BR112012016151A2 - clatrato, método para produzir um clatrato ou uma composição deste, e, composição de resina epóxi curável ou um produto curado da mesma - Google Patents

clatrato, método para produzir um clatrato ou uma composição deste, e, composição de resina epóxi curável ou um produto curado da mesma

Info

Publication number
BR112012016151A2
BR112012016151A2 BR112012016151A BR112012016151A BR112012016151A2 BR 112012016151 A2 BR112012016151 A2 BR 112012016151A2 BR 112012016151 A BR112012016151 A BR 112012016151A BR 112012016151 A BR112012016151 A BR 112012016151A BR 112012016151 A2 BR112012016151 A2 BR 112012016151A2
Authority
BR
Brazil
Prior art keywords
clathrate
composition
epoxy resin
resin composition
producing
Prior art date
Application number
BR112012016151A
Other languages
English (en)
Portuguese (pt)
Inventor
Kazuo Ono
Naoyuki Kamegaya
Natsuki Amanokura
Original Assignee
Nippon Soda Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Soda Co filed Critical Nippon Soda Co
Publication of BR112012016151A2 publication Critical patent/BR112012016151A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C65/00—Compounds having carboxyl groups bound to carbon atoms of six—membered aromatic rings and containing any of the groups OH, O—metal, —CHO, keto, ether, groups, groups, or groups
    • C07C65/01—Compounds having carboxyl groups bound to carbon atoms of six—membered aromatic rings and containing any of the groups OH, O—metal, —CHO, keto, ether, groups, groups, or groups containing hydroxy or O-metal groups
    • C07C65/03—Compounds having carboxyl groups bound to carbon atoms of six—membered aromatic rings and containing any of the groups OH, O—metal, —CHO, keto, ether, groups, groups, or groups containing hydroxy or O-metal groups monocyclic and having all hydroxy or O-metal groups bound to the ring
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
BR112012016151A 2010-01-20 2011-01-14 clatrato, método para produzir um clatrato ou uma composição deste, e, composição de resina epóxi curável ou um produto curado da mesma BR112012016151A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010010375 2010-01-20
JP2010228645 2010-10-08
PCT/JP2011/000172 WO2011089874A1 (ja) 2010-01-20 2011-01-14 包接化合物及びその製造方法

Publications (1)

Publication Number Publication Date
BR112012016151A2 true BR112012016151A2 (pt) 2015-09-15

Family

ID=44306676

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112012016151A BR112012016151A2 (pt) 2010-01-20 2011-01-14 clatrato, método para produzir um clatrato ou uma composição deste, e, composição de resina epóxi curável ou um produto curado da mesma

Country Status (5)

Country Link
JP (1) JP5536108B2 (zh)
CN (1) CN102725273B (zh)
BR (1) BR112012016151A2 (zh)
TW (1) TWI525073B (zh)
WO (1) WO2011089874A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2012035755A1 (ja) * 2010-09-15 2014-01-20 日本曹達株式会社 液状の硬化性エポキシ樹脂組成物及びそれを含有する接着剤
JP6046894B2 (ja) * 2011-12-28 2016-12-21 ナミックス株式会社 液状封止材
JP5901349B2 (ja) * 2012-02-28 2016-04-06 古河電気工業株式会社 接着フィルム、ウェハ加工用テープおよび接着フィルムの製造方法
US10266642B2 (en) * 2014-09-08 2019-04-23 Nippon Soda Co., Ltd. Crystal polymorphism of inclusion compound and method for producing same, and curable resin composition
CN106589828A (zh) * 2016-12-22 2017-04-26 科化新材料泰州有限公司 一种环保型环氧树脂组合物及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5000036B2 (ja) * 2000-12-11 2012-08-15 日本曹達株式会社 分子化合物の製造方法
JP5475940B2 (ja) * 2006-01-20 2014-04-16 日本曹達株式会社 スラリー法による包接化合物の製造法
EP2103600B1 (en) * 2006-12-21 2013-09-11 Nippon Soda Co., Ltd. Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin
US8653160B2 (en) * 2007-09-21 2014-02-18 Nippon Soda Co., Ltd. Inclusion complex containing epoxy resin composition for semiconductor encapsulation

Also Published As

Publication number Publication date
JP5536108B2 (ja) 2014-07-02
CN102725273A (zh) 2012-10-10
JPWO2011089874A1 (ja) 2013-05-23
TWI525073B (zh) 2016-03-11
CN102725273B (zh) 2016-02-17
WO2011089874A1 (ja) 2011-07-28
TW201139358A (en) 2011-11-16

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B11E Dismissal acc. art. 34 of ipl - requirements for examination incomplete
B11T Dismissal of application maintained [chapter 11.20 patent gazette]