BE1024350A1 - Automated system for the singulation of circuits from DBC substrates, and method thereof - Google Patents

Abstract

The present invention relates to methods for singulating substrates to strips and / or circuits, for breaking off so-called loss edges, as well as settings for performing the aforementioned methods. In addition, an umbrella system has been described that efficiently unites the institutions. Finally, the product of the singulation method and / or singulation system is also described.

Description

BE2016 / 5506

AUTOMATED SYSTEM FOR SINGULATING SWITCHES FROM DBC SUSSTRATES, AND METHOD THEREFOR

TECHNICAL DOMAIN

The invention relates to an automated system for singulating circuits from Substrates, specifically for singulating circuits from so-called DBC substrates. In addition, methods for this purpose are described, also for an adjustment and method for removing loss edges from Substrates. Finally, an overarching system is described and the end product of the methods.

STATE OF THE ART

A problem with the known methods for singulating circuits from Substrates is that this is done on the one hand slowly, and on the other hand with an excessive percentage of damaged or defective circuits. The Substrates can be handled manually, which is expensive in terms of working hours and therefore not economically interesting, also because this requires training of an employee. In addition, the amount of errors leading to damage is still unacceptably high. An automation of these working methods and settings are therefore gradually available.

However, the applicant noted that existing devices and systems that perform these operations automatically are not adapted to certain problems. After all, automation is based on a standardized product that must be manipulated. However, this is not the case, as discussed further. Deviations may occur on the Substrates in the form of a warp. Where the Substrates should normally be flat, there is a curvature, so-called 'twist' and 'warpage'. The devices currently known are unable to manipulate individualized Substrates adapted to the precise warp, resulting in too rough handling of the Substrates. Given the sensitivity of these products, this leads to an unacceptable percentage of losses due to breakage that occurs during production and further processing, for example, by clamping the Substrates. Also, in the effective singulation itself, the Substrates are insufficiently taken into account and many fractions and

BE2016 / 5506 damage. Since this is typically an end process, this amounts to, in addition to loss of material, also loss of production capacity and working hours.

In addition, such rough handling of the Substrates (and singled circuits) also results in damage that may not fully occur until later (microcracks that expand under stress until fatal errors occur), which is often life-threatening for an end user.

An example of a known system that falls short is, for example, US 4,235,357. Here, the Substrates are clamped at multiple times and ορ multiple positions during singulation, as shown in Figure 2 (a) of document US '7,005,317. In practice, this clamping leads to unacceptable losses. Further shortcomings of such a system are further elucidated on the basis of the discussion of the invention itself.

A second such system is described in US 7,005,317, wherein the substrate is broken down at the bottom by providing a pressure differential on one side. Here, the Substrates are attenuated along pre-arranged fault lines as usual. However, the substrate is clamped on the sides, and in addition, the circuits can break in undesired places due to the adjusted overpressure on one side. This can certainly be seen in figure 9 of US 7,005,317, where it is clear that the substrate, and thereby the circuits along the entire surface, are loaded. As mentioned, this can lead to a deterioration of the structural integrity of the ceramic support (microcracks) leading to fractures, if not during singulation, then under use in the future. Furthermore, such a system also increases the chance that components on the circuits will break or be damaged by the substrate curving up.

The object of the present invention is to find a solution to at least some of the aforementioned Problems.

There is a need for an improved method, improved settings and Systems for singulating circuits from Substrates.

SÄMENVÄTTING OF THE INVENTION

BE2016 / 5506

The invention relates in a first aspect to a method for swinging electronic circuits from a substrate, the substrate comprising a first set of pre-applied attenuated breaklines and a second set of pre-applied attenuated breaklines, the first set and the second set substantially perpendicular stand on top of each other, comprising the following steps:

a. advancing a substrate parallel to the fracture lines of the first set beyond a first sharp splitting wedge located on an opposite side of the substrate from the fracture lines, advancing the substrate to a first position at which an extremity of fracture line of the second set of fracture lines beyond and substantially parallel to a projection of the first sharp splitting wedge is perpendicular to the substrate, and wherein an extremity strip of the substrate is fully protruding from the first sharp splitting wedge;

b. just breaking off the cantilever strip from the substrate along the extremity of the second set of fracture, by applying a first moment of force to the cantilever strip, applying the first moment of force by applying a first force to the cantilever strip, the first force is directed substantially perpendicular to the substrate from the side where the score line is applied to the opposite side, preferably the second force being applied to a ceramic portion of the protruding strip, and the first sharp splitting wedge serving as the axis of the first moment of force;

c. just parallel to the breaklines of the second set of advancing the broken strip beyond a second sharp splined wedge located on the opposite side of the broken strip relative to the breaklines, advancing the broken strip to a second position with an extraneous breakline of the first set of breaklines of the strip beyond and substantially parallel to a projection of the second sharp splitting wedge is perpendicular to the substrate, and an extremely electronic circuit of the broken strip is fully cantilevered with respect to the second sharp splitting wedge; and

d. breaking off the cantilevering circuit of the strip along the extremity of the fracture of the first set, by applying a second moment of force to the cantilevering circuit, applying the second moment of force by applying a second force to the cantilevering circuit, whereby the second force is directed substantially perpendicular to the strip from the side where the score line is applied to the opposite side, preferably

BE2016 / 5506 in which the second force is exerted on a ceramic part of the protruding circuit, and in which the second sharp splitting wedge serves as axis for the second moment of force.

In a second aspect, the invention relates to a method of breaking a substrate along a straight, attenuated score line pre-applied on one side of the substrate, comprising the following steps:

a. advancing a substrate along a direction parallel to the substrate and perpendicular to the fracture line, advancing the substrate beyond a sharp splitting wedge located on an opposite side of the substrate from the fracture line, advancing the substrate to a position where the score line is beyond and substantially parallel to a projection of the sharp splitting wedge perpendicular to the substrate, preferably at a maximum distance of 0.25 cm, and further preferably 0.1 cm, and with an extra mowing end of the substrate fully protruding from the sharp splitting wedge;

b. net suction engaging the substrate after advancing the substrate to the position where the substrate is sucked in one or more locations on the substrate and the suction engaging the substrate is adapted to a curvature of the substrate's surface to follow ;

c. breaking off the cantilevered end of the substrate along the fracture line, by applying a moment of force to the cantilevering end, applying the moment of force by applying a force to the cantilevering end, the force being directed substantially perpendicular to the substrate from the side where the fracture line is applied to the other side, and where the sharp splitting wedge serves as axis for the moment of force.

In a third aspect, the invention relates to an arrangement for singulating electronic circuits from Substrates, wherein the Substrates comprise a first set of pre-applied attenuated fault lines and a second set of pre-applied attenuated fault lines, the first set and the second set being substantially perpendicular on top of each other, comprising:

a. a first transport system for the controlled movement of a substrate in a plane parallel to the substrate and along a first transport direction parallel to the fault lines of the first set, wherein the first

BE2016 / 5506 conveyor system includes one or more pistons adapted for suction engaging and immobilization of the substrate, preferably on a non-component side of the substrate, and the pistons adapted to curvature of the substrate substrate wipe when gripping and immobilizing the substrate;

b. a first sharp splitting wedge over which protruding strips of the substrate are broken off successively along the fracture lines of the second set, the first sharp splitting wedge being downward along the first transport direction and below the plane in which the Substrates are moved, the first sharp splitting wedge having a splitting edge which is substantially parallel to the plane in which the Substrates are moved and is substantially perpendicular to the first conveying direction, and the splitting edge is preferably at a maximum distance of 0.25 cm, preferably 0.10 cm, further preferably 0.05 cm cm, to a square in which the Substrates are moved; and c, a first crushing unit for applying a first force ορ a protruding strip from the immobilized substrate and breaking off the protruding strip from the immobilized substrate, the first crushing unit being adapted to exert the first force on the protruding strip when the cantilever strip is positioned completely beyond a projection of the splitting edge of the first sharp splitting wedge perpendicular to the plane in which the Substrates are moved, the first force being substantially perpendicular to the plane of the substrate and directed from top to bottom relative to the substrate, preferably the first force being applied to an extremity of the protruding strip, further preferably to a ceramic portion of the extremity of the protruding strip;

the one or more pistons of the first conveying system adapted to suck and immobilize the substrate when the cantilever strip is positioned completely past the projection of the splitting edge of the first sharp splitting wedge on the plane in which the Substrates are moved, before the first crushing unit applies the first force ορ the protruding strip.

In a further embodiment, the above installing further includes:

a. a collection system for collecting broken strips from the

Substrates, preferably in which the collection system comprises one or more pistons for just sucking engagement of the broken strips;

BE2016 / 5506

b. a second transport system for the controlled displacement of a collected strip in a plane parallel to the collected strip and along a second transport direction substantially perpendicular to the fracture lines of the first set on the collected strip, the second transport system comprising one or more pistons for suctioning engaging and immobilizing the received strip, preferably on a non-component side of the received strip, and the pistons adapted to follow a curvature of the plane of the received strip when engaging and immobilizing the received strip, preferably wherein the one or more pistons of the second conveying system form part of the one or more pistons of the coilecting system;

c. a second sharp splitting wedge over which protruding switches of the strip are broken off successively along the fracture lines of the first set, the second sharp splitting wedge being downward along the second transport direction and under the plane in which the strips are moved, the second sharp splitting wedge having a splitting edge which is substantially parallel to the plane in which the strips are moved and is perpendicular to the second conveying direction, and the cutting edge is preferably at a maximum distance of 0.25 cm, preferably 0.10 cm, further preferably 0.05 cm , to the square in which the strips are moved;

d. a second breaking unit for applying a second force to a protruding circuit of the immobilized strip and breaking off the protruding circuit of the immobilized strip, the second breaking unit being adapted to apply the second force to the protruding circuit when the protruding circuit circuit is fully positioned beyond a projection of the spiked edge of the second sharp splitting wedge perpendicular to the plane in which the strips are moved, the second force being substantially perpendicular to the plane of the strip and oriented from top to bottom relative to the strip, preferably where the second force is applied to an extremity! end of the cantilever circuit, preferably further on a ceramic portion of the extremity. end of the cantilever circuit; and

e. optionee! a second coilecting system for receiving and transmitting broken circuits of the strips, preferably wherein the second coilecting system comprises one or more pistons for sucking engagement of the broken circuits;

BE2016 / 5506 in which the one or more pistons of the second conveying system are adapted to grip and immobilize the strip in a suction manner when the cantilevering circuit is completely beyond the projection of the splitting edge of the second sharp splitting wedge on the plane in which the strips are moved, is positioned before the second crushing unit applies the second force to the cantilevering circuit.

In a fourth aspect, the invention relates to an arrangement for breaking off the edge of the substrate from the substrate, the edge of the substrate being separated by at least one side of the substrate by means of the middle. of pre-applied attenuated fault lines, comprising:

a holding system for holding the substrate, preferably centrally and / or on one side of the substrate where no electronic components are present, comprising one or more pistons, preferably vacuum pads, the one or more pistons being adapted to to flex the curvature of the substrate when holding the substrate.

b. at least one break system, comprising a movable clamp, preferably a movable vise, with two jaws for gripping a loss edge of the substrate with the jaws on both sides, the movable clamp being pivotable about a pivot axis on a support of the breaking system sutured, the pivot axis being at a maximum distance of 0.5 cm, preferably 0.25 cm, further preferably 0.1 cm, from an extremity of one of the jaws, and still more preferably wherein the pivot axis is substantially ! coincides with the fracture line of the clamped loss edge.

In a fifth aspect, the invention relates to a system for singling electronic circuits from Loss Edge Substrates, comprising:

a. an arrangement for breaking off edge of the substrate substrate as described herein;

b. a conveying system for transferring the debris-stripped substrates from the substrate for breaking down the edges of the substrate to the substrate for singling electronic circuits from substrates;

c. an arrangement for singling electronic circuits from Substrates as described herein.

BE2016 / 5506

In a sixth aspect, the invention relates to an electronic circuit singulated from a substrate, according to a method as described in this document, preferably wherein the singulation is performed with a system as described in this document.

DESCRIPTION OF THE FIGURES

Fsgyur 1 shows a side view of a possible embodiment of singulating or breaking off a strip / circuit of a substrate / strip according to the invention.

Fsgyur 2 shows a side view of a possible embodiment of a part of a device according to the invention for breaking off loss edges of a substrate, in which opposite loss edges are germinated and the substrate is immobilized.

Fsgyys · 3 shows a simplified implementation of a prior art setting for strip / circuit breakdown of a substrate / strip, not taking into account a warpage or twist of the substrate / strip.

Fägyu! 4 shows a perspective view of a possible embodiment of a part of the adjustment according to the invention for breaking off loss edges of a substrate, in which the loss edge of the substrate is clamped.

Fig. 5A shows a side view of a possible embodiment of a part of the Setup according to the invention for breaking off loss edges of a substrate, clamping the loss edge of the substrate, continuing on Figure 2.

Figure SB shows a side view of a possible embodiment of a part of the inventive setting for breaking off loss edges of a substrate, the loss edge being broken in an action following the position of Figure 5A, also continuing on Figure 2.

Fsgsjyr 6Ä shows a top view of a possible embodiment of the setting according to the invention for singulating Substrates to strips and to circuits, especially in the plane XY, with the first breaking unit withdrawn, and the setting being ready for breaking off a circuit from a comic.

BE2016 / 5506

Figyyr SB shows a top view of a possible embodiment of the setting according to the invention for just singulating Substrates to strips and to circuits, namely in the plane XY, wherein the first breaking unit is actively retracted, and the setting is ready to abort a strip from a substrate.

Figure 7 shows a side cross-section of a possible embodiment of a part! of the setting according to the invention for singulating Substrates into strips, namely in the plane XZ.

DETAILED DESCRIPTION

The invention relates to an improved system, apparatus and method for singulating multi-circuit substrates (units) in a manner that reduces the loss due to circuit breakages and the like, as well as a faster, automated singulation process suitable for industrial application.

Unless otherwise defined, all terms used in the description of the invention, including technical and scientific terms, have the meaning generally understood by those skilled in the art of the invention. For a better assessment of the description of the invention, the following terms are explicitly explained.

One, de and in this document refer to both the singular and the plural unless the context clearly presupposes otherwise. For example, a segment means one or more than a segment.

When around or around this document is used with a measurable quantity, a parameter, a duration or moment, and the like, variations of +/- 20% or less, preferably +/- 10% or less, more at preferably +/- 5% or less, even more preferably +/- 1% or less, and even more preferably +/- 0.1% or less than and of the quoted value, insofar as such variations apply. invention. However, this should be understood to mean that the value of the quantity by which the term is used approximately or round is itself specifically disclosed.

BE2016 / 5506

The terms include, include, consist of, consist of, provide with, contain, contain, control, controlling, content, containing are synonyms and are inclusive or open terms that indicate the presence of what is, and do not exclude or seize the presence of other components, features, elements, elements, steps, known from or described in the prior art.

Claiming numerical Intervals through the endpoints encompass all of the actual jaws, fractions and / or real jaws between the endpoints, including these endpoints.

