Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
  • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
  • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
  • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
  • H01L25/073—Apertured devices mounted on one or more rods passed through the apertures
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
  • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Computer Hardware Design (AREA)
• General Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Physics & Mathematics (AREA)
• Ceramic Engineering (AREA)
• Rectifiers (AREA)
• Die Bonding (AREA)
• Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
• Thermistors And Varistors (AREA)
• Power Conversion In General (AREA)
• Synchronous Machinery (AREA)
• Particle Accelerators (AREA)

Applications Claiming Priority (7)

Publications (1)

Family

ID=27561698

Family Applications (3)

Family Applications Before (1)

Family Applications After (1)

Country Status (8)

Families Citing this family (8)

Family Cites Families (19)

• 0
  • BE BE635452D patent/BE635452A/xx unknown
  • BE BE633287D patent/BE633287A/xx unknown
  • DE DEST19510A patent/DE1250928B/de active Pending
  • NL NL295752D patent/NL295752A/xx unknown
  • NL NL293539D patent/NL293539A/xx unknown
• 1962
  • 1962-07-27 DE DEST19531A patent/DE1259470B/de active Pending
  • 1962-09-04 DE DEST19667A patent/DE1248171B/de active Pending
  • 1962-09-21 DE DEP1269A patent/DE1269737B/de active Pending
• 1963
  • 1963-05-21 US US281873A patent/US3280390A/en not_active Expired - Lifetime
  • 1963-05-30 CH CH677263A patent/CH437505A/de unknown
  • 1963-06-07 GB GB22755/63A patent/GB1033813A/en not_active Expired
  • 1963-06-07 FR FR937351A patent/FR1370038A/fr not_active Expired
  • 1963-06-21 GB GB24827/63A patent/GB1020151A/en not_active Expired
  • 1963-07-16 US US295331A patent/US3262030A/en not_active Expired - Lifetime
  • 1963-07-19 GB GB28620/63A patent/GB976278A/en not_active Expired
  • 1963-07-19 GB GB28621/63A patent/GB976034A/en not_active Expired
  • 1963-07-19 CH CH907763A patent/CH418464A/de unknown
  • 1963-07-23 CH CH916063A patent/CH417778A/de unknown
  • 1963-07-23 CH CH915863A patent/CH415862A/de unknown
  • 1963-09-20 GB GB37080/63A patent/GB1066446A/en not_active Expired
• 1964
  • 1964-09-24 CH CH1240064A patent/CH438491A/de unknown
  • 1964-09-24 US US402982A patent/US3290566A/en not_active Expired - Lifetime
  • 1964-09-25 GB GB39136/64A patent/GB1041317A/en not_active Expired
  • 1964-09-28 BE BE653631D patent/BE653631A/xx unknown
  • 1964-09-28 FR FR989579A patent/FR86442E/fr not_active Expired
  • 1964-09-28 NL NL6411246A patent/NL6411246A/xx unknown
  • 1964-09-28 LU LU47033D patent/LU47033A1/xx unknown

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