|
DE962489C
(de)
*
|
1954-02-10 |
1957-04-25 |
Dehydag Gmbh |
Sparbeizmittel zum Schutze von Metallen bei der Behandlung mit sauren Mitteln
|
|
DE1007592B
(de)
*
|
1955-01-19 |
1957-05-02 |
Dehydag Gmbh |
Bad zur Herstellung von galvanischen Metallueberzuegen
|
|
US2853443A
(en)
*
|
1956-04-25 |
1958-09-23 |
Westinghouse Electric Corp |
Addition agent for acid copper electrolytes
|
|
BE565994A
(da)
*
|
1957-04-16 |
|
|
|
|
US2931760A
(en)
*
|
1957-09-25 |
1960-04-05 |
Leon R Westbrook |
Acid copper plating
|
|
NL238490A
(da)
*
|
1958-04-26 |
|
|
|
|
US3770599A
(en)
*
|
1971-05-24 |
1973-11-06 |
Oxy Metal Finishing Corp |
Acid zinc plating baths
|
|
US4009087A
(en)
*
|
1974-11-21 |
1977-02-22 |
M&T Chemicals Inc. |
Electrodeposition of copper
|
|
US4474649A
(en)
*
|
1982-06-21 |
1984-10-02 |
Asarco Incorporated |
Method of thiourea addition of electrolytic solutions useful for copper refining
|
|
JPH02232391A
(ja)
*
|
1988-12-21 |
1990-09-14 |
Internatl Business Mach Corp <Ibm> |
アデイテイブ鍍金浴および方法
|
|
US6565729B2
(en)
*
|
1998-03-20 |
2003-05-20 |
Semitool, Inc. |
Method for electrochemically depositing metal on a semiconductor workpiece
|
|
TWI223678B
(en)
*
|
1998-03-20 |
2004-11-11 |
Semitool Inc |
Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
|
|
US6113771A
(en)
*
|
1998-04-21 |
2000-09-05 |
Applied Materials, Inc. |
Electro deposition chemistry
|
|
US6571657B1
(en)
|
1999-04-08 |
2003-06-03 |
Applied Materials Inc. |
Multiple blade robot adjustment apparatus and associated method
|
|
US6551484B2
(en)
|
1999-04-08 |
2003-04-22 |
Applied Materials, Inc. |
Reverse voltage bias for electro-chemical plating system and method
|
|
US20030213772A9
(en)
*
|
1999-07-09 |
2003-11-20 |
Mok Yeuk-Fai Edwin |
Integrated semiconductor substrate bevel cleaning apparatus and method
|
|
US6913680B1
(en)
|
2000-05-02 |
2005-07-05 |
Applied Materials, Inc. |
Method of application of electrical biasing to enhance metal deposition
|
|
US6808612B2
(en)
|
2000-05-23 |
2004-10-26 |
Applied Materials, Inc. |
Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
|
|
US6576110B2
(en)
|
2000-07-07 |
2003-06-10 |
Applied Materials, Inc. |
Coated anode apparatus and associated method
|
|
JP2004536217A
(ja)
*
|
2000-10-03 |
2004-12-02 |
アプライド マテリアルズ インコーポレイテッド |
金属蒸着のためのエントリーにあたって半導体基板を傾けるための方法と関連する装置
|
|
US6610189B2
(en)
|
2001-01-03 |
2003-08-26 |
Applied Materials, Inc. |
Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
|
|
US20040020780A1
(en)
*
|
2001-01-18 |
2004-02-05 |
Hey H. Peter W. |
Immersion bias for use in electro-chemical plating system
|
|
US6478937B2
(en)
|
2001-01-19 |
2002-11-12 |
Applied Material, Inc. |
Substrate holder system with substrate extension apparatus and associated method
|
|
US20030146102A1
(en)
*
|
2002-02-05 |
2003-08-07 |
Applied Materials, Inc. |
Method for forming copper interconnects
|
|
US6911136B2
(en)
*
|
2002-04-29 |
2005-06-28 |
Applied Materials, Inc. |
Method for regulating the electrical power applied to a substrate during an immersion process
|
|
US20040200725A1
(en)
*
|
2003-04-09 |
2004-10-14 |
Applied Materials Inc. |
Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process
|
|
US20040206628A1
(en)
*
|
2003-04-18 |
2004-10-21 |
Applied Materials, Inc. |
Electrical bias during wafer exit from electrolyte bath
|
|
US20050092601A1
(en)
*
|
2003-10-29 |
2005-05-05 |
Harald Herchen |
Electrochemical plating cell having a diffusion member
|
|
US20050092602A1
(en)
*
|
2003-10-29 |
2005-05-05 |
Harald Herchen |
Electrochemical plating cell having a membrane stack
|
|
US20060102467A1
(en)
*
|
2004-11-15 |
2006-05-18 |
Harald Herchen |
Current collimation for thin seed and direct plating
|
|
US20060175201A1
(en)
*
|
2005-02-07 |
2006-08-10 |
Hooman Hafezi |
Immersion process for electroplating applications
|
|
US20100140098A1
(en)
*
|
2008-05-15 |
2010-06-10 |
Solopower, Inc. |
Selenium containing electrodeposition solution and methods
|
|
EP3074552A1
(en)
*
|
2013-11-25 |
2016-10-05 |
Enthone, Inc. |
Electrodeposition of copper
|