AU5699496A - A heatsink and a method and an assembly for forming the same - Google Patents

A heatsink and a method and an assembly for forming the same

Info

Publication number
AU5699496A
AU5699496A AU56994/96A AU5699496A AU5699496A AU 5699496 A AU5699496 A AU 5699496A AU 56994/96 A AU56994/96 A AU 56994/96A AU 5699496 A AU5699496 A AU 5699496A AU 5699496 A AU5699496 A AU 5699496A
Authority
AU
Australia
Prior art keywords
heatsink
assembly
forming
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU56994/96A
Other languages
English (en)
Inventor
Francis Edward Fisher
Robin Douglas Johnson
William Dawson Jordan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermalloy Ltd
Original Assignee
Redpoint Thermalloy Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Redpoint Thermalloy Ltd filed Critical Redpoint Thermalloy Ltd
Publication of AU5699496A publication Critical patent/AU5699496A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU56994/96A 1995-05-16 1996-05-15 A heatsink and a method and an assembly for forming the same Abandoned AU5699496A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9509866 1995-05-16
GBGB9509866.1A GB9509866D0 (en) 1995-05-16 1995-05-16 A heatsink and a method and an assembly for forming the same
PCT/GB1996/001160 WO1996036995A1 (en) 1995-05-16 1996-05-15 A heatsink and a method and an assembly for forming the same

Publications (1)

Publication Number Publication Date
AU5699496A true AU5699496A (en) 1996-11-29

Family

ID=10774528

Family Applications (1)

Application Number Title Priority Date Filing Date
AU56994/96A Abandoned AU5699496A (en) 1995-05-16 1996-05-15 A heatsink and a method and an assembly for forming the same

Country Status (6)

Country Link
EP (1) EP0826240A1 (de)
JP (1) JPH11505373A (de)
KR (1) KR19990014819A (de)
AU (1) AU5699496A (de)
GB (2) GB9509866D0 (de)
WO (1) WO1996036995A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19700432A1 (de) * 1997-01-10 1998-07-16 Swg Metallverarbeitung Und Mon Verfahren zum Herstellen von Kühlkörpern sowie nach dem Verfahren hergestellte Kühlkörper
GB2347206A (en) * 1998-12-18 2000-08-30 Alstom Uk Ltd Heatsink assembly
EP1328019A1 (de) * 2002-01-10 2003-07-16 Wen-Chen Wei Kühlkörper mit Lamellen mit Zinken
DE102005007041A1 (de) * 2005-02-15 2006-08-17 Alcan Technology & Management Ag Kühlkörper für Halbleiterbauelemente oder dgl. Einrichtungen sowie Verfahren zu dessen Herstellung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2502472C2 (de) * 1975-01-22 1982-09-02 Siemens AG, 1000 Berlin und 8000 München Kühlkörper für Thyristoren
US4009752A (en) * 1975-02-24 1977-03-01 Honeywell Information Systems Inc. Warp-resistant heat sink
GB8700842D0 (en) * 1987-01-15 1987-02-18 Marston Palmer Ltd Heat sink
DE3703873A1 (de) * 1987-02-07 1988-08-18 Sueddeutsche Kuehler Behr Kuehlkoerper, insbesondere zum kuehlen elektronischer bauelemente
JP3122173B2 (ja) * 1990-11-09 2001-01-09 株式会社東芝 放熱器、放熱装置および放熱器の製造方法
US5311928A (en) * 1993-06-28 1994-05-17 Marton Louis L Heat dissipator

Also Published As

Publication number Publication date
GB2300975A (en) 1996-11-20
JPH11505373A (ja) 1999-05-18
WO1996036995A1 (en) 1996-11-21
EP0826240A1 (de) 1998-03-04
GB9509866D0 (en) 1995-07-12
GB9610170D0 (en) 1996-07-24
KR19990014819A (ko) 1999-02-25

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