BR0202789A - Sistema de resfriamento para chip de circuito integrado - Google Patents

Sistema de resfriamento para chip de circuito integrado

Info

Publication number
BR0202789A
BR0202789A BR0202789-5A BR0202789A BR0202789A BR 0202789 A BR0202789 A BR 0202789A BR 0202789 A BR0202789 A BR 0202789A BR 0202789 A BR0202789 A BR 0202789A
Authority
BR
Brazil
Prior art keywords
integrated circuit
circuit chip
cooling system
compressor
panel
Prior art date
Application number
BR0202789-5A
Other languages
English (en)
Other versions
BR0202789B1 (pt
Inventor
Jung Sik Park
Eon Pyo Hong
Yong Dol Park
Dong Koo Shin
Jin Young Jung
Hyeong Kook Lee
Original Assignee
Lg Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Electronics Inc filed Critical Lg Electronics Inc
Publication of BR0202789A publication Critical patent/BR0202789A/pt
Publication of BR0202789B1 publication Critical patent/BR0202789B1/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

"SISTEMA DE RESFRIAMENTO PARA CHIP DE CIRCUITO INTEGRADO". Em um sistema de resfriamento para um chIp de circuito integrado, incluindo um evaporador em contato e combinado com um chip de circuito integrado instalado em um painel fixado em uma armação e absorvendo calor gerado no chip de circuito integrado; um compressor conectado ao evaporador por um primeiro tubo de conexão; um condensador conectado ao compressor por um segundo tubo de conexão; um dispositivo de expansão conectado ao condensador por um terceiro tubo de conexão e simultaneamente conectado ao evaporador por um quarto tubo de conexão; e um painel de montagem instalado no painel por um dispositivo de combinação de painel e montado com o compressor, o condensador e os dispositivo de expansão, é possível realizar a operação do chip de circuito integrado de maneira uniforme, e conseq³entemente uma segurança de um produto pode ser aperfeiçoada. Em adição, embora um chip de circuito integrado está se tornando ainda mais integrado, o resfriamento do chip de circuito integrado pode ser eficientemente realizado.
BRPI0202789-5A 2002-03-14 2002-07-22 Sistema de resfriamento para chip de circuito integrado BR0202789B1 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2002-0013931A KR100464046B1 (ko) 2002-03-14 2002-03-14 컴퓨터의 냉각장치

Publications (2)

Publication Number Publication Date
BR0202789A true BR0202789A (pt) 2004-05-25
BR0202789B1 BR0202789B1 (pt) 2015-02-24

Family

ID=28036068

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0202789-5A BR0202789B1 (pt) 2002-03-14 2002-07-22 Sistema de resfriamento para chip de circuito integrado

Country Status (6)

