BE583030A - Perfectionnements relatifs au refroidissement de dispositifs semi-conducteurs - Google Patents

Perfectionnements relatifs au refroidissement de dispositifs semi-conducteurs

Info

Publication number
BE583030A
BE583030A BE583030A BE583030A BE583030A BE 583030 A BE583030 A BE 583030A BE 583030 A BE583030 A BE 583030A BE 583030 A BE583030 A BE 583030A BE 583030 A BE583030 A BE 583030A
Authority
BE
Belgium
Prior art keywords
cooling
semiconductor devices
semiconductor
devices
Prior art date
Application number
BE583030A
Other languages
English (en)
French (fr)
Original Assignee
Stone J & Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stone J & Co Ltd filed Critical Stone J & Co Ltd
Publication of BE583030A publication Critical patent/BE583030A/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
BE583030A 1958-09-25 1959-09-25 Perfectionnements relatifs au refroidissement de dispositifs semi-conducteurs BE583030A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3074258A GB881571A (en) 1958-09-25 1958-09-25 Improvements relating to the cooling of semi-conductor devices

Publications (1)

Publication Number Publication Date
BE583030A true BE583030A (fr) 1960-01-18

Family

ID=10312426

Family Applications (1)

Application Number Title Priority Date Filing Date
BE583030A BE583030A (fr) 1958-09-25 1959-09-25 Perfectionnements relatifs au refroidissement de dispositifs semi-conducteurs

Country Status (6)

Country Link
BE (1) BE583030A (en, 2012)
DE (1) DE1205196B (en, 2012)
ES (1) ES251880A1 (en, 2012)
FR (1) FR1236322A (en, 2012)
GB (1) GB881571A (en, 2012)
NL (2) NL293350A (en, 2012)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2423070A1 (de) * 1973-07-06 1975-01-23 Siemens Ag Anordnung eines leistungshalbleiters
FR2495838A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de refroidissement amovible pour supports de circuits integres
FR2495846A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de connexion electrique a haute densite de contacts
EP0198378A3 (en) * 1985-04-08 1986-12-30 Otis Elevator Company Apparatus for removing heat from electrical components, and method of manufacturing such apparatus
US5594355A (en) * 1994-07-19 1997-01-14 Delta Design, Inc. Electrical contactor apparatus for testing integrated circuit devices
EP1691595A3 (de) * 2005-02-10 2012-01-18 Behr-Hella Thermocontrol GmbH Gebläseregler für ein Fahrzeug

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB321299A (en) * 1952-01-22 1929-11-07 William Charles King Improvements in or relating to heating buildings by electricity
BE565471A (en, 2012) * 1957-03-08
DE1751741U (de) * 1957-05-17 1957-09-05 Telefunken Gmbh Gehaeuseanordnung zur kuehlung von leistungskristalloden.
DE1768720U (de) * 1957-12-16 1958-06-19 Licentia Gmbh Einrichtung zur kuehlung von transistoren.

Also Published As

Publication number Publication date
GB881571A (en) 1961-11-08
DE1205196B (de) 1965-11-18
FR1236322A (fr) 1960-07-15
NL293350A (en, 2012)
ES251880A1 (es) 1960-03-16
NL243350A (en, 2012)

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