AU2021101303A4 - Sound insulation pasting board for electrical and electronic devices of vehicle - Google Patents

Sound insulation pasting board for electrical and electronic devices of vehicle Download PDF

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Publication number
AU2021101303A4
AU2021101303A4 AU2021101303A AU2021101303A AU2021101303A4 AU 2021101303 A4 AU2021101303 A4 AU 2021101303A4 AU 2021101303 A AU2021101303 A AU 2021101303A AU 2021101303 A AU2021101303 A AU 2021101303A AU 2021101303 A4 AU2021101303 A4 AU 2021101303A4
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AU
Australia
Prior art keywords
sound insulation
layer
insulation structure
electrical
electronic devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU2021101303A
Inventor
Shaowei Ruan
Weiwei Xu
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Xuzhou University of Technology
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Xuzhou University of Technology
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Filing date
Publication date
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Priority to AU2021101303A priority Critical patent/AU2021101303A4/en
Application granted granted Critical
Publication of AU2021101303A4 publication Critical patent/AU2021101303A4/en
Ceased legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R13/00Elements for body-finishing, identifying, or decorating; Arrangements or adaptations for advertising purposes
    • B60R13/08Insulating elements, e.g. for sound insulation
    • B60R13/0869Insulating elements, e.g. for sound insulation for protecting heat sensitive parts, e.g. electronic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/12Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/18Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R13/00Elements for body-finishing, identifying, or decorating; Arrangements or adaptations for advertising purposes
    • B60R13/08Insulating elements, e.g. for sound insulation
    • B60R13/0884Insulating elements, e.g. for sound insulation for mounting around noise sources, e.g. air blowers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/055 or more layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/02Cellular or porous
    • B32B2305/024Honeycomb
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/02Cellular or porous
    • B32B2305/026Porous
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/10Properties of the layers or laminate having particular acoustical properties
    • B32B2307/102Insulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/56Damping, energy absorption
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The present disclosure discloses a sound insulation pasting board for electrical and electronic devices of a vehicle, including an aluminum alloy outer frame, where an inner side wall of the aluminum alloy outer frame is provided with a heat conduction column, an upper end of the aluminum alloy outer frame is provided with a radiation-proof electromagnetic wave atomic particle filling layer, a lower end of the radiation-proof electromagnetic wave atomic particle filling layer is provided with a heat dissipation hole filling layer, a lower end of the heat dissipation hole filling layer is provided with a shock-proof sponge filling layer, a lower end of the shock-proof sponge filling layer is provided with a sound insulation structure placement layer, and the sound insulation structure placement layer includes a resonant sound insulation structure layer, a porous sound insulation structure layer and a cavity. The sound insulation pasting board according to the present disclosure is simple in structure, ingenious in design and convenient to use. The resonant sound insulation structure layer, the porous sound insulation structure layer and the cavity can effectively insulate sound of the electrical and electronic devices of the vehicle, shock of the electrical and electronic devices of the vehicle can be effectively insulated, and the heat conduction column and the heat dissipation hole filling layer can effectively dissipate heat of the electrical and electronic devices of the vehicle. 1/1 DRAWINGS: 3 \ -1 2 61 63 62 7 6 FIG. 1 1 4 FIG. 2

Description

1/1
DRAWINGS:
3 \ -1
2
61 63 62 7 6
FIG. 1
1
4
FIG. 2
SOUND INSULATION PASTING BOARD FOR ELECTRICAL AND ELECTRONIC DEVICES OF VEHICLE TECHNICAL FIELD
[0001] The present disclosure relates to the technical field of decorative parts for electrical and electronic devices of a vehicle, and in particular, to a sound insulation pasting board for electrical and