BR102012009057A2 - processo para a preparaÇço de um composto a partir de uma pelÍcula de uma massa para moldar de cetona do Éter poliarilÊnico e de uma pelÍcula metÁlica e seu uso - Google Patents
processo para a preparaÇço de um composto a partir de uma pelÍcula de uma massa para moldar de cetona do Éter poliarilÊnico e de uma pelÍcula metÁlica e seu usoInfo
- Publication number
- BR102012009057A2 BR102012009057A2 BRBR102012009057-0A BR102012009057A BR102012009057A2 BR 102012009057 A2 BR102012009057 A2 BR 102012009057A2 BR 102012009057 A BR102012009057 A BR 102012009057A BR 102012009057 A2 BR102012009057 A2 BR 102012009057A2
- Authority
- BR
- Brazil
- Prior art keywords
- film
- preparation
- compound
- weight
- parts
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/288—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyketones
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
- Y10T428/24975—No layer or component greater than 5 mils thick
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
PROCESSO PARA A PREPARAÇçO DE UM COMPOSTO A PARTIR DE UMA PELÍCULA DE UMA MASSA PARA MOLDAR DE CETONA DO ÉTER POLIARILÊNICO E DE UMA PELÍCULA METÁLICA E SEU USO. A presente invenção refere-se a um processo para a preparação de um composto a partir de uma película de uma massa para moldar de cetona do éter poliarilênico e de uma película metálica, que contém os seguintes estágios: I. preparação de uma película com uma espessura de 5 a 1200 pm a partir de uma massa para moldar, que compreende os seguintes componentes: a) 60 96 partes em peso de cetona do éter poliarilênico, b) 2 a 25 partes em peso de nitreto de boro hexagonal e c) 2 a 25 partes em peso de talco, sendo que a soma das partes em peso dos componentes a), b) e c) perfaz 100; II. preparação de uma folha metálica com uma espessura de 10 a 150 pm; III. prensagem das películas preparadas ob I. e II. sem usar um adesivo a uma temperatura na faixa de T ~m~-40K até T ~m~ + 40K e com uma pressão na faixa de 0,4 a 500 MPa (4 a 5000 bar) resulta em um composto livre de adesivo, que é adequado para a produção de placas condutoras estáveis à dimensão.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011007837A DE102011007837A1 (de) | 2011-04-21 | 2011-04-21 | Kleberloser Verbund aus einer Polyarylenetherketon- und einer Metallfolie |
Publications (1)
Publication Number | Publication Date |
---|---|
BR102012009057A2 true BR102012009057A2 (pt) | 2013-07-02 |
Family
ID=45888071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRBR102012009057-0A BR102012009057A2 (pt) | 2011-04-21 | 2012-04-17 | processo para a preparaÇço de um composto a partir de uma pelÍcula de uma massa para moldar de cetona do Éter poliarilÊnico e de uma pelÍcula metÁlica e seu uso |
Country Status (8)
Country | Link |
---|---|
US (1) | US20120270022A1 (pt) |
EP (1) | EP2514590B1 (pt) |
JP (1) | JP5896822B2 (pt) |
KR (1) | KR101965905B1 (pt) |
CN (1) | CN102744932B (pt) |
BR (1) | BR102012009057A2 (pt) |
DE (1) | DE102011007837A1 (pt) |
RU (1) | RU2606631C2 (pt) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140087617A1 (en) * | 2012-09-27 | 2014-03-27 | Rogers Corporation | Aluminum poly(aryl ether ketone) laminate, methods of manufacture thereof, and articles comprising the same |
EP2765163A1 (en) * | 2013-02-12 | 2014-08-13 | Solvay Specialty Polymers USA, LLC. | Mobile electronic device |
WO2014130275A2 (en) | 2013-02-22 | 2014-08-28 | Ticona Llc | High performance polymer composition with improved flow properties |
US9512312B2 (en) | 2014-08-21 | 2016-12-06 | Ticona Llc | Polyaryletherketone composition |
US20160053107A1 (en) | 2014-08-21 | 2016-02-25 | Ticona Llc | Composition Containing a Polyaryletherketone and Low Naphthenic Liquid Crystalline Polymer |
DE202015007762U1 (de) * | 2015-11-10 | 2016-01-18 | Rolf Espe | Presswerkzeug als Pressblech ausgebildet, das aus einem nichtmetallischen Werkstoff besteht |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2861696D1 (en) | 1977-09-07 | 1982-04-29 | Ici Plc | Thermoplastic aromatic polyetherketones, a method for their preparation and their application as electrical insulants |
GB8429609D0 (en) | 1984-11-23 | 1985-01-03 | Ici Plc | Polyketone |
US4774314A (en) | 1986-04-25 | 1988-09-27 | Amoco Corporation | Preparing poly(aryl ethers) using alkaline earth metal carbonates, organic acid salts, and optionally copper compounds, as catalysts |
WO1997017824A1 (fr) * | 1995-11-10 | 1997-05-15 | Ibiden Co., Ltd. | Carte a circuits imprimes multicouche et sa fabrication |
JP4162321B2 (ja) * | 1999-03-18 | 2008-10-08 | 株式会社クラレ | 金属箔積層板の製造方法 |
EP1479729B1 (en) | 1999-11-30 | 2006-12-27 | Otsuka Chemical Company, Limited | Resin composition and flexible printed circuit board |
GB2364319B (en) | 2000-07-06 | 2003-01-15 | Gharda Chemicals Ltd | Melt processible polyether ether ketone polymer |
US20030181560A1 (en) * | 2000-08-29 | 2003-09-25 | Akiyoshi Kawaguchi | Resin composition, molded object thereof, and use thereof |
JP2002080617A (ja) * | 2000-09-06 | 2002-03-19 | Polymatech Co Ltd | 熱伝導性シート |
JP3875061B2 (ja) | 2001-10-23 | 2007-01-31 | 大塚化学ホールディングス株式会社 | 樹脂組成物及び成形品 |
JP2003128944A (ja) | 2001-10-23 | 2003-05-08 | Otsuka Chem Co Ltd | 樹脂組成物及び成形品 |
JP2003128931A (ja) | 2001-10-23 | 2003-05-08 | Otsuka Chem Co Ltd | 樹脂組成物及び成形品 |
JP3877996B2 (ja) * | 2001-10-31 | 2007-02-07 | 敏夫 谷本 | 繊維強化プラスチック複合材料およびその製造方法 |
JP4654647B2 (ja) * | 2004-09-30 | 2011-03-23 | 味の素株式会社 | 回路基板用金属付きポリアミドイミドフィルム及びその製造方法 |
RU2284267C2 (ru) * | 2004-11-10 | 2006-09-27 | Броня Цой | Материал для компонентов радиоэлектронных приборов |
JP2007197715A (ja) | 2005-12-28 | 2007-08-09 | Nippon Talc Co Ltd | 耐熱性樹脂組成物及びプリント配線板 |
DE112008000932T5 (de) * | 2007-04-11 | 2010-02-18 | World Properties, Inc., Lincolnwood | Schaltkreismaterialien, Mehrschichtschaltkreise und Verfahren zu ihrer Herstellung |
CN101365294B (zh) * | 2007-08-08 | 2010-06-23 | 富葵精密组件(深圳)有限公司 | 覆铜基材及使用该覆铜基材的柔性电路板 |
KR101174063B1 (ko) * | 2007-11-29 | 2012-08-13 | 미쓰비시 쥬시 가부시끼가이샤 | 금속 적층체, led 탑재 기판, 및 백색 필름 |
JP2010001402A (ja) * | 2008-06-20 | 2010-01-07 | Kaneka Corp | 高熱伝導性樹脂成形体 |
JP5385685B2 (ja) * | 2009-05-28 | 2014-01-08 | 三菱樹脂株式会社 | カバーレイフィルム、発光素子搭載用基板及び光源装置 |
DE102009045892A1 (de) * | 2009-10-21 | 2011-04-28 | Evonik Degussa Gmbh | Folie aus Polyarylenetherketon |
-
2011
- 2011-04-21 DE DE102011007837A patent/DE102011007837A1/de not_active Withdrawn
-
2012
- 2012-03-27 EP EP12161486.1A patent/EP2514590B1/de active Active
- 2012-04-17 BR BRBR102012009057-0A patent/BR102012009057A2/pt not_active IP Right Cessation
- 2012-04-20 US US13/451,828 patent/US20120270022A1/en not_active Abandoned
- 2012-04-20 RU RU2012115918A patent/RU2606631C2/ru not_active IP Right Cessation
- 2012-04-20 KR KR1020120041548A patent/KR101965905B1/ko active IP Right Grant
- 2012-04-20 CN CN201210117411.XA patent/CN102744932B/zh active Active
