BE454977A - - Google Patents
Info
- Publication number
- BE454977A BE454977A BE454977DA BE454977A BE 454977 A BE454977 A BE 454977A BE 454977D A BE454977D A BE 454977DA BE 454977 A BE454977 A BE 454977A
- Authority
- BE
- Belgium
- Prior art keywords
- detector
- varnish
- adjusted
- tip
- once
- Prior art date
Links
- 239000013078 crystal Substances 0.000 claims description 6
- 230000035945 sensitivity Effects 0.000 claims description 3
- 239000002966 varnish Substances 0.000 claims 8
- 229920001342 Bakelite® Polymers 0.000 claims 2
- 239000004637 bakelite Substances 0.000 claims 2
- 230000004048 modification Effects 0.000 claims 2
- 238000012986 modification Methods 0.000 claims 2
- 238000001035 drying Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 230000008646 thermal stress Effects 0.000 description 2
- FWXAUDSWDBGCMN-DNQXCXABSA-N [(2r,3r)-3-diphenylphosphanylbutan-2-yl]-diphenylphosphane Chemical compound C=1C=CC=CC=1P([C@H](C)[C@@H](C)P(C=1C=CC=CC=1)C=1C=CC=CC=1)C1=CC=CC=C1 FWXAUDSWDBGCMN-DNQXCXABSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE256718X | 1943-04-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
BE454977A true BE454977A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Family
ID=5966370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE454977D BE454977A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1943-04-05 |
Country Status (3)
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE924997C (de) * | 1948-10-01 | 1955-03-10 | Siemens Ag | Richtleiter |
DE1043515B (de) * | 1953-10-01 | 1958-11-13 | Siemens Ag | Verfahren zur Herstellung einer in einem mit Vergussmasse ausgefuellten, vakuumdichtabgeschlossenen Gehaeuse untergebrachten Halbleiteranordnung |
BE534031A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1953-12-12 | |||
DE976378C (de) * | 1953-12-24 | 1963-08-14 | Siemens Ag | Verfahren zum Verschliessen von Gehaeusen fuer elektrische Halbleiteranordnungen mittels Erwaermung |
-
0
- BE BE454977D patent/BE454977A/fr unknown
-
1944
- 1944-02-22 CH CH256718D patent/CH256718A/de unknown
- 1944-02-22 FR FR902142D patent/FR902142A/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
CH256718A (de) | 1948-08-31 |
FR902142A (fr) | 1945-08-20 |
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