Country Link
US (1) US6687125B2 (pt)
JP (1) JP3920722B2 (pt)
KR (1) KR100464046B1 (pt)
CN (1) CN1231966C (pt)
BR (1) BR0202789B1 (pt)
DE (1) DE10232146B4 (pt)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004235184A (ja) * 2003-01-28 2004-08-19 Matsushita Electric Ind Co Ltd 高周波装置
US6967841B1 (en) * 2004-05-07 2005-11-22 International Business Machines Corporation Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover
DE102004057432B4 (de) * 2004-11-27 2006-10-19 Rittal Gmbh & Co. Kg Kühlgerät
DE102004063039B4 (de) * 2004-12-28 2011-09-22 Siemens Ag Anordnung mit einem elektrischen Leistungshalbleiterbauelement und einer Zwei-Phasen-Kühlvorrichtung
DE102005012350B4 (de) * 2005-03-07 2008-04-03 Asetek A/S Kühlsystem für elektronische Geräte, insbesondere Computer
WO2007010005A1 (de) * 2005-07-19 2007-01-25 Siemens Aktiengesellschaft Anordnung eines elektrischen bauelements und einer zwei-phasen-kühlvorrichtung und verfahren zum herstellen der anordnung
JP4315141B2 (ja) * 2005-09-09 2009-08-19 セイコーエプソン株式会社 電子部品の温度制御装置並びにハンドラ装置
US7412844B2 (en) * 2006-03-07 2008-08-19 Blue Zone 40 Inc. Method and apparatus for cooling semiconductor chips
DE102006011333A1 (de) * 2006-03-09 2007-09-13 Behr Industry Gmbh & Co. Kg Vorrichtung zur Kühlung, insbesondere elektronischer Bauelemente
JP2008085144A (ja) * 2006-09-28 2008-04-10 Sanyo Electric Co Ltd 冷却装置
JP2008191996A (ja) * 2007-02-06 2008-08-21 Hitachi Ltd ディスクアレイ装置および電子装置
GB2451684A (en) * 2007-08-09 2009-02-11 Digital Projection Ltd Heat transfer apparatus for cooling a light valve or digital micro mirror
US8302419B2 (en) * 2008-05-02 2012-11-06 Thermal Take Technology Co., Ltd. Computer cooling apparatus
CN101841992A (zh) * 2009-03-18 2010-09-22 鸿富锦精密工业（深圳）有限公司 散热模组组装治具
US8755945B2 (en) * 2010-08-04 2014-06-17 Powerquest Llc Efficient computer cooling methods and apparatus
DE202010014108U1 (de) * 2010-10-08 2010-12-02 Congatec Ag Wärmeverteiler mit mechanisch gesichertem Wärmekopplungselement
DE202010014106U1 (de) * 2010-10-08 2010-12-16 Congatec Ag Wärmeverteiler mit flexibel gelagertem Wärmerohr
CN102307016A (zh) * 2011-08-31 2012-01-04 孙建章 一种冷媒智能真空循环散热系统
CN108896288A (zh) * 2018-06-26 2018-11-27 芜湖广智天和信息技术有限公司 一种计算机主板风机降温用测试装置
KR102391709B1 (ko) * 2019-09-23 2022-04-29 김문배 산소발생기 겸용 공기청정장치
CN110908482A (zh) * 2019-11-29 2020-03-24 安徽开华散热器制造科技有限公司 一种散热装置
CN117850551B (zh) * 2024-03-08 2024-06-04 山东艾琳智能科技有限公司 一种基于大数据的信息处理系统

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546619A (en) * 1984-06-25 1985-10-15 Rohner Thomas G Mechanical cooler for electronics
FR2580060B1 (pt) * 1985-04-05 1989-06-09 Nec Corp
US5052472A (en) * 1989-07-19 1991-10-01 Hitachi, Ltd. LSI temperature control system
US5323847A (en) * 1990-08-01 1994-06-28 Hitachi, Ltd. Electronic apparatus and method of cooling the same
JPH04196395A (ja) * 1990-11-28 1992-07-16 Hitachi Ltd 冷却装置を備えた電子計算機
KR100294896B1 (ko) * 1993-11-30 2001-09-17 오웨, 필립 존 필터
US6205796B1 (en) * 1999-03-29 2001-03-27 International Business Machines Corporation Sub-dew point cooling of electronic systems
KR100294317B1 (ko) * 1999-06-04 2001-06-15 이정현 초소형 냉각 장치
KR20020009638A (ko) * 2002-01-02 2002-02-01 (주)암스코 씨피유냉각기

Also Published As

Publication number Publication date
KR20030074932A (ko) 2003-09-22
US6687125B2 (en) 2004-02-03
JP3920722B2 (ja) 2007-05-30
BR0202789B1 (pt) 2015-02-24
US20030174468A1 (en) 2003-09-18
DE10232146B4 (de) 2008-07-31
CN1231966C (zh) 2005-12-14
DE10232146A1 (de) 2003-10-09
JP2003273301A (ja) 2003-09-26
KR100464046B1 (ko) 2005-01-03
CN1445840A (zh) 2003-10-01

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Legal Events

Date Code Title Description
B07A Technical examination (opinion): publication of technical examination (opinion) [chapter 7.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 24/02/2015, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 14A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2385 DE 20-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.