Classifications

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  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L24/42—Wire connectors; Manufacturing methods related thereto
  • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
  • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
  • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
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  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
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  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/484—Connecting portions
  • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• • H—ELECTRICITY
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  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
  • H01L2224/732—Location after the connecting process
  • H01L2224/73251—Location after the connecting process on different surfaces
  • H01L2224/73265—Layer and wire connectors
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  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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  • H01L2924/01005—Boron [B]
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  • H01L2924/01—Chemical elements
  • H01L2924/01006—Carbon [C]
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  • H01L2924/01014—Silicon [Si]
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  • H01L2924/01015—Phosphorus [P]
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  • H01L2924/01019—Potassium [K]
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  • H01L2924/01024—Chromium [Cr]
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  • H01L2924/01—Chemical elements
  • H01L2924/01028—Nickel [Ni]
• • H—ELECTRICITY
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  • H01L2924/01032—Germanium [Ge]
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  • H01L2924/01042—Molybdenum [Mo]
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  • H01L2924/01—Chemical elements
  • H01L2924/01049—Indium [In]
• • H—ELECTRICITY
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  • H01L2924/01—Chemical elements
  • H01L2924/0105—Tin [Sn]
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  • H01L2924/01051—Antimony [Sb]
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  • H01L2924/01067—Holmium [Ho]
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  • H01L2924/01072—Hafnium [Hf]
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  • H01L2924/01074—Tungsten [W]
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  • H01L2924/01—Chemical elements
  • H01L2924/01079—Gold [Au]
• • H—ELECTRICITY
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  • H01L2924/013—Alloys
  • H01L2924/014—Solder alloys

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• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Contacts (AREA)
• ing And Chemical Polishing (AREA)
• Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
• Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

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• 0
  • BE BE551335D patent/BE551335A/xx unknown
• 1956
  • 1956-09-05 US US608067A patent/US2917684A/en not_active Expired - Lifetime
  • 1956-09-25 DE DEN12762A patent/DE1047317B/de active Pending
  • 1956-09-26 GB GB29393/56A patent/GB842366A/en not_active Expired
  • 1956-09-27 FR FR1157675D patent/FR1157675A/fr not_active Expired

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