AU5768696A - A heatsink and a method and an assembly for forming the same - Google Patents

A heatsink and a method and an assembly for forming the same

Info

Publication number
AU5768696A
AU5768696A AU57686/96A AU5768696A AU5768696A AU 5768696 A AU5768696 A AU 5768696A AU 57686/96 A AU57686/96 A AU 57686/96A AU 5768696 A AU5768696 A AU 5768696A AU 5768696 A AU5768696 A AU 5768696A
Authority
AU
Australia
Prior art keywords
heatsink
assembly
forming
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU57686/96A
Inventor
Francis Edward Fisher
Robin Douglas Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermalloy Ltd
Original Assignee
Redpoint Thermalloy Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Redpoint Thermalloy Ltd filed Critical Redpoint Thermalloy Ltd
Publication of AU5768696A publication Critical patent/AU5768696A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU57686/96A 1995-05-16 1996-05-15 A heatsink and a method and an assembly for forming the same Abandoned AU5768696A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9509863A GB2300974B (en) 1995-05-16 1995-05-16 A heatsink and a method of forming the same
GB9509863 1995-05-16
PCT/GB1996/001159 WO1996036994A1 (en) 1995-05-16 1996-05-15 A heatsink and a method and an assembly for forming the same

Publications (1)

Publication Number Publication Date
AU5768696A true AU5768696A (en) 1996-11-29

Family

ID=10774526

Family Applications (1)

Application Number Title Priority Date Filing Date
AU57686/96A Abandoned AU5768696A (en) 1995-05-16 1996-05-15 A heatsink and a method and an assembly for forming the same

Country Status (7)

Country Link
EP (1) EP0826239A1 (en)
JP (1) JPH11505372A (en)
KR (1) KR19990014818A (en)
CN (1) CN1184558A (en)
AU (1) AU5768696A (en)
GB (1) GB2300974B (en)
WO (1) WO1996036994A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990050155A (en) * 1997-12-16 1999-07-05 윤종용 Clip Heatsink
EP1328020A1 (en) * 2002-01-10 2003-07-16 Wen-Chen Wei Fin piece structure for heat dissipater
DE102009007612B4 (en) * 2008-02-07 2011-02-17 Optrex Europe Gmbh Heat sink for removing heat from electronic components and method for its production
CN102307456A (en) * 2011-08-31 2012-01-04 昆山锦泰电子器材有限公司 Vertical radiating fin with electronic component
JP6226446B2 (en) * 2012-10-09 2017-11-08 Ａｐｓジャパン株式会社 Heat sink manufacturing method
JP6939068B2 (en) * 2017-05-09 2021-09-22 三菱電機株式会社 How to manufacture heat sinks, lighting fixtures, and heat sinks
CN111589917B (en) * 2020-05-25 2021-03-26 深圳市维鼎精密五金有限公司 Fin structure and stamping processing equipment thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3536960A (en) * 1968-06-26 1970-10-27 Electric Regulator Corp Heat sink module
DE2502472C2 (en) * 1975-01-22 1982-09-02 Siemens AG, 1000 Berlin und 8000 München Heat sink for thyristors
US4009752A (en) * 1975-02-24 1977-03-01 Honeywell Information Systems Inc. Warp-resistant heat sink
US4729426A (en) * 1986-03-06 1988-03-08 Thermalloy Incorporated Bonded clip heat sink
GB8700842D0 (en) * 1987-01-15 1987-02-18 Marston Palmer Ltd Heat sink
DE3703873A1 (en) * 1987-02-07 1988-08-18 Sueddeutsche Kuehler Behr HEAT SINK, ESPECIALLY FOR COOLING ELECTRONIC COMPONENTS
JP3122173B2 (en) * 1990-11-09 2001-01-09 株式会社東芝 Heatsink, heatsink, and method of manufacturing heatsink
US5304735A (en) * 1992-02-14 1994-04-19 Aavid Engineering, Inc. Heat sink for an electronic pin grid array
DE69304304T2 (en) * 1993-04-05 1997-01-02 Sgs Thomson Microelectronics Combination of an electronic semiconductor device and a heat sink
JPH0750494A (en) * 1993-08-06 1995-02-21 Mitsubishi Electric Corp Cooling device

Also Published As

Publication number Publication date
CN1184558A (en) 1998-06-10
KR19990014818A (en) 1999-02-25
WO1996036994A1 (en) 1996-11-21
GB2300974B (en) 1999-12-29
GB9509863D0 (en) 1995-07-12
EP0826239A1 (en) 1998-03-04
JPH11505372A (en) 1999-05-18
GB2300974A (en) 1996-11-20

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