- 2012-04-23 JP JP2012098116A patent/JP5896822B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
RU2606631C2 (ru) | 2017-01-10 |
JP5896822B2 (ja) | 2016-03-30 |
EP2514590A1 (de) | 2012-10-24 |
DE102011007837A1 (de) | 2012-10-25 |
KR101965905B1 (ko) | 2019-04-04 |
JP2012224086A (ja) | 2012-11-15 |
US20120270022A1 (en) | 2012-10-25 |
EP2514590B1 (de) | 2014-06-18 |
RU2012115918A (ru) | 2013-10-27 |
CN102744932B (zh) | 2016-01-20 |
KR20120120070A (ko) | 2012-11-01 |
CN102744932A (zh) | 2012-10-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BR102012009057A2 (pt) | processo para a preparaÇço de um composto a partir de uma pelÍcula de uma massa para moldar de cetona do Éter poliarilÊnico e de uma pelÍcula metÁlica e seu uso | |
BR112013030891A2 (pt) | método para a fabricação de produto conformado com isotropia mantida | |
BR112013021411A2 (pt) | endurecedores de alta latência para resinas epóxi | |
BR112012013130A2 (pt) | membranas compostas de silicone com alto efeito de separação. | |
BR112012009482A2 (pt) | filme feito de poliarilenoetercetona | |
BR112012019630A2 (pt) | processo para a acetilação de elementos de madeira | |
BR112013002586A2 (pt) | chapa de aço para prensagem a quente e método de produção de peças prensadas a quente usando chapa de aço para prensagem a quente | |
BR112013031422A2 (pt) | métodos para converter material lignocelulósico em produtos úteis | |
BR112015031913A2 (pt) | processo para a fabricação de amino-benzoxazinonas 4-propargilatadas e sua utilização | |
BR112015027755A8 (pt) | Material compósito, e, processo para fabricação de um material compósito | |
BR112014011614A8 (pt) | processo para a produção de uma composição, composição, compósito | |
CO6420335A2 (es) | Un complejo de haluro de hidrogeno de agomelatina y la preparación del mismo | |
BRPI0700118A (pt) | processo para a desidratação de etanol | |
BR112015017606A2 (pt) | composição, método de produzir a composição, utilização da composição e combustível obtido a partir da composição | |
BR102013031320A8 (pt) | sistema e meio legível por computador não-transitório | |
BR112015020274A2 (pt) | cepa possuindo produtividade melhorada de l-valina e método de produção de l-valina utilizando a mesma | |
BR112012020714A8 (pt) | Polibutadieno bimodal catalisado por neodímio e processo para a produção de polibutadienos bimodais catalisados por neodímio | |
BR112013032432A2 (pt) | processo para produzir uma composição de polietileno | |
BRPI0915365B8 (pt) | Processo para a preparação de 2-triflúor-metil-5-alquil-piridinas substituídas na posição 1 | |
BR112012028765A2 (pt) | processo para liquefazer um material celulósico | |
BR112015020702A2 (pt) | película | |
BR112012023317A2 (pt) | hidrato de cloridrato de agomelatina e sua preparação | |
BR112014032395A2 (pt) | polibutadieno com grupos epóxi | |
BR112012009194A8 (pt) | Método para produzir material compósito reforçado com fibras, e material de molde resistente ao calor e material estrutural resistente ao calor usando o material compósito | |
BR112017002706A2 (pt) | ?processo para a produção do plástico reforçado por fibras? |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
B03A | Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette] | ||
B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 7A ANUIDADE. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO ARQUIVAMENTO PUBLICADO NA RPI 2510 DE 12/02/2019. |