BR0315712A - Placa de circuito impresso que fornece compensação de linha cruzada e conector de telecomunicação - Google Patents
Placa de circuito impresso que fornece compensação de linha cruzada e conector de telecomunicaçãoInfo
- Publication number
- BR0315712A BR0315712A BR0315712-1A BR0315712A BR0315712A BR 0315712 A BR0315712 A BR 0315712A BR 0315712 A BR0315712 A BR 0315712A BR 0315712 A BR0315712 A BR 0315712A
- Authority
- BR
- Brazil
- Prior art keywords
- holes
- printed circuit
- circuit board
- line compensation
- cross line
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0248—Skew reduction or using delay lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
"PLACA DE CIRCUITO IMPRESSO QUE FORNECE COMPENSAçãO DE LINHA CRUZADA E CONECTOR DE TELECOMUNICAçãO". Uma placa de circuito impressa fornece compensação para linha cruzada. A placa de circuito impresso inclui os primeiros orifícios atravessados na placa para receber um primeiro componente de conexão e os segundos orifícios atravessados na placa para receber um segundo componente de conexão. Um traço portador de sinal transmite um sinal de um dos primeiros orifícios atravessados para um dos segundos orifícios atravessados. Um traço de controle de retardo de fase está na conexão elétrica com o um dos primeiros orifícios atravessados. O traço de controle de retardo de fase efetua o retardo de fase do sinal do um dos primeiros orifícios atravessados para um dos segundos orifícios atravessados.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42798502P | 2002-11-20 | 2002-11-20 | |
PCT/US2003/037651 WO2004047240A2 (en) | 2002-11-20 | 2003-11-18 | Apparatus for crosstalk compensation in a telecommunications connector |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0315712A true BR0315712A (pt) | 2005-09-06 |
Family
ID=32326625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0315712-1A BR0315712A (pt) | 2002-11-20 | 2003-11-18 | Placa de circuito impresso que fornece compensação de linha cruzada e conector de telecomunicação |
Country Status (9)
Country | Link |
---|---|
US (1) | US7154049B2 (pt) |
EP (1) | EP1563573A4 (pt) |
CN (1) | CN100429830C (pt) |
AU (1) | AU2003293036B2 (pt) |
BR (1) | BR0315712A (pt) |
MX (1) | MXPA05005341A (pt) |
RU (1) | RU2322741C2 (pt) |
TW (1) | TWI303501B (pt) |
WO (1) | WO2004047240A2 (pt) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7474737B2 (en) * | 2002-10-10 | 2009-01-06 | The Siemon Company | Telecommunications test plugs having tuned near end crosstalk |
US7265300B2 (en) * | 2003-03-21 | 2007-09-04 | Commscope Solutions Properties, Llc | Next high frequency improvement using hybrid substrates of two materials with different dielectric constant frequency slopes |
US7342181B2 (en) * | 2004-03-12 | 2008-03-11 | Commscope Inc. Of North Carolina | Maximizing capacitance per unit area while minimizing signal transmission delay in PCB |
US7153168B2 (en) * | 2004-04-06 | 2006-12-26 | Panduit Corp. | Electrical connector with improved crosstalk compensation |
US7980900B2 (en) * | 2004-05-14 | 2011-07-19 | Commscope, Inc. Of North Carolina | Next high frequency improvement by using frequency dependent effective capacitance |
US7190594B2 (en) * | 2004-05-14 | 2007-03-13 | Commscope Solutions Properties, Llc | Next high frequency improvement by using frequency dependent effective capacitance |
WO2007095533A1 (en) | 2006-02-13 | 2007-08-23 | Panduit Corp. | Connector with crosstalk compensation |
US7488206B2 (en) * | 2006-02-14 | 2009-02-10 | Panduit Corp. | Method and apparatus for patch panel patch cord documentation and revision |
US7479043B2 (en) * | 2006-05-08 | 2009-01-20 | The Siemon Company | Targeted compensation in telecommunications connectors |
US7364470B2 (en) | 2006-07-05 | 2008-04-29 | Commscope, Inc. Of North Carolina | Communications connectors with signal current splitting |
DE102006056001B4 (de) * | 2006-11-24 | 2008-12-04 | Phoenix Contact Gmbh & Co. Kg | Konfektionierbarer Rundsteckverbinder für Ethernet |
US7604515B2 (en) | 2006-12-01 | 2009-10-20 | The Siemon Company | Modular connector with reduced termination variability |
US7874878B2 (en) | 2007-03-20 | 2011-01-25 | Panduit Corp. | Plug/jack system having PCB with lattice network |
US20110036617A1 (en) * | 2007-08-03 | 2011-02-17 | Leonid Kokurin | Compensating Conductive Circuit |
US7722406B2 (en) * | 2008-03-17 | 2010-05-25 | Zippy Technology Corp. | Output adapting device of plug-in power system |
US7658651B2 (en) * | 2008-04-25 | 2010-02-09 | Tyco Electronics Corporation | Electrical connectors and circuit boards having non-ohmic plates |
DE102008026467B4 (de) * | 2008-06-03 | 2011-12-29 | Mc Technology Gmbh | Steckverbindersystem |
MX2011001542A (es) | 2008-08-13 | 2011-03-30 | Panduit Corp | Conector de comunicaciones con compensacion de etapas multiples. |
BRPI0917310A2 (pt) | 2008-08-20 | 2015-11-17 | Panduit Corp | jaque de comunicacao para uso em uma rede de comunicacao |
US8047879B2 (en) * | 2009-01-26 | 2011-11-01 | Commscope, Inc. Of North Carolina | Printed wiring boards and communication connectors having series inductor-capacitor crosstalk compensation circuits that share a common inductor |
US7850492B1 (en) | 2009-11-03 | 2010-12-14 | Panduit Corp. | Communication connector with improved crosstalk compensation |
TWI434634B (zh) * | 2011-08-09 | 2014-04-11 | 中原大學 | Differential mode flat spiral delay line structure |
WO2013036319A1 (en) | 2011-09-07 | 2013-03-14 | Commscope, Inc. Of North Carolina | Communications connectors having frequency dependent communications paths and related methods |
CN103947055B (zh) | 2011-11-23 | 2017-03-08 | 泛达公司 | 使用正交补偿网络的补偿网络 |
US10014990B2 (en) * | 2012-02-13 | 2018-07-03 | Sentinel Connector Systems, Inc. | Testing apparatus for a high speed cross over communications jack and methods of operating the same |
US9112320B2 (en) | 2012-02-23 | 2015-08-18 | Commscope, Inc. Of North Carolina | Communications connectors having electrically parallel sets of contacts |
US9136647B2 (en) | 2012-06-01 | 2015-09-15 | Panduit Corp. | Communication connector with crosstalk compensation |
US20140027155A1 (en) * | 2012-07-25 | 2014-01-30 | Ametek, Inc. | Differential mode signal connector and cable assembly |
US9246463B2 (en) * | 2013-03-07 | 2016-01-26 | Panduit Corp. | Compensation networks and communication connectors using said compensation networks |
US9257792B2 (en) | 2013-03-14 | 2016-02-09 | Panduit Corp. | Connectors and systems having improved crosstalk performance |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS648692A (en) * | 1987-07-01 | 1989-01-12 | Fujitsu Ltd | Printed circuit board |
JP2525996B2 (ja) * | 1992-05-20 | 1996-08-21 | 日東電工株式会社 | フレキシブルプリント回路板 |
US5414393A (en) * | 1992-08-20 | 1995-05-09 | Hubbell Incorporated | Telecommunication connector with feedback |
WO1997032456A1 (en) * | 1996-02-29 | 1997-09-04 | The Whitaker Corporation | Non-ohmic energy coupling for cross talk reduction |
US5997358A (en) * | 1997-09-02 | 1999-12-07 | Lucent Technologies Inc. | Electrical connector having time-delayed signal compensation |
US5930119A (en) * | 1998-02-26 | 1999-07-27 | Arizona Digital, Inc. | Backplane having reduced LC product |
GB9807616D0 (en) * | 1998-04-08 | 1998-06-10 | Weatherley Richard | Reduction of crosstalk in data transmission system |
US6483714B1 (en) * | 1999-02-24 | 2002-11-19 | Kyocera Corporation | Multilayered wiring board |
US6250968B1 (en) * | 1999-07-14 | 2001-06-26 | Berg Technology, Inc. | Electrical connector system with cross-talk compensation |
US6249047B1 (en) * | 1999-09-02 | 2001-06-19 | Micron Technology, Inc. | Ball array layout |
US6379157B1 (en) * | 2000-08-18 | 2002-04-30 | Leviton Manufacturing Co., Inc. | Communication connector with inductive compensation |
US6433286B1 (en) * | 2000-09-29 | 2002-08-13 | Intel Corporation | Method of making higher impedance traces on a low impedance circuit board |
IL145103A (en) * | 2001-08-23 | 2010-05-17 | Rit Techn Ltd | High data rate interconnecting device |
US6483715B1 (en) * | 2001-11-21 | 2002-11-19 | Surtec Industries Inc. | Circuit board coupled with jacks |
US6630628B2 (en) * | 2002-02-07 | 2003-10-07 | Agilent Technologies, Inc. | High-performance laminate for integrated circuit interconnection |
US6796847B2 (en) * | 2002-10-21 | 2004-09-28 | Hubbell Incorporated | Electrical connector for telecommunications applications |
-
2003
- 2003-11-18 MX MXPA05005341A patent/MXPA05005341A/es active IP Right Grant
- 2003-11-18 EP EP03790027A patent/EP1563573A4/en not_active Withdrawn
- 2003-11-18 BR BR0315712-1A patent/BR0315712A/pt not_active IP Right Cessation
- 2003-11-18 CN CNB2003801035807A patent/CN100429830C/zh not_active Expired - Lifetime
- 2003-11-18 RU RU2005119191/09A patent/RU2322741C2/ru not_active IP Right Cessation
- 2003-11-18 WO PCT/US2003/037651 patent/WO2004047240A2/en not_active Application Discontinuation
- 2003-11-18 AU AU2003293036A patent/AU2003293036B2/en not_active Ceased
- 2003-11-19 US US10/716,808 patent/US7154049B2/en active Active
- 2003-11-20 TW TW092132612A patent/TWI303501B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AU2003293036A1 (en) | 2004-06-15 |
EP1563573A4 (en) | 2009-07-15 |
MXPA05005341A (es) | 2005-08-16 |
WO2004047240A3 (en) | 2004-12-09 |
AU2003293036B2 (en) | 2008-02-28 |
RU2005119191A (ru) | 2006-01-20 |
EP1563573A2 (en) | 2005-08-17 |
US20040147165A1 (en) | 2004-07-29 |
CN100429830C (zh) | 2008-10-29 |
CN1714476A (zh) | 2005-12-28 |
US7154049B2 (en) | 2006-12-26 |
WO2004047240A2 (en) | 2004-06-03 |
TW200415825A (en) | 2004-08-16 |
TWI303501B (en) | 2008-11-21 |
RU2322741C2 (ru) | 2008-04-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 6A E 7A ANUIDADES. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2073 DE 28/09/2010. |
|
B15K | Others concerning applications: alteration of classification |
Ipc: H05K 1/02 (2006.01) |