AU5109100A - Apparatus for sealing semiconductor device - Google Patents
Apparatus for sealing semiconductor deviceInfo
- Publication number
- AU5109100A AU5109100A AU51091/00A AU5109100A AU5109100A AU 5109100 A AU5109100 A AU 5109100A AU 51091/00 A AU51091/00 A AU 51091/00A AU 5109100 A AU5109100 A AU 5109100A AU 5109100 A AU5109100 A AU 5109100A
- Authority
- AU
- Australia
- Prior art keywords
- semiconductor device
- sealing semiconductor
- sealing
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000007789 sealing Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000/81282 | 2000-03-23 | ||
JP2000081282 | 2000-03-23 | ||
PCT/JP2000/003817 WO2001071798A1 (en) | 2000-03-23 | 2000-06-12 | Apparatus for sealing semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
AU5109100A true AU5109100A (en) | 2001-10-03 |
Family
ID=18598242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU51091/00A Abandoned AU5109100A (en) | 2000-03-23 | 2000-06-12 | Apparatus for sealing semiconductor device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3646093B2 (en) |
AU (1) | AU5109100A (en) |
WO (1) | WO2001071798A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007311683A (en) * | 2006-05-22 | 2007-11-29 | Matsushita Electric Ind Co Ltd | Sticking method and apparatus therefor |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10261661A (en) * | 1997-03-19 | 1998-09-29 | Toshiba Corp | Underfill filling method and printed wiring board structure |
JP3564980B2 (en) * | 1997-11-28 | 2004-09-15 | 松下電工株式会社 | Semiconductor chip mounting method |
JP3495913B2 (en) * | 1998-05-28 | 2004-02-09 | シャープ株式会社 | Resin sheet for mounting semiconductor devices |
-
2000
- 2000-06-12 AU AU51091/00A patent/AU5109100A/en not_active Abandoned
- 2000-06-12 JP JP2001569879A patent/JP3646093B2/en not_active Expired - Lifetime
- 2000-06-12 WO PCT/JP2000/003817 patent/WO2001071798A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP3646093B2 (en) | 2005-05-11 |
WO2001071798A1 (en) | 2001-09-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |