BE723634A - - Google Patents

Info

Publication number
BE723634A
BE723634A BE723634DA BE723634A BE 723634 A BE723634 A BE 723634A BE 723634D A BE723634D A BE 723634DA BE 723634 A BE723634 A BE 723634A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR78003493A external-priority patent/FR94659E/fr
Application filed filed Critical
Publication of BE723634A publication Critical patent/BE723634A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y10T29/49098—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
BE723634D 1967-11-29 1968-11-08 BE723634A (en:Method)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR130093 1967-11-29
FR78003486 1968-03-29
FR78003493A FR94659E (fr) 1967-11-29 1968-04-16 Procédé de fabrication de composants électriques ou électroniques, notamment de condensateurs au tantale.

Publications (1)

Publication Number Publication Date
BE723634A true BE723634A (en:Method) 1969-04-16

Family

ID=27244694

Family Applications (1)

Application Number Title Priority Date Filing Date
BE723634D BE723634A (en:Method) 1967-11-29 1968-11-08

Country Status (6)

Country Link
US (1) US3550228A (en:Method)
BE (1) BE723634A (en:Method)
DE (1) DE1811837A1 (en:Method)
GB (1) GB1212899A (en:Method)
LU (1) LU57287A1 (en:Method)
NL (1) NL6816790A (en:Method)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1805174A1 (de) * 1968-10-25 1970-05-14 Telefunken Patent Verfahren zum Aufbringen von Einzelkoerpern auf einen Grundkoerper
US3650648A (en) * 1970-02-25 1972-03-21 Union Carbide Corp System for molding electronic components
JPS5121454B1 (en:Method) * 1971-05-24 1976-07-02
JPS4857652U (en:Method) * 1971-11-02 1973-07-23
US3783348A (en) * 1972-10-30 1974-01-01 Rca Corp Encapsulated semiconductor device assembly
US3828227A (en) * 1973-04-09 1974-08-06 Sprague Electric Co Solid tantalum capacitor with end cap terminals
US4173062A (en) * 1976-08-16 1979-11-06 Corning Glass Works Method of forming a quadriplanar component
US4097915A (en) * 1976-08-16 1978-06-27 Corning Glass Works Quadriplanar capacitor
US4282645A (en) * 1978-07-31 1981-08-11 Sprague Electric Company Method of assembling an encapsulated chip capacitor
US4288842A (en) * 1979-06-11 1981-09-08 Emhart Industries, Inc. Solid chip capacitor and method of manufacture
DE3134617C2 (de) * 1981-09-01 1989-11-02 Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut Folien-Kondensator
JPS58196829U (ja) * 1982-06-24 1983-12-27 松尾電機株式会社 固体電解コンデンサ
JPS5934625A (ja) * 1982-08-20 1984-02-25 松尾電機株式会社 チツプ型固体電解コンデンサの製造方法
US4463407A (en) * 1982-09-27 1984-07-31 Northern Telecom Limited Surface mounted electronic components having pre-applied solder
GB2141583A (en) * 1983-06-17 1984-12-19 Standard Telephones Cables Ltd Leadless capacitors
US4511951A (en) * 1983-11-14 1985-04-16 Rogers Corporation Multilayer decoupling capacitor and method of manufacture thereof
US4497012A (en) * 1983-11-14 1985-01-29 Rogers Corporation Decoupling capacitor and method of manufacture thereof
US4491895A (en) * 1983-11-14 1985-01-01 Rogers Corporation Decoupling capacitor and method of manufacture thereof
US4578736A (en) * 1984-08-28 1986-03-25 At&T Technologies, Inc. Surface mounted electrical components and method of fabrication
US4648006A (en) * 1985-03-26 1987-03-03 Illinois Tool Works Inc. Plastic chip capacitor for surface mounting
US4757610A (en) * 1986-02-21 1988-07-19 American Precision Industries, Inc. Surface mount network and method of making
DE3776667D1 (de) * 1986-04-16 1992-03-26 Micropore International Ltd Verfahren zur umhuellung eines gegenstandes mit einem homogenen block.
US4725806A (en) * 1987-05-21 1988-02-16 Standex International Corporation Contact elements for miniature inductor
EP0359856B1 (de) * 1988-04-09 1993-12-22 Georg Sillner Verfahren sowie Vorrichtung zum Umformen von Zylindrischen elektrischen Bauteilen
US4926542A (en) * 1988-08-26 1990-05-22 Dale Electronic, Inc. Method of making a surface mount wirewound resistor
DE3927690C2 (de) * 1988-08-26 2001-12-13 Dale Electronics Oberflächenmontierbarer Widerstand
FR2640825B1 (fr) * 1988-12-20 1991-01-25 Europ Composants Electron Composant electrique a report direct
JPH04273112A (ja) * 1991-02-28 1992-09-29 Murata Mfg Co Ltd モールド型チップ電子部品
TWM250321U (en) * 2004-01-14 2004-11-11 Optimum Care Int Tech Inc Lead frame unit structure of chip with hidden position
ITPC20050004U1 (it) * 2005-03-10 2006-09-11 Electrica Srl Rele' voltmetrico con aggancio migliorato dei terminali
WO2010076883A1 (ja) * 2008-12-29 2010-07-08 昭和電工株式会社 固体電解コンデンサ
JP6694235B2 (ja) * 2015-01-29 2020-05-13 Tdk株式会社 電子部品

Also Published As

Publication number Publication date
DE1811837A1 (de) 1969-07-10
LU57287A1 (en:Method) 1969-02-25
NL6816790A (en:Method) 1969-06-02
US3550228A (en) 1970-12-29
GB1212899A (en) 1970-11-18

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