BE583030A - Perfectionnements relatifs au refroidissement de dispositifs semi-conducteurs - Google Patents

Perfectionnements relatifs au refroidissement de dispositifs semi-conducteurs

Info

Publication number
BE583030A
BE583030A BE583030A BE583030A BE583030A BE 583030 A BE583030 A BE 583030A BE 583030 A BE583030 A BE 583030A BE 583030 A BE583030 A BE 583030A BE 583030 A BE583030 A BE 583030A
Authority
BE
Belgium
Prior art keywords
cooling
semiconductor devices
semiconductor
devices
Prior art date
Application number
BE583030A
Other languages
English (en)
French (fr)
Original Assignee
Stone J & Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stone J & Co Ltd filed Critical Stone J & Co Ltd
Publication of BE583030A publication Critical patent/BE583030A/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
BE583030A 1958-09-25 1959-09-25 Perfectionnements relatifs au refroidissement de dispositifs semi-conducteurs BE583030A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3074258A GB881571A (en) 1958-09-25 1958-09-25 Improvements relating to the cooling of semi-conductor devices

Publications (1)

Publication Number Publication Date
BE583030A true BE583030A (fr) 1960-01-18

Family

ID=10312426

Family Applications (1)

Application Number Title Priority Date Filing Date
BE583030A BE583030A (fr) 1958-09-25 1959-09-25 Perfectionnements relatifs au refroidissement de dispositifs semi-conducteurs

Country Status (6)

Country Link
BE (1) BE583030A (enrdf_load_html_response)
DE (1) DE1205196B (enrdf_load_html_response)
ES (1) ES251880A1 (enrdf_load_html_response)
FR (1) FR1236322A (enrdf_load_html_response)
GB (1) GB881571A (enrdf_load_html_response)
NL (2) NL293350A (enrdf_load_html_response)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2423070A1 (de) * 1973-07-06 1975-01-23 Siemens Ag Anordnung eines leistungshalbleiters
FR2495838A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de refroidissement amovible pour supports de circuits integres
FR2495846A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de connexion electrique a haute densite de contacts
EP0198378A3 (en) * 1985-04-08 1986-12-30 Otis Elevator Company Apparatus for removing heat from electrical components, and method of manufacturing such apparatus
US5594355A (en) * 1994-07-19 1997-01-14 Delta Design, Inc. Electrical contactor apparatus for testing integrated circuit devices
EP1691595A3 (de) * 2005-02-10 2012-01-18 Behr-Hella Thermocontrol GmbH Gebläseregler für ein Fahrzeug

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB321299A (en) * 1952-01-22 1929-11-07 William Charles King Improvements in or relating to heating buildings by electricity
BE565471A (enrdf_load_html_response) * 1957-03-08
DE1751741U (de) * 1957-05-17 1957-09-05 Telefunken Gmbh Gehaeuseanordnung zur kuehlung von leistungskristalloden.
DE1768720U (de) * 1957-12-16 1958-06-19 Licentia Gmbh Einrichtung zur kuehlung von transistoren.

Also Published As

Publication number Publication date
GB881571A (en) 1961-11-08
DE1205196B (de) 1965-11-18
FR1236322A (fr) 1960-07-15
NL293350A (enrdf_load_html_response)
ES251880A1 (es) 1960-03-16
NL243350A (enrdf_load_html_response)

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