In a first aspect, the invention relates to a method for just singling electronic circuits from a substrate, the substrate comprising a first set of pre-applied attenuated fault lines and a second set of pre-applied attenuated fault lines, wherein the first set and the second set are substantially perpendicular stand on top of each other, comprising the following steps:

a. advancing a substrate parallel to the fracture lines of the first set at a first sharp splitting wedge located on an opposite side of the substrate from the fracture lines, the substrate being advanced to a first position at which an extremity of fracture line of the second set of fracture lines beyond and substantially parallel to a projection of the first sharp splitting wedge is perpendicular to the substrate, and wherein an extremity strip of the substrate is fully protruding from the first sharp splitting wedge;

b. just breaking off the cantilevering strip of the substrate along the extrusion line of the second set, by applying a first moment of force to the cantilevering strip, applying the first moment of force by just applying a first force to the cantilevering strip, the first force is directed substantially perpendicular to the substrate From the side where the score line is applied to the other side, preferably the second force being applied to a ceramic portion of the protruding strip, and the first sharp splitting wedge serving as the shaft for the first moment of force;

c. advancing the broken strip parallel to the break lines of the second set beyond a second sharp splitting wedge located on the opposite side of the broken strip relative to the break lines, advancing the broken strip to a second position with an extraneous break line of the first set of score lines of the strip

BE2016 / 5506 past and substantial! parallel to a projection of the second sharp splitting wedge is perpendicular to the substrate, and an extrema electronic circuitry of the broken strip is fully protruding from the second sharp splitting wedge; and d, breaking off the cantilever circuit of the strip along the extremal fracture line of the first set by applying a second moment of force to the cantilever circuit, applying the second moment of force by applying a second force to the cantilever circuit , where the second force is substantial! is oriented perpendicular to the strip from the side where the break line is applied to the opposite side, preferably with the second force applied to a ceramic portion of the cantilever circuit, and the second sharp splitting wedge serving as the shaft for the second moment of force.

One of the aims of the inventive concept is to singulate electronic circuits in an improved manner, both in terms of accuracy and speed. after all, the applicant noticed that an unacceptably high error rate (microcracks, 'toe out', 'chip out' and other Problems) occurred during singulation. Upon further investigation, many of these fractures are due to already present weakenings in the substrate, including tensile stresses in the substrate and more interposed between the layers in different materials. These expand differently during heating and cooling, resulting in a poorly fitting product at rest and a resulting tension. This problem is known, inter alia, with direct-bonded copper (DBG) Substrates, where the thermal expansion coefficient of copper (or layer of other electrical conductor) and that of the ceramic support on which the copper layer (or other) is bound, differ greatly. In addition, there is also a substantial difference in the treatment of the top and bottom of the substrate. At the top a very precise etching process is carried out to etch individual conductors in the copper, while this is typically lacking at the bottom (possibly other patterns can be applied to it, nevertheless this further stresses the substrate. so-called fracture lines are applied by laser (pulse lines), which further weakens the ceramic support, which on the one hand can lead to further warping of the substrate, but also increases the chance of unwanted fractures (not on fracture lines) due to damage to the structural integrity of the circuits,

These stresses are strongly reflected in the further processing of the substrate, namely the application of the power components, the soldering process and the

BE2016 / 5506 baking the switches. During sidering, the Substrates are typically brought to a temperature of 2.40 ° C in a vacuum oven, after which the Substrates are allowed to cool to normal temperature. It is in these processes with temperature changes that a so-called 'twist' and / or 'warpage' occur. These can lead to a deviation of the desired flat substrate by up to 5 mm and even more.

Current singulation systems do not or insufficiently take this into account, which leads to an excessive loss percentage of broken units or circuits. The inventor solves this problem by the aforementioned combination of measures (and subsequent ones) that together solve the problem substantially. In addition, it should also be noted that breaks occur between the 'baking process' described above and intermediate steps, such as ultrasonic wire bonding and the like. in these steps, the substrate is often! clipped as flat as possible (typically on a vacuum table) to perform the steps as accurately as possible. The substrate is therefore heavily loaded to compensate for the twist and warpage, whereby fractures may occur (or further weakening of the substrate).

A first mistake rests in the fact that the Substrates are broken over an edge of a shear pad on which the substrate rests. However, due to the curvature of the substrate, the substrate cannot be guaranteed to be held in the correct position during fracturing, and the fracture may occur elsewhere, as also shown in the example of Figure 3. Using a sharp splitting wedge for breaking off the cantilevered sections instead of a shear breaking platform ensures that the moment of force engages in the correct position (or along the correct line, i.e. as close as possible to the breakline of the cantilevered section), and the breaking off this is done as correctly and accurately as possible along the desired fault line.

in a further embodiment, the method further comprises the following steps:

a. immobilizing the substrate upon reaching the first position and before breaking off the protruding strip, by means of one or more pistons, preferably flexible vacuum pads, which grip in a non-protruding part of the substrate, whereby a curvature of the plane of the substrate is monitored;

b. immobilizing the broken-off strip upon reaching the second position and before breaking off the cantilever circuit, by means of one or more pistons, preferably flexible vacuum pads, which grip in a non-cantilevered part of the broken-off strip, following a curvature of just the broken strip.

BE2016 / 5506

It should be taken into account here that the above steps can take place between or simultaneously some of the aforementioned steps.

A second mistake that many known Systems make is the sprouting of the Substrates by means of flat clamps that do not take into account the curvature of the substrate, and if possible a! cause fractures. In addition, this can lead to problems with components on the circuits, which can be damaged and / or make clamping more difficult.

In order to avoid the above Problems, the applicant proposes a method whereby, among other things, it is not opted for a clamping engagement and / or transport of the Substrates, but for a sucking (one-sided) engagement of the Substrates (on a non-cantilevered part), and transport along a transport direction without clamping the Substrates (on the surface of the substrate), In addition, the pistons can have some mobility (small deviations in angle of the piston, vertical and / or horizontal position, these deviations are typically only a few degrees or a few mm, since the deviations of the substrate may also be of this magnitude). This guarantees an optimal connection to the substrate without this producing significant additional loads. This can be achieved, for example, through the use of a flexible material for the pistons. In addition, the pistons are positioned in position in the plane along which the substrates are moved, preferably substantially immobile, and the pistons are used discontinuously. Once a substrate has been brought into the first position, the pistons will engage and immobilize the substrate. After breaking off the protruding strip, the pistons release the substrate again so that it can be pushed further along the first conveying direction so that it is brought back into first position with a protruding extrema strip, after which the pistons engage the substrate again. The substrate is moved smoothly so that the substrate follows the first conveying direction, for example by providing guide channels on either side of the substrate (along the edges of the substrate which are parallel to the first conveying direction). The substrate can then be pushed (on the proximal side), for example by a pushing device. This pushing device furthermore preferably also serves to prevent a flashover when the protruding strip is broken off, for instance by providing an overhanging part at the pushing device which hangs above the proximal edge of the substrate, and thus the flashover of the substrate upwards (or vice versa If downward overtopping is threatened by another arrangement).

BE2016 / 5506

Note that the above explanation was based on a situation in which the substrate is shifted along the first transport direction, but this can easily be extrapolated to the situation in which the strips are shifted along the second transport direction.

Preferably, the pistons are provided with flexible suction cups so that they do not damage the Substrates and can adapt to curves of the substrate or other unforeseen situations.

In a further embodiment, the extrema fracture line of the first set is in the first position a maximum distance of 0.25 cm, preferably 0.1 cm, even more preferably 0.06 cm, away from the projection of the first sharp splitting wedge, and the extrema fracture line of the second set in the second position a maximum distance of 0.25 cm, preferably 0.1 cm, even more preferably 0.06 cm, from the projection of the second sharp splitting wedge.

