BR112012015939A2 - método para soldagem de um componente para montagem em superfície e componente para montagem em superfície - Google Patents

método para soldagem de um componente para montagem em superfície e componente para montagem em superfície

Info

Publication number
BR112012015939A2
BR112012015939A2 BR112012015939A BR112012015939A BR112012015939A2 BR 112012015939 A2 BR112012015939 A2 BR 112012015939A2 BR 112012015939 A BR112012015939 A BR 112012015939A BR 112012015939 A BR112012015939 A BR 112012015939A BR 112012015939 A2 BR112012015939 A2 BR 112012015939A2
Authority
BR
Brazil
Prior art keywords
surface mount
mount component
welding
component
mount
Prior art date
Application number
BR112012015939A
Other languages
English (en)
Other versions
BR112012015939A8 (pt
BR112012015939B1 (pt
Inventor
Toyoda Minoru
Ueshima Minoru
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of BR112012015939A2 publication Critical patent/BR112012015939A2/pt
Publication of BR112012015939A8 publication Critical patent/BR112012015939A8/pt
Publication of BR112012015939B1 publication Critical patent/BR112012015939B1/pt

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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
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BR112012015939-9A 2009-12-28 2010-12-22 Método para soldagem de um componente para montagem em superfície e componente para montagem em superfície BR112012015939B1 (pt)

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JP2009-298932 2009-12-28
JP2009298932A JP2011138968A (ja) 2009-12-28 2009-12-28 面実装部品のはんだ付け方法および面実装部品
PCT/JP2010/073849 WO2011081213A1 (ja) 2009-12-28 2010-12-22 面実装部品のはんだ付け方法および面実装部品

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WO2011081213A1 (ja) 2011-07-07
US10297539B2 (en) 2019-05-21
JP2011138968A (ja) 2011-07-14
KR20160148726A (ko) 2016-12-26
EP2521429A4 (en) 2016-08-31
KR20120123291A (ko) 2012-11-08
ES2822311T3 (es) 2021-04-30
EP2521429B1 (en) 2020-09-09
KR20190132566A (ko) 2019-11-27
CN102714921A (zh) 2012-10-03
BR112012015939A8 (pt) 2018-07-17
CN102714921B (zh) 2016-08-03
US10354944B2 (en) 2019-07-16
KR20180130002A (ko) 2018-12-05
KR102240216B1 (ko) 2021-04-13
BR112012015939B1 (pt) 2023-11-28
US20150262926A1 (en) 2015-09-17
US20120292087A1 (en) 2012-11-22

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