BE494578A - - Google Patents

Info

Publication number
BE494578A
BE494578A BE494578DA BE494578A BE 494578 A BE494578 A BE 494578A BE 494578D A BE494578D A BE 494578DA BE 494578 A BE494578 A BE 494578A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of BE494578A publication Critical patent/BE494578A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
BE494578D 1949-03-18 BE494578A (enrdf_load_html_response)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE281450X 1949-03-18

Publications (1)

Publication Number Publication Date
BE494578A true BE494578A (enrdf_load_html_response)

Family

ID=20307024

Family Applications (1)

Application Number Title Priority Date Filing Date
BE494578D BE494578A (enrdf_load_html_response) 1949-03-18

Country Status (6)

Country Link
US (1) US2706175A (enrdf_load_html_response)
BE (1) BE494578A (enrdf_load_html_response)
CH (1) CH281450A (enrdf_load_html_response)
DE (1) DE830860C (enrdf_load_html_response)
FR (1) FR1023810A (enrdf_load_html_response)
GB (1) GB667227A (enrdf_load_html_response)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE939362C (de) * 1953-06-04 1956-02-23 Wilhelm Meyer Verfahren und Vorrichtung zum Innenverchromen
DE959776C (de) * 1953-07-08 1957-03-14 Wolfram Ruff Dr Ing Anordnung zum Hartverchromen von Leichtmetallmotorenzylindern
BE538274A (enrdf_load_html_response) * 1954-05-19
US3483097A (en) * 1968-01-08 1969-12-09 Gen Motors Corp Method for coating inside surfaces of cavities
US3905885A (en) * 1973-06-13 1975-09-16 United States Steel Corp Method for the electrolytic conditioning of metal tubes
US4294670A (en) * 1979-10-29 1981-10-13 Raymond Louis W Precision electroplating of metal objects
FR2565323B1 (fr) * 1984-05-30 1986-10-17 Framatome Sa Procede de protection contre la corrosion d'un tube de generateur de vapeur et dispositif pour la mise en oeuvre de ce procede
US4686013A (en) * 1986-03-14 1987-08-11 Gates Energy Products, Inc. Electrode for a rechargeable electrochemical cell and method and apparatus for making same
GB8719816D0 (en) * 1987-08-21 1987-09-30 Sb Plating Ltd Electro-plating techniques
US4853099A (en) * 1988-03-28 1989-08-01 Sifco Industries, Inc. Selective electroplating apparatus
US4931150A (en) * 1988-03-28 1990-06-05 Sifco Industries, Inc. Selective electroplating apparatus and method of using same
KR20010020807A (ko) * 1999-05-03 2001-03-15 조셉 제이. 스위니 고정 연마재 제품을 사전-조절하는 방법
US6991528B2 (en) * 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20050092621A1 (en) * 2000-02-17 2005-05-05 Yongqi Hu Composite pad assembly for electrochemical mechanical processing (ECMP)
US20040020789A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7125477B2 (en) * 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US6979248B2 (en) * 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7374644B2 (en) * 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US6962524B2 (en) * 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7066800B2 (en) * 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US7303662B2 (en) * 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US7678245B2 (en) * 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US7303462B2 (en) * 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7670468B2 (en) * 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US20080156657A1 (en) * 2000-02-17 2008-07-03 Butterfield Paul D Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) * 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7137879B2 (en) * 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20050194681A1 (en) * 2002-05-07 2005-09-08 Yongqi Hu Conductive pad with high abrasion
US20050178666A1 (en) * 2004-01-13 2005-08-18 Applied Materials, Inc. Methods for fabrication of a polishing article
US9307648B2 (en) 2004-01-21 2016-04-05 Microcontinuum, Inc. Roll-to-roll patterning of transparent and metallic layers
US7833389B1 (en) * 2005-01-21 2010-11-16 Microcontinuum, Inc. Replication tools and related fabrication methods and apparatus
US20060030156A1 (en) * 2004-08-05 2006-02-09 Applied Materials, Inc. Abrasive conductive polishing article for electrochemical mechanical polishing
US7084064B2 (en) * 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
WO2006039436A2 (en) * 2004-10-01 2006-04-13 Applied Materials, Inc. Pad design for electrochemical mechanical polishing
US7520968B2 (en) * 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
WO2006078918A2 (en) 2005-01-21 2006-07-27 Microcontinuum, Inc. Replication tools and related fabrication methods and apparatus
EP1851366B1 (en) * 2005-02-21 2008-05-28 Aerotecnica Coltri S.P.A. Anode for an apparatus for the galvanic coating of the running surfaces of cylinders
US20060219663A1 (en) * 2005-03-31 2006-10-05 Applied Materials, Inc. Metal CMP process on one or more polishing stations using slurries with oxidizers
US7427340B2 (en) * 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US20070096315A1 (en) * 2005-11-01 2007-05-03 Applied Materials, Inc. Ball contact cover for copper loss reduction and spike reduction
WO2007100849A2 (en) 2006-02-27 2007-09-07 Microcontinuum, Inc. Formation of pattern replicating tools
KR100871160B1 (ko) * 2006-06-21 2008-12-05 양경준 고압가스용기 제조방법
US20080293343A1 (en) * 2007-05-22 2008-11-27 Yuchun Wang Pad with shallow cells for electrochemical mechanical processing
ES2363566T5 (es) * 2008-10-22 2020-04-16 Macdermid Enthone Inc Procedimiento para la deposición galvánica de capas de cromo duro
US9589797B2 (en) 2013-05-17 2017-03-07 Microcontinuum, Inc. Tools and methods for producing nanoantenna electronic devices
TWM491679U (zh) * 2014-07-29 2014-12-11 Min Aik Prec Ind Co Ltd 可對加工件穿孔鍍金的電鍍設備
WO2018075156A1 (en) 2016-09-09 2018-04-26 Modumetal, Inc. Manufacturing of molds by deposition of material layers on a workpiece, molds and articles obtained by said process
EP3612669A1 (en) 2017-04-21 2020-02-26 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB190403087A (en) * 1904-02-08 1904-12-08 Henry Maurice Wilton P Johnson Improvements relating to Apparatus for Amalgamating and Coating Metals or Alloys of Metals with Metals or Alloys of Metals by the Aid of Electricity
US914856A (en) * 1908-02-10 1909-03-09 Otto Meyer Electrolytic apparatus.
US1886218A (en) * 1927-06-29 1932-11-01 Western Cartridge Co Gun barrel and process of finishing the same
US1809826A (en) * 1927-09-06 1931-06-16 Chromium Corp Process of electrodepositing chromium
US1927162A (en) * 1931-02-27 1933-09-19 Research Corp Electroplating
US1982009A (en) * 1931-11-30 1934-11-27 Paul E Mckinney Means for electroplating the interior surfaces of hollow articles
DE670804C (de) * 1937-04-27 1939-01-26 Ladislav Partsch Vorrichtung zum Ausbuechsen von Maschinenzylindern und Maschinenlagern
US2332569A (en) * 1940-03-08 1943-10-26 Flannery Bolt Co Hollow stay bolt
US2475586A (en) * 1943-04-09 1949-07-12 Thompson Prod Inc Method of electropolishing the internal surface of a hollow valve
US2431948A (en) * 1943-11-01 1947-12-02 Gen Motors Corp Apparatus for electrodepositing metal on bearing shells and the like

Also Published As

Publication number Publication date
US2706175A (en) 1955-04-12
DE830860C (de) 1952-02-07
CH281450A (de) 1952-03-15
GB667227A (en) 1952-02-27
FR1023810A (fr) 1953-03-24

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