The splitting wedge is, so to speak, sharp, at least towards the plane in which the Substrates are advanced, and serves as an opposition to the substrate when the protruding portion of the substrate is broken off by applying a force to it, and this as a fulcrum or pivot over which the cantilever portion of the substrate, the cantilever strip, is broken along the score line by applying a force to the cantilever strip perpendicular to the plane of the strip (and thus of the substrate). For example, the splitting wedge may be a substantially planar projecting ledge in which the plane of the ridge is perpendicular to the square in which the Substrates are moved and is parallel to the fault lines over which the Substrates are broken across the ledge.

Again, the same reasoning applies to the operation of the second splitting wedge, and is not discussed in more detail here, but it is believed that a person skilled in the art, based on the information in this document, has the information that is needed.

In a further embodiment, the substrate comprises one or more degradable loss edges which are separated from the rest of the substrate by attenuated fracture lines pre-applied on at least one side. In this case, the previous procedure is preceded by the following steps:

a. just immobilizing the substrate by means of one or more pistons, preferably flexion vacuum pads, which suctionly engage the substrate, following a curvature of the surface of the substrate;

b. just clampingly gripping the substrate on at least one edge of the substrate, of which at least one of the gripped edges has a degradable

BE2016 / 5506 is a trim edge, preferably wherein the sprouting gripping is adapted to a curvature of the pad of the grippable degradable trim edge;

c. breaking off the sprouted degradable loss edge by applying a moment of force to the sprouted degradable loss edge, the moment of force being applied about an axis at a maximum distance of 0.25 cm, preferably from 0.1 cm, even more preferably from 0.06 cm, to the break line of the sprouted degradable loss edge.

Substrates are typically provided with degradable waste borders before the start of the singulation process, which serve, inter alia, for the physical manipulation of the Substrates without damaging circuits, but also for applying information about the substrate (identifiers and such). When singing, these must first be removed. Because these loss edges are too smooth to be removed by the above method (force should be applied too close to the break line, and thus be larger, which gives a less predictable result, and thus more chance of breakage). if the fringe edges were to be removed in this manner, an apparatus for performing the method would then have to adjust each other while singling a substrate between chipping fringe edges and chipping strips / circuits from the rest of the substrate / strip . For this reason, a method has been chosen which focuses on the naturalization of the edge of the loss, in which the moment of force to naturalize the edge of the loss is exerted on the edge of the loss around an axis which is as close as possible to the breaking line of the loss edge. In this way it is ensured that the edge of the line is broken off along the breaking line (and does not, for example, break off part of the substrate, or partly remains attached to the substrate).

Preferably, the alignment of the jaws is adjustable relative to each other to optimally clamp the loss edges and remove them correctly (i.e., where the pivot axis coincides with the break line of the loss edge). For example, it is important that the jaws are positioned so that the moment of force acting through the jaws on the loss edge is exerted around an axis that is located on the breaking line of the loss edge (or as close to it as possible). To this end, it may be possible to calibrate the pelvis at the start of singing (or recalibrate in between). The intended result here is that both jaws are well positioned to apply the forces of force over a portion of the loss edge extending from the extremity end of the loss edge to as close as possible to the break line to ensure the loss edge is fully breaks down, and not partially. That way it can be guaranteed that it is as close to the axis as possible

BE2016 / 5506 around which the moment of force works, a force can be applied to the veriiesrand vis the pelvis.

In a further embodiment, the method includes the next step after breaking off the protruding strip:

a. receiving the broken strip, the broken strip being positioned such that the break lines of the first set of the broken strip are substantially perpendicular to the first sharp splitting wedge;

and optionee! comprising step after termination of the cantilevering electronic circuit:

b. receiving the aborted circuit.

By immediately receiving the broken strip, preferably in a few essentials! parallel to the tray in which the substrate is moved, and to position the broken strip as indicated above, the strip can be easily transferred to a second breaking step to singulate the individual circuits. Preferably, the square in which the broken strip is collected is lower than the square in which the substrate is moved, such that the strip can be gradually shifted in this square to a second breaking step. It is important here that the broken strip is very correctly aligned with the second splitting wedge in such a way that the individual circuits can be correctly tinged.

In a further embodiment the suction-engaging of the substrate and / or the strip takes place on the underside of the substrate and / or the strip, respectively, when the substrate and / or the strip above the first sharp splitting wedge and / or the second sharp splitting wedge, respectively. are in the first position and / or the second position, respectively.

In a second aspect, the invention relates to a method of breaking a substrate along a straight, attenuated fracture line pre-arranged on one side of the substrate, comprising the following steps:

a. advancing a substrate along a direction parallel to the substrate and perpendicular to the fracture line, the substrate being advanced beyond a sharp splitting wedge located on an opposite side of the substrate from the breakline, advancing the substrate to a position where the break line is past and

BE2016 / 5506 is substantially parallel to a projection of the sharp splitting wedge perpendicular to the substrate, preferably at a maximum distance of 0.2.5 cm and more preferably 0.1 cm, and even more preferably 0.06 cm, and wherein a the extreme end of the substrate is fully protruding from the sharp splitting wedge;

b. the suction-engaging of the substrate after advancing the substrate to the position, the substrate being suction-engaging in one or more locations on the substrate, and the suction-engaging of the substrate being adapted to a curvature of the plane of the substrate to follow ;

c. breaking off the cantilevered end of the substrate along the fracture line, by just applying a moment of force to the cantilevering end, the moment of force being applied by applying a force to the cantilevering end, the force being directed substantially perpendicularly to the substrate from the side where the score line is applied to the opposite side, and the sharp wedge wedge serves as the axis for the moment of force.

The above method is a more general application of the method described above, and offers solutions to the same problems as in the above method, and can be applied both for breaking strips of a substrate and for breaking individual circuits of a strip.

Preferably, the forces of the methods of the first and second aspects are specifically applied to an edge of the substrate, preferably to a ceramic portion of the substrate. In this way, the more critical parts of the substrate, which typically include copper or other electrical conductors, are spared from loads that could potentially lead to breakage.

In a further embodiment, a rotating action of the substrate about an axis parallel to the score line is substantially limited and / or prevented by just limiting movement of an opposite edge of the substrate relative to the edge on which the force is applied, the limiting the movement of the opposite edge is performed on the side of the substrate where the score line is applied. This aspect can also, and preferably always, be carried out in the method according to the first aspect, in this way also avoiding the flashover of the strips when the individual circuits are broken off.

BE2016 / 5506

As is also illustrated in the figures with an embodiment of an apparatus for this, a failsafe measure can be taken that the moment of force under the influence of which the protruding strip of the substrate is broken off does not cause the substrate to rotate (for example, when sucking badly engagement of the pistons), but still to break off a strip (or switch) from the rest of the substrate (or remainder of the strip). A possibility for this is to provide a physical stop-over stopper which is located at a small distance from the substrate.

In a third aspect, the invention relates to an arrangement for singulating electronic switches from Substrates, wherein the Substrates comprise a first set of pre-applied attenuated fault lines and a second set of pre-applied attenuated fault lines, the first set and the second set being substantially perpendicular on top of each other, comprising:

a. a first transport system for the controlled movement of a substrate in a plane parallel to the substrate and along a first transport direction parallel to the fault lines of the first set, the first transport system comprising one or more pistons adapted for suction engagement and immobilizing the substrate, preferably on a non-component side of the substrate, and the pistons adapted to follow a curvature of the plane of the substrate upon just engaging and immobilizing the substrate;

b. a first sharp splitting wedge over which protruding strips of the substrate are successively broken along the fracture lines of the second set, the first sharp splitting wedge being downward along the first transport direction and below the plane in which the Substrates are moved, the first sharp splitting wedge having a splitting edge which is substantially parallel to the plane in which the Substrates are moved and is substantially perpendicular to the first conveying direction, and the splitting edge is preferably at a maximum distance of 0.25 cm, preferably 0.10 cm, further preferably 0.05 cm cm, to the plane in which the Substrates are moved; and

c. a first crushing unit for applying a first force to a cantilever strip of the immobilized substrate and breaking off the cantilever strip of the immobilized substrate, the first crushing unit being adapted to exert the first force on the cantilever

BE2016 / 5506 strip when the cantilever strip is positioned completely past a projection of the cutting edge of the first sharp cutting wedge perpendicular to the plane in which the Substrates are dislocated, the first force being substantially perpendicular to the plane of the substrate and directed from top to bottom relative to the substrate, preferably the first force being applied to an extremity of the protruding strip, further preferably to a ceramic portion of the extremity of the protruding strip; the one or more pistons of the first conveying system being adapted to grip and immobilize the substrate in a suction manner when the protruding strip is positioned completely past the projection of the splitting edge of the first sharp splitting wedge on the plane in which the Substrates are machined, before the first crushing unit applies the first force to the cantilever strip.

The installation offers a solution to the problems discussed earlier, and offers, among other things, an improvement in a strongly reduced error rate when singling circuits from substrates. After all, the setting avoids where possible to exert pressure or forces on the surface of the substrate, except during the breaking itself. Since the plane of the substrate is sensitive to load, this prevents fractures. In known systems this occurs, inter alia, when clamping a substrate flat before breaking. Furthermore, we do not work with a breaking surface, but with a sharp wedge wedge (breaking path, breaking knife, ... and other terms can also provide an explanation), which serves as a counterbalance for the substrate (strip) along the fracture line of a protruding strip ( circuit), such that, when a force is applied to the cantilever strip (circuit), it will break along the fracture line, since a localized reaction force is delivered to the substrate, near and along the fracture line. In known systems, the eventual breakage may also occur in other places, as these do not take into account the possible curvature of the substrate (strip), or the substrate (strip) may suffer other damage due to clamping during breaking off. This clamping is done at the proposed setting by means of one or more, preferably two or four, pistons that grip the substrate (strip) when it is brought into the correct position. As a result, a force is exerted as short as possible on the substrate, and this is especially not done via a clamping of the substrate (strip). In addition, the pistons are adapted to engage the substrate (strip) in a manner adapted to the curvature of the substrate (strip). Further possibilities for this have been mentioned before (fiexibeie zgnap, adjustable pistons, ...).

BE2016 / 5506

Reaching the first position, with exactly one strip (link) positioned cantilevered relative to the first splitting wedge, is accomplished by the transport system, which preferably includes a supporting pocket (or sub-pockets) along which the substrate is shifted. One month! the first position is reached, the pistons engage the substrate (logically on the non-cantilevered portion) so that the substrate is immobilized. For example, by exerting a force on the protruding portion, a moment of force can act on this protruding portion, which ensures that this protruding portion is broken off along the fault line of the protruding portion. The presence of the splitting wedge under the substrate (or above, depending on the arrangement) causes the fracture to occur along the fracture line as desired, acting as a fulcrum for the moment of force. Suctioning engagement by the pistons ensures that the substrate does not topple smoothly due to the acting force and torque, but that the protruding portion is broken off from the rest of the substrate that is held in place. Once broken down, the substrate is moved further to a new part! (new strip) protruding in the first position.

in a further embodiment, the above arrangement further includes:

d. a collection system for collecting broken strips from the Substrates, preferably wherein the collection system comprises one or more pistons for sucking gripping of the broken strips;

e. a second transport system for the controlled displacement of a collected strip in a plane parallel to the collected strip and along a second transport direction substantially perpendicular to the fault lines of the first set on the collected strip, the second transport system comprising one or more pistons for suctioning engaging and immobilizing the received strip, preferably on a non-component side of the received strip, and the pistons adapted to follow a curvature of the received strip's grip upon gripping and immobilizing the collected strip, preferably in which the one or more pistons of the second transport system forming the one or more pistons of the collection system;

f. a second sharp splitting wedge over which protruding circuits of the strip are broken off successively along the fracture lines of the first set, the second sharp splitting wedge being downward along the second transport direction and under the plane in which the strips are moved, the second sharp splitting wedge having a spike edge includes that substance! is parallel

BE2016 / 5506 with the plane in which the strips are moved and is perpendicular to the second transport direction, and the splitting edge is preferably at a maximum distance of 0.25 cm, preferably 0.10 cm, further preferably 0.05 cm, up to the square in which the strips are moved;

g, a second breaking unit for applying a second force to a cantilever circuit of the immobilized strip and breaking off the cantilever circuit of the immobilized strip, the second breaking unit adapted to apply the second force to the cantilever circuit when the cantilever circuit is positioned completely beyond a projection of the splitting edge of the second sharp splitting wedge perpendicular to the plane in which the strips are moved, the second force being substantially perpendicular to the strip's head and oriented from top to bottom relative to of the strip, preferably the second force being applied to an outer end of the cantilever circuit, further preferably to a ceramic portion of the outer end of the cantilever circuit; and

h. optionally a second coilecting system for receiving and transmitting broken circuits of the strips, preferably in which the second coilecting system comprises one or more pistons for sucking engagement of the broken circuits;

the one or more pistons of the second conveying system adapted to suction-engage and immobilize the strip when the cantilever circuit is positioned completely beyond the projection of the splitting edge of the second sharp splitting wedge on the plane in which the strips are moved, before the second breaking unit applies the second force to the cantilever circuit.

The effect of this extension on the setting is substantially similar to the original setting, for breaking off strips of the substrate and offers significant advantages to the problems. In addition, a coilecting system is provided for the broken strips, such that they are brought into a correct position and discharged to the second crushing unit. This can be done, for example, by a specific shape of the mechanism that moves the strips, which aligns correctly with the edge of the substrate and thus pushes it further at the correct angle. The crushing units are movable along the respective transport directions so that the supports can be adapted to the specific widths / lengths of strips and circuits. Typically, even after breaking a strip / circuit, the crushing units will again remove the substrate / strip that remains,

BE2016 / 5506 in such a way that a next step can be carried out. This is further shown in the figures.

In a further embodiment, the institution further comprises:

i. a first stopper for limiting or avoiding a substantially perpendicular movement of the end of the substrate opposite the protruding strip, perpendicular to the plane of the substrate; and / or

j. a second stopper for limiting or avoiding a substantially perpendicular movement of the strip opposite the protruding circuit, which is perpendicular to the plane of the strip;

wherein the first and / or the second stopper are adapted to respectively move the substrate and / or the strip along the first and / or the second transport direction, respectively, towards the first and / or the second crushing unit.

The presence of these stoppers serve firstly to enhance the effect of the pistons, namely to just immobilize the substrates / strips when they are in first / second position. These can limit the movement of the substrate / strip perpendicular to its plane by a specific shape of the stopper, for example by an already discussed overhang of the stopper (see also figures). On the other hand, this stopper is also used as a pushing device for the substrate / strip. In this way it is also ensured that the stopper can perform the first operation (preventing movement) during the movement of the substrate / strip. Since it is a simple pushing of the substrate / strip, a true clamping is no longer necessary, as is often used in the known systems, which reduces the risk of breakage.

In a fourth aspect, the invention relates to an institution for breaking off loss edges of a substrate, wherein the loss edges are separated from at least one side of the substrate by pre-applied attenuated fracture lines, comprising:

a. a holding system for holding the substrate, preferably centers! and / or on one side of the substrate where no electronic components are present, comprising one or more pistons, preferably vacuum pads, the one or more pistons being adapted to follow a curvature of the plane of the substrate when holding the substrate.

BE2016 / 5506

b. at least one break system, comprising a movable clamp, preferably a movable vise, with two jaws for gripping a loss edge of the substrate with the jaws on both sides, the movable clamp being pivotable about a pivot axis on a support of the breaking system the pivot axis is attached at a maximum distance of 0.5 cm, preferably 0.25 cm, more preferably 0.1 cm, from an extremity. end of one of the jaws, and still more preferably wherein the pivot axis substantially coincides with the fracture line of the clamped loss edge.

The Applicant noted that before breaking off a loss edge of a substrate, better results were obtained by operating with a separate setting for this purpose. This ensures, among other things, that the set-up does not always have to be adjusted to cope with different situations, but is also more focused on the case where one of the edges no longer has to be treated with a same circumference as when singling switches. among themselves (or strips). By clamping the top and bottom of the loss edge with a jaw, it is possible to break it off more correctly, (almost) perfectly along the fracture line of the loss edge. This is possible by coinciding the axis around which the force moment is applied to the loss edge to coincide with the fracture line. In addition, care is taken that the clamping jaws cover the loss edge as completely as possible and thus ensure that the entire loss edge is cracked from the rest of the substrate. This is accomplished by adjusting the clamping jaw breaking system so that it is pivotable around an adjustable axis.

Optionally, the jaws can be adjusted to engage the loss edge only over part of the length of the loss edge (distance along the breakline of the loss edge), to apply force to the loss edge adapted to the curvature at an appropriate location of the substrate. Possibilities for this are jaws that engage one or more of the ends of the loss edge along the length direction, or centers along the length direction. Alternatively, intermittent engagements can also be provided, for example over the extension of fracture lines perpendicular to the fracture line of the loss edge in question. In addition, the breaking system can also be provided with a stational (relative to the pivotable jaws) support element which extends under (depending on the direction of rotation) the substrate away from the loss edge (preferably under breaking lines perpendicular to the break line of the loss edge) which counterforce forms on the substrate, so that a human breaking movement is even better imitated, and so there is both a force

BE2016 / 5506 is exerted as close as possible to the breakline of the edge of the loss, on the edge of the edge, but a counterforce is also exerted on the substrate by this stationary support element, again preferably also as close as possible to the edge of the edge of the loss.

In a fifth aspect, the invention relates to a system for singulating electronic circuits from Loss Edge Substrates, comprising:

a. A setting for breaking off the edges of the substrate's edges as described in this document;

b. a transport system for transferring the debris-depleted Substrates from the substrate for breaking off debris from the substrate to the electronic circuit singling circuitry;

c. an arrangement for singulating electronic circuits from Substrates as described herein.

The system combines the advantageous aspects of the previously described settings (and the previously described methods), in order to address the probability of the known defective singulation systems, namely that these often overload the Substrates and thus to fractures and unusable circuits lead.

In a sixth aspect, the invention relates to an electronic circuit singulated from a substrate, according to a method described in this document, preferably wherein the singulation is performed with a system as described in this document.

Substrates treated according to the methods and / or Systems according to the invention are statistically more efficiently regulated than techniques and systems of the prior art allow, and thus lead to a lower production cost, a more economised use of raw materials and also to less danger that circuits only experience breaks during use due to prior loads during production, which, among other things, lead to micro-cracks, which can further develop into fatal damage during use of the circuits.

The foregoing implicitly also includes combinations of several of the described steps / parts of methods / settings

BE2016 / 5506

In what follows, the invention is described by means of non-limiting examples which illustrate the invention, and which are not intended or are to be interpreted to limit the scope of the invention.

EXAMPLES

EXAMPLE 1:

In the first example, a setting, illustrated in Figures 1, 6A, 6B and 7, for singulating strips and circuits of a substrate (1) is described. The Substrates typically comprise a ceramic wafer or support (2) with a metal layer (3) on either side or on either side. This metal layer (3) is usually processed and / or provided with power components. In addition, the Substrates are already pre-divided into separate circuits which are arranged in strips (columns and rows), the individual circuits being separated from one another by so-called weakened fault lines (including element 4 in the figures) in the ceramic support (2). breaking along the fracture line (4) simplifies and allows automatic and manual singling.

The device or institution includes a first conveying system that can move the substrate (1) in a plane parallel to the substrate along the first conveying direction (parallel to the fracture lines of the first set). In the embodiment of the figures 2, this first conveying system comprises conductive pockets or guides (11) over which the substrate (1) can slide and is supported by it. Furthermore, the first transport system comprises a first push hero (10) which is suitable for moving a substrate (1) resting on the guides (11) along the first transport direction (X axis) by pushing it forward (and also along it this first transport direction, the X-axis). Providing a sufficiently smooth surface for the geysers (11) ensures that no damage can occur to the Substrates. Furthermore, the first conveying system comprises one or more pistons (12) adapted to follow the curvature of the bottom of the substrate (1) (e.g. by some flexibility in the attachment of the pistons (12) and / or by a flexible fabric to be used for the pistons / suction cups). These pistons (12) engage the substrate (1) once it reaches a first position, which will be explained further below, and immobilize the substrate.

The setting further includes a first sharp splitting wedge (5 or 14) for breaking a protruding strip (20) from the substrate (1). The substrate (1) is slid further along the guides (11) until one strip (20) protrudes beyond the first splitting wedge (5 or 14) (or the projection thereof onto the bottom of the substrate) and so on

BE2016 / 5506 lands in the first position. This 'first position' means that the breakline (4) of the second set of the protruding strip (20) lies along the top splitting edge of the first splitting wedge (5 or 14), and preferably slightly beyond (thus slightly more yields a fully protruding strip). This first splitting wedge (5 or 14) (or at least the top yield thereof) is typically a short distance from the square in which the substrate (1) is moved.

As soon as the substrate (1) is immobilized in the first position, a first breaking unit (13) is activated. This provides a first force on the substrate, and more precisely on the cantilever strip (20) (preferably as distal as possible with respect to the first splitting wedge (5 or 14) for maximum torque, and to provide a ceramic portion of the cantilever strip (20)). The force is directed to the plane of the substrate (1) and towards the side of the substrate to which the first splitting wedge (5 or 14) is located. This can, for example, be controlled by the breaking unit (13) towards the protruding strip (20) and further, thus exerting force on the protruding strip (20). in the case of the example as in Figure 7, this is a downward movement along the Z axis.

In this way the protruding strip (20) is broken off along the fault line (4) (of the second set) in its entirety and ends up on a slightly lower coil coiling system. Once the strip has broken off, the first breaking unit (13) preferably retracts, and a second conveying system is used which advances the strip in a plane parallel to that of the strip, and along a second conveying direction (Y axis) which is substantially perpendicular Stands on the fault lines of the first set on the received strip. This second transport system moves the broken strip further with a second pushing unit (15) along a second guide (16) to a second position, after which the strip is immobilized, preferably again with a second piston or pair of pistons (18). The second transport system functions largely similar to the first, the versions are thus also quite cheerful and will not be discussed in more detail, but are considered as a logical continuation of what was described above of the invention, certainly for an expert in net ve, Also the second position is similar to the first position, being the position where the strip has a cantilever circuit with the breakline of the first set of the cantilever circuit just (about 0.1 mm to 0.8 mm, preferably about 0.6 mm) beyond the perpendicular projection of the second sharp splitting wedge (17) on the plane of the strip. Then, the second breaking unit (19) acts with similar operation as the first breaking unit (19), and the cantilever circuit breaks off along the break line of the first set of the cantilever circuit. Once the strip has been mingled in circuits (or already during), it occurs

BE2016 / 5506 first transport system back in operation to propel the substrate (1) and bring a new cantilever strip into first position, and start the first crushing process again,

The embodiment further comprises a first and a second stopper (21), which are part of the first and second pushing unit (15). By providing these pushing units with a stopper (21) in the form of an overhanging protrusion (21) as seen in the figures, the rotation of the substrate (1) or the strip is prevented when the first or second force is applied since the pushing unit (10 and / or 15) always moves with the pushed substrate or strip. This is mainly an additional measure! As an assurance, the pistons may not or imperviously immobilize the substrate (1) or strip upon the action of the first or second force. The overhanging projection (21) should preferably be quite dense (0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, 1.2 mm, 1.4 mm, 1.6 mm, 1.8 mm, 2 mm, ...) with a strip to prevent movement of the substrate or strip as early as possible.

EXAMPLE 2:

In this example, illustrated in Figures 2, 4, 5A and 5B, an arrangement is described for breaking down so-called loss edges (9) of a substrate (1). These concern fairly narrow edges which have already been weakened in advance along straight pre-arranged fracture lines (4). Because of the narrow edges it is often more difficult to apply a force moment (22) to this in an accurate and secure manner for breaking off the edges (9). On the one hand, the arrangement comprises a holding system (7) for holding the substrate (1). This is done practically by one or more pistons (7) which engage the substrate (1) approximately centrally at one or more locations on one side of the substrate without components, by creating an underpressure. Again the pistons (7) are adapted to follow a curvature of the plane of the substrate (1).

In addition, the arrangement comprises at least one breaking system, preferably two breaking systems. These breaking systems are adapted to grip the extension edges (9) of the substrate (1). In practice, two loss edges (9) will often be gripped at opposite edges of the substrate (1) and then break them down. The break systems include a movable and adjustable clamp (6) attached to a support relative to the holding system, the clamp (6) preferably resembling a vise (or the principle flexes), This clamp (6) includes two jaws ( 6a, 6b) which can engage the substrate (1) on either side of a loss edge (9). For this reason, the jaws (6a, 6b) are also preferred

BE2016 / 5506 endeding can be adjusted (both towards and from each other, as well as along each other), including for adaptations tailored to a specific circuit. The clamp (6) is pivotable about a pivot axis (8) arranged relative to the substrate (1) such that the pivot axis (8) coincides with the score line (4) of the clamped loss edge (9). By then rotating the seed (6) around the pivot axis (8), a moment of force (22) is applied to the loss edge (9) and it is then completely broken off, since the pistons (7) rest the substrate ( 1) keep it substantially in place. The setting for breaking off loss edges (9) can be adjusted to perform this simultaneously on all edges, 3 or 2 at a time, or to perform this edge by edge. Note that in the example, the pivot axis (8) is not a physical axis, but a virtual axis.

It is believed that the present invention is not limited to the embodiments described above and that some modifications or changes to the described examples can be added without revaluating the added claims. For example, the present invention has been described with reference to Substrates, but it is to be understood that the invention may be applied to e.g. specific products such as direct bonded copper Substrates (DBC substrates), but also others.

BE2016 / 5506

Claims (14)

CONCLUSIONS A method of singling electronic circuits from a substrate, the substrate comprising a first set of pre-applied attenuated breaklines and a second set of pre-applied attenuated breaklines, wherein the first set and the second set are substantially perpendicular to each other, comprising the following to step: a. Parallel to the fracture lines of the first set of advancing a substrate past a first sharp splitting wedge located on an opposite side of the substrate from the fracture lines, advancing the substrate to a first position with an extrema fracture line of the second set of fracture lines beyond and substantially parallel to a projection of the first sharp splice wedge is perpendicular to the substrate, and an extrema strip of the substrate is fully protruding from the first sharp splice wedge; b. immobilizing the substrate upon reaching the first position and before breaking off the cantilever strip, by means of one or more pistons, preferably flexible vacuum pads, which grip a non-cantilevered portion of the substrate, whereby a curvature of the bottom of the substrate is introduced; c, breaking off the cantilever strip from the substrate along the extrema fracture line of the second set, by applying a first moment of force to the cantilever strip, applying the first moment of force by applying a first force to the cantilever strip, the first force being directed substantially perpendicular to the substrate from the side wear, the break line is applied to the opposite side, preferably the second force being applied to a ceramic portion of the protruding strip, and the first sharp splitting wedge serving as the axis for the first moment of strength; d, advancing the broken line of the second set of the broken strip past the second sharp splined wedge located on the opposite side of the broken strip from the broken lines, whereby the broken strip is advanced to a second position at which extrema breakline of the first set of breaklines of the strip beyond and substantially parallel to a projection of the second sharp splice wedge perpendicular to the substrate, and wherein an extrema electronic circuit of the BE2016 / 5506 stripped strip is fully protruding from the second sharp splitting wedge; e. immobilizing the broken strip upon reaching the second position and before breaking off the cantilever circuit, by middle! of one or more pistons, preferably flexible vacuum pads, which engages in suction on a non-cantilevered part of the broken strip, whereby a curvature of the surface of the broken strip is applied; f. breaking off the cantilever circuit from the strip along the extremal break line of the first set, by applying a second moment of force to the cantilever circuit, applying the second moment of force by applying a second force to the cantilever circuit, the second force substantial! is oriented perpendicular to the strip from the side where the break line is applied to the opposite side, preferably with the second force applied to a ceramic portion of the cantilever circuit, and the second sharp splitting wedge serving as the shaft for the second moment of force. The method of claim 1, wherein the extrema breakline of the first set in the first position is a maximum distance of 0.2.5 cm, preferably 0.1 cm, even more preferably 0.06 cm, from the projection of the first sharp splitting wedge is removed, and wherein the extrema breakline of the second set is in the second position a maximum distance of 0.25 cm, preferably 0.1 cm, even more preferably 0.06 cm, from the projection of the second sharp splitting wedge . A method according to any one of the preceding claims 1 to 2, wherein the substrate comprises one or more degradable loss edges separated from the rest of the substrate by attenuated fracture lines pre-applied on at least one side, comprising the following steps: a. immobilizing the substrate by means of! one or more pistons, preferably flexible vacuum pads, which grip the substrate in a suction manner, whereby a curvature of the surface of the substrate is introduced; b. the clamping gripping of the substrate on at least one edge of the substrate, of which at least one of the gripping edges is a BE2016 / 5506 is a degradable loss edge, preferably wherein the clamping gripping is adapted to a curvature of the plane of the grippable loss edge; c. breaking off the sprouted degradable loss edge by applying a moment of force to the sprouted degradable loss edge, the moment of force being applied about an axis at a maximum distance of 0.25 cm, preferably from 0.1 cm, even more preferably from 0.06 cm, to the fracture line of the sprouted degradable loss edge. Method according to one of the preceding claims 1 to 3, comprising the following step after breaking off the protruding strip: a. receiving the broken strip, the broken strip being positioned such that the break lines of the first set of the broken strip are substantially perpendicular to the first sharp splitting wedge; and optionally comprising the following step after aborting the cantilever electronic circuit: b. receiving the aborted circuit. A method according to any one of the preceding claims 1 to 4, wherein the suction gripping of the substrate and / or the strip finds the bottom of the substrate and / or the strip respectively when the substrate and / or the strip above respectively the first sharp splitting wedge and / or the second sharp splitting wedge are in the first position and / or the second position, respectively. A method for fracturing a substrate along a straight, attenuated fracture line pre-applied on one side of the substrate, comprising steps of: a. advancing a substrate along a direction parallel to the substrate and perpendicular to the fracture line, advancing the substrate beyond a sharp splitting wedge located on an opposite side of the substrate from the fracture line, advancing the substrate to a position where the score line is beyond and substantially parallel to a projection of the sharp splitting wedge perpendicular to the substrate, preferably at a maximum distance of 0.25 cm and further BE2016 / 5506 preferred of 0.1 cm, and in which an extreme end of the substrate is fully protruding from the sharp splitting wedge; b. suction-engaging the substrate after advancing the substrate to the position, the substrate being suction-engaging at one or more positions on the substrate, and the suction-engaging of the substrate being adapted to a curvature of the surface of the substrate to convey c. breaking off the cantilevering end of the substrate along the fracture line, by applying a moment of force to the cantilevering end, applying the momentum of force by applying a force to the cantilevering end, the force being directed substantially perpendicular to the substrate from the side where the break line is applied to the other side, and where the sharp splitting wedge serves as the axis for the moment of force. A method according to the preceding claim 6, wherein the force is applied to an edge of the substrate, preferably to a ceramic part of the substrate. A method according to the preceding claim 7, wherein a rotating action of the substrate about an axis parallel to the fracture line is substantially limited and / or prevented by limiting movement of an opposite edge of the substrate relative to the edge at which the force is applied, limiting movement of the other edge is performed on the side of the substrate where the break line is applied. An institution for singulating electronic circuits from Substrates, the Substrates comprising a first set of pre-applied attenuated fracture lines and a second set of pre-applied attenuated break lines, wherein the first set and the second set are substantially perpendicular to each other, comprising: a. a first transport system for the controlled movement of a substrate in a plane parallel to the substrate and along a first transport direction parallel to the fracture lines of the first set, wherein the first transport system comprises one or more pistons adapted for suction engagement and immobilizing the substrate, preferably on a non-component side BE2016 / 5506 of the substrate, and wherein the pistons are adapted to follow a curvature of the plane of the substrate when gripping and immobilizing the substrate; b. a first sharp splitting wedge over which protruding strips of the substrate are broken off successively along the fracture lines of the second set, the first sharp splitting wedge being downward along the first conveying direction and below the plane in which the Substrates are moved, the first sharp splitting wedge having a splitting edge which is substantially parallel to the plane in which the Substrates are moved and is substantially perpendicular to the first conveying direction, and the splitting edge is preferably at a maximum distance of 0.5 cm, preferably 0.25 cm, further preferably 0.1 cm, to the plane in which the Substrates are moved; and c. a first crushing unit for applying a first force to a protruding strip of the immobilized substrate and breaking off the protruding strip from the immobilized substrate, the first crushing unit adapted to apply the first force to the protruding strip when the protruding strip strip completely beyond a projection of the splitting edge of the first sharp splitting wedge is positioned perpendicular to the plane in which the Substrates are moved, the first force being substantially perpendicular to the plane of the substrate and oriented from top to bottom relative to the substrate, preferably wherein the first force is applied to an extremity of the protruding strip, further preferably to a ceramic portion of the extremity of the protruding strip; the one or more pistons of the first conveying system being adapted to grip and immobilize the substrate in a suction manner when the cantilever strip is positioned completely beyond the projection of the splitting edge of the first sharp splitting wedge on the plane in which the Substrates are moved, before the first crushing unit applies the first force to the cantilever strip. An apparatus for swinging electronic circuits from substrates according to the preceding claim 9, further comprising: BE2016 / 5506 d. a collection system for collecting broken strips from the Substrates, preferably wherein the collection system comprises one or more pistons for sucking gripping of the broken strips; e. a second conveying system for the controlled displacement of a collected strip in a flat parallel to the collected strip and along a second conveying direction substantially perpendicular to the fault lines of the first set on the collected strip, the second conveying system comprising one or more pistons for suctioning engaging and immobilizing the collected strip, preferably on a non-component side of the collected strip, and the pistons adapted to accommodate a curvature of the received strip's grip upon gripping and immobilizing the collected strip, preferably wherein the one or more pistons of the second transport system form part of the one or more pistons of the collection system; f. a second sharp splitting wedge over which protruding switches of the strip are broken off successively along the fracture lines of the first set, the second sharp splitting wedge being downward along the second direction of transport and under the plane in which the strips are moved, the second sharp splitting wedge having a splitting edge which is substantially parallel to the plane in which the strips are moved and is perpendicular to the second conveying direction, and the splitting edge is preferably at a maximum distance of 0.5 cm, preferably 0.2.5 cm, more preferably of 0.1 cm, until just where the strips are moved; g. a second breaking unit for applying a second force to a cantilevering circuit of the immobilized strip and breaking off the cantilevering circuit of the immobilized strip, the second breaking unit being adapted to apply the second force to the cantilevering circuit when the cantilevering circuit is fully positioned beyond a projection of the splitting edge of the second sharp splitting wedge perpendicular to the plane in which the strips are moved, the second force being substantially perpendicular to the strip's plane and directed from top to bottom relative to the strip, preferably the second force being applied to an extreme mowing end of the protruding circuit, with further BE2016 / 5506 preferred on a ceramic part of the extrema! end of the cantilevering circuit; and h. optionee! a second colection system for just receiving and transmitting broken circuits of the strips, preferably wherein the second collation system comprises one or more pistons for sucking engagement of the broken circuits; the one or more pistons of the second conveying system adapted to suction-engage and immobilize the strip when the cantilevering circuit is positioned completely beyond the projection of the splitting edge of the second sharp splitting wedge on the plane in which the strips are moved, before the second breaking unit exerts the second force on the cantilevering circuit. The arrangement for singulating electronic circuits from Substrates according to any of the preceding claims 9 or 10, further comprising: i. a first stopper for limiting or avoiding a substantially perpendicular movement of the end of the substrate opposite the protruding strip, perpendicular to the plane of the substrate; and / or j. a second stopper for limiting or avoiding a substantially perpendicular movement of the end of the strip relative to the protruding circuit standing perpendicular to the strip; wherein the first and / or the second stopper are adapted to advance the substrate and / or the strip, respectively, along the first and / or the second transport direction, respectively, towards the first and / or the second crushing unit. 12. Device for just breaking off loss edges of a substrate, wherein the loss edges are separated from at least one side of the substrate by pre-applied attenuated fracture lines, comprising: a holding system for holding the substrate, preferably centrally and / or on one side of the substrate where no electronic components are present, comprising one or more pistons, preferably vacuum pads, the one or more pistons being adapted to monitor a curvature of the substrate's plane when holding the substrate. BE2016 / 5506 b. at least one breaking system, comprising a movable core, preferably a movable vise, with two jaws for gripping a clamped loss edge of the substrate with the jaws on both sides, the movable core pivoting about a pivot axis on a support of the fracture system is attached, the pivot axis being at a maximum distance of 0.5 cm, preferably 0.25 cm, more preferably 0.1 cm, from an extremity of one of the jaws, and still more preferably with the pivot axis substantially coincides with the fracture line of the clamped loss edge. 13. System for singulating electronic circuits ult Substrates with loss edges, comprising: a. A setting for breaking down loss edges of a substrate according to the preceding claim 12; b. a transport system for transferring the debris-depleted Substrates from the decomposition decomposition substrate to the electronic circuit singling circuitry of the Substrates; c. an institution for singulating electronic circuits from substrates according to any one of the preceding claims 9 to 11. Electronic circuitry singulated from a substrate, by a method according to any one of the preceding claims 1 to 5, preferably wherein the singulation is performed with a system according to the preceding claim 13. BE2016 / 5506 Automated system for swinging circuits from DBC-SURSTRATES, and method for this