AU6109501A - Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning - Google Patents

Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning

Info

Publication number
AU6109501A
AU6109501A AU6109501A AU6109501A AU6109501A AU 6109501 A AU6109501 A AU 6109501A AU 6109501 A AU6109501 A AU 6109501A AU 6109501 A AU6109501 A AU 6109501A AU 6109501 A AU6109501 A AU 6109501A
Authority
AU
Australia
Prior art keywords
predetermined
symmetrically balanced
electrodes
complementary
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
AU6109501A
Inventor
Anthony A Anthony
William M Anthony
James P Muccioli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
X2Y Attenuators LLC
Original Assignee
X2Y Attenuators LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by X2Y Attenuators LLC filed Critical X2Y Attenuators LLC
Publication of AU6109501A publication Critical patent/AU6109501A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
AU6109501A 2000-04-28 2001-04-30 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning Pending AU6109501A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US20032700P 2000-04-28 2000-04-28
US21531400P 2000-06-30 2000-06-30
US22549500P 2000-08-15 2000-08-15
US25581800P 2000-12-15 2000-12-15
PCT/US2001/013911 WO2001084581A2 (en) 2000-04-28 2001-04-30 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning

Publications (1)

Publication Number Publication Date
AU6109501A true AU6109501A (en) 2001-11-12

Family

ID=27498375

Family Applications (2)

Application Number Title Priority Date Filing Date
AU6109501A Pending AU6109501A (en) 2000-04-28 2001-04-30 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
AU2001261095A Ceased AU2001261095B2 (en) 2000-04-28 2001-04-30 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning

Family Applications After (1)

Application Number Title Priority Date Filing Date
AU2001261095A Ceased AU2001261095B2 (en) 2000-04-28 2001-04-30 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning

Country Status (8)

Country Link
EP (1) EP1303898A4 (en)
JP (1) JP2004509451A (en)
KR (1) KR100541828B1 (en)
CN (1) CN100367618C (en)
AU (2) AU6109501A (en)
CA (1) CA2413222A1 (en)
IL (1) IL152488A0 (en)
WO (1) WO2001084581A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US7356050B2 (en) 2003-12-17 2008-04-08 Siemens Aktiengesellschaft System for transmission of data on a bus
WO2005065097A2 (en) * 2003-12-22 2005-07-21 X2Y Attenuators, Llc Internally shielded energy conditioner
KR20070107747A (en) 2005-03-01 2007-11-07 엑스2와이 어테뉴에이터스, 엘.엘.씨 Conditioner with coplanar conductors
CN110044253A (en) * 2019-05-27 2019-07-23 中国工程物理研究院电子工程研究所 A kind of micro motor and embedded angle measurement unit

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016411A (en) * 1983-07-08 1985-01-28 株式会社村田製作所 Laminated porcelain condenser
JPS60254608A (en) * 1984-05-30 1985-12-16 株式会社村田製作所 Laminated ceramic condenser
JPH0440265Y2 (en) * 1985-07-15 1992-09-21
JPS62199927A (en) * 1986-02-28 1987-09-03 Taiho Kogyo Co Ltd Control method for supercharger associated with wet clutch
JPH02251120A (en) * 1989-03-24 1990-10-08 Murata Mfg Co Ltd Laminated capacitor
JPH06349666A (en) * 1993-06-02 1994-12-22 Taiyo Yuden Co Ltd Multilayered ceramic capacitor
JPH07263269A (en) * 1994-03-22 1995-10-13 Tdk Corp Laminated ceramic capacitor
JPH07273502A (en) * 1994-03-29 1995-10-20 Murata Mfg Co Ltd Low pass filter
JP3106942B2 (en) * 1995-12-28 2000-11-06 株式会社村田製作所 LC resonance components
JPH09266130A (en) * 1996-03-27 1997-10-07 Taiyo Yuden Co Ltd Multilayer capacitor
JPH10241991A (en) * 1997-02-24 1998-09-11 Taiyo Yuden Co Ltd Laminated capacitor and its trimming method
JPH10270282A (en) * 1997-03-21 1998-10-09 Taiyo Yuden Co Ltd Multilayer ceramic capacitor
JPH11204372A (en) * 1997-11-14 1999-07-30 Murata Mfg Co Ltd Monolithic capacitor
CN1293831A (en) * 1998-01-19 2001-05-02 X2Y衰减器有限公司 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package

Also Published As

Publication number Publication date
EP1303898A4 (en) 2009-06-03
KR100541828B1 (en) 2006-01-10
EP1303898A2 (en) 2003-04-23
IL152488A0 (en) 2003-05-29
CA2413222A1 (en) 2001-11-08
CN1502157A (en) 2004-06-02
WO2001084581A3 (en) 2002-06-27
WO2001084581A2 (en) 2001-11-08
CN100367618C (en) 2008-02-06
JP2004509451A (en) 2004-03-25
AU2001261095B2 (en) 2004-08-19
KR20030085464A (en) 2003-11-05
WO2001084581B1 (en) 2002-08-01

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