019033A8 true BR112014019033A8 (pt) 2021-03-02
BR112014019033B1 BR112014019033B1 (pt) 2022-02-08

Family

ID=45896511

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014019033-0A BR112014019033B1 (pt) 2012-02-02 2013-01-24 Método de fabricação de um circuito flexível de múltiplas camadas

Country Status (7)

Country Link
US (1) US9226410B2 (pt)
EP (1) EP2810543B1 (pt)
CN (1) CN104145539B (pt)
BR (1) BR112014019033B1 (pt)
CA (1) CA2862772C (pt)
GB (1) GB2498994B (pt)
WO (1) WO2013114080A1 (pt)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201313893D0 (en) * 2013-08-02 2013-09-18 Day Ian J Network servier flex rigid
CN104375382A (zh) * 2014-03-31 2015-02-25 中能柔性光电（滁州）有限公司 一种柔性导电膜图形化制造方法
US9568626B2 (en) 2014-06-12 2017-02-14 Pgs Geophysical As Flexible printed circuits in marine geophysical streamers
CN106793581B (zh) * 2016-11-18 2019-05-14 深圳崇达多层线路板有限公司 多层n+n叠构线路板压合定位方法
WO2019014554A1 (en) * 2017-07-13 2019-01-17 Cellink Corporation METHODS AND DEVICES OF INTERCONNECTION CIRCUITS
CN107241865B (zh) * 2017-07-19 2023-09-12 广东力兹微电气技术有限公司 制造柔性线路板的设备及其工艺
US11800641B2 (en) 2019-06-14 2023-10-24 Hutchinson Aeronautique & Industrie Ltée. Composite panel comprising an integrated electrical circuit and manufacturing method thereof
US11572929B2 (en) 2020-04-16 2023-02-07 Raytheon Company Vibration isolator and method of assembly using flex circuits
US11821938B2 (en) 2021-09-30 2023-11-21 Hamilton Sundstrand Corporation Rigid-flex printed circuit board including built-in diagnostic
WO2024092246A1 (en) * 2022-10-28 2024-05-02 Electroninks Writeables, Inc. Electronic component stickers and methods of use

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4052603A (en) * 1974-12-23 1977-10-04 International Business Machines Corporation Object positioning process and apparatus
EP0087651B2 (de) 1982-02-27 1994-06-08 Kurt Held Vorrichtung zur Stützung der Pressbänder an wälzkörpergestützten Doppelbandpressen
DE3307057C2 (de) * 1983-03-01 1991-02-14 Held, Kurt, 7218 Trossingen Vorrichtung zur kontinuierlichen Herstellung kupferkaschierter Elektrolaminate
DE3342678C2 (de) * 1983-11-25 1995-08-31 Held Kurt Verfahren und Vorrichtung zur kontinuierlichen Herstellung metallkaschierter Laminate
DE3413434A1 (de) 1984-04-10 1985-10-17 Dielektra GmbH, 5000 Köln Verfahren zum kontinuierlichen herstellen von kupferkaschiertem basismaterial fuer leiterplatten
CN1004987B (zh) * 1985-02-07 1989-08-09 马克艾尔艾恩公司 作印刷电路板用的覆金属叠层板的生产方法
US4659425A (en) * 1986-02-03 1987-04-21 Ibm Corporation Continuous process for the manufacture of printed circuit boards
EP0291629A3 (de) 1987-05-16 1990-02-28 Aeg Isolier- Und Kunststoff Gmbh Verfahren zum kontinuierlichen Herstellen von bandförmigem Basismaterial
DE3803997A1 (de) 1988-02-10 1989-08-24 Held Kurt Vorrichtung zur kontinuierlichen herstellung von multilayer-leiterplatten
US5350621A (en) * 1992-11-30 1994-09-27 Allied-Signal Inc. System of electronic laminates with improved registration properties
DE4301844C2 (de) * 1993-01-23 1996-10-02 Held Kurt Verfahren und Vorrichtung zur Herstellung bahnförmiger Gemische bzw. Bahnen
EP0658300B1 (de) * 1993-07-07 2000-09-27 Dyconex Patente Ag Strukturierte leiterplatten und folienleiterplatten und verfahren zu deren herstellung
WO1997001437A1 (en) * 1995-06-28 1997-01-16 Fraivillig Materials Company Circuit board laminates and method of making
JPH09314785A (ja) * 1996-05-27 1997-12-09 Matsushita Electric Works Ltd 金属箔張り積層板の製造方法及び製造装置
US5976391A (en) * 1998-01-13 1999-11-02 Ford Motor Company Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same
US20010018796A1 (en) 1999-08-16 2001-09-06 Michael G. Lee Method of forming multilayer circuit structure
US7026436B2 (en) * 2002-11-26 2006-04-11 E.I. Du Pont De Nemours And Company Low temperature polyimide adhesive compositions and methods relating thereto
US7827682B2 (en) * 2005-04-21 2010-11-09 Endicott Interconnect Technologies, Inc. Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner
US20080295327A1 (en) 2007-06-01 2008-12-04 3M Innovative Properties Company Flexible circuit
JP5181618B2 (ja) * 2007-10-24 2013-04-10 宇部興産株式会社 金属箔積層ポリイミド樹脂基板
EP2307180B1 (en) * 2008-06-19 2011-11-09 Teijin Aramid B.V. Process for manufacturing polyolefin films
CN102308367B (zh) * 2009-02-06 2015-06-10 Lg化学株式会社 制造绝缘导电图形的方法和层压体

Also Published As

Publication number Publication date
EP2810543A1 (en) 2014-12-10
GB2498994B (en) 2014-03-19
CN104145539A (zh) 2014-11-12
BR112014019033B1 (pt) 2022-02-08
CN104145539B (zh) 2018-04-27
WO2013114080A1 (en) 2013-08-08
CA2862772A1 (en) 2013-08-08
US20150108084A1 (en) 2015-04-23
CA2862772C (en) 2020-07-14
GB201201806D0 (en) 2012-03-21
US9226410B2 (en) 2015-12-29
EP2810543B1 (en) 2019-08-28
GB2498994A (en) 2013-08-07

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Legal Events

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B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 24/01/2013, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 11A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2758 DE 14-11-2023 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.