AU7977700A - Method for electrodeposition of metallic multilayers - Google Patents

Method for electrodeposition of metallic multilayers

Info

Publication number
AU7977700A
AU7977700A AU79777/00A AU7977700A AU7977700A AU 7977700 A AU7977700 A AU 7977700A AU 79777/00 A AU79777/00 A AU 79777/00A AU 7977700 A AU7977700 A AU 7977700A AU 7977700 A AU7977700 A AU 7977700A
Authority
AU
Australia
Prior art keywords
electrodeposition
metallic multilayers
multilayers
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU79777/00A
Inventor
Sima Valizadeh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RESEARCH INSTITUTE ACREO AB
Original Assignee
RES INST ACREO AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RES INST ACREO AB filed Critical RES INST ACREO AB
Publication of AU7977700A publication Critical patent/AU7977700A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AU79777/00A 1999-09-30 2000-10-02 Method for electrodeposition of metallic multilayers Abandoned AU7977700A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9903531 1999-09-30
SE9903531A SE9903531D0 (en) 1999-09-30 1999-09-30 Method for electro-deposition of metallic multi-layers
PCT/SE2000/001902 WO2001023645A1 (en) 1999-09-30 2000-10-02 Method for electrodeposition of metallic multilayers

Publications (1)

Publication Number Publication Date
AU7977700A true AU7977700A (en) 2001-04-30

Family

ID=20417206

Family Applications (1)

Application Number Title Priority Date Filing Date
AU79777/00A Abandoned AU7977700A (en) 1999-09-30 2000-10-02 Method for electrodeposition of metallic multilayers

Country Status (8)

Country Link
EP (1) EP1230443A1 (en)
JP (1) JP2003510465A (en)
KR (1) KR20020042680A (en)
CN (1) CN1376214A (en)
AU (1) AU7977700A (en)
CA (1) CA2382481A1 (en)
SE (1) SE9903531D0 (en)
WO (1) WO2001023645A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002093140A1 (en) * 2001-05-14 2002-11-21 Johns Hopkins University Multifunctional magnetic nanowires
CN1896337B (en) * 2006-06-16 2010-05-12 南京航空航天大学 Full-automatic fluid system microreactor for electrodeposition coded nano-line
KR100848689B1 (en) * 2006-11-01 2008-07-28 고려대학교 산학협력단 Method of Manufacturing Multilayered Nanowires and Nanowires thereof
US7736753B2 (en) * 2007-01-05 2010-06-15 International Business Machines Corporation Formation of nanostructures comprising compositionally modulated ferromagnetic layers by pulsed ECD
CN103906863A (en) * 2011-08-02 2014-07-02 麻省理工学院 Tuning nano-scale grain size distribution in multilayered alloys electrodeposited using ionic solutions, including a1-mn and similar alloys
JP5025815B1 (en) * 2011-08-10 2012-09-12 小島化学薬品株式会社 Hard gold plating solution
WO2015065150A1 (en) * 2013-11-04 2015-05-07 서울시립대학교 산학협력단 Method for forming multilayer-plated thin film using alloy plating liquid and pulse current
JP6422658B2 (en) * 2014-02-27 2018-11-14 新光電気工業株式会社 Electroplating bath and electroplating method
KR101713016B1 (en) * 2015-07-24 2017-03-07 덕산하이메탈(주) Manufacturing method of sheet with exothermic and amorphous characteristics by plating
KR101776149B1 (en) * 2015-07-24 2017-09-08 덕산하이메탈(주) Plating apparatus and plating method for alloy with exothermic and amorphous characteristics plating
WO2017039402A1 (en) * 2015-09-02 2017-03-09 단국대학교 천안캠퍼스 산학협력단 Method for producing alloy thin films of various compositions by means of electroforming
KR101837440B1 (en) 2016-05-02 2018-03-09 한국과학기술연구원 Metal nanolaminates and manufacturing method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE743946A (en) * 1969-01-07 1970-05-28
US4108739A (en) * 1973-09-04 1978-08-22 Fuji Photo Film Co., Ltd. Plating method for memory elements
JPS55164092A (en) * 1979-06-08 1980-12-20 Sony Corp Noncrystalline alloy-plated layer and its manufacture
IL76592A (en) * 1985-10-06 1989-03-31 Technion Res & Dev Foundation Method for electrodeposition of at least two metals from a single solution
US4795534A (en) * 1986-09-25 1989-01-03 Vanguard Research Associates, Inc. Electrolyte solution and process for gold electroplating
JPH0270084A (en) * 1988-09-06 1990-03-08 C Uyemura & Co Ltd Gold plating bath and gold plating method
JP3102505B2 (en) * 1991-07-18 2000-10-23 ティーディーケイ株式会社 Method for manufacturing soft magnetic multilayer plating film, soft magnetic multilayer plating film, and magnetic head

Also Published As

Publication number Publication date
CA2382481A1 (en) 2001-04-05
KR20020042680A (en) 2002-06-05
SE9903531D0 (en) 1999-09-30
JP2003510465A (en) 2003-03-18
WO2001023645A1 (en) 2001-04-05
CN1376214A (en) 2002-10-23
EP1230443A1 (en) 2002-08-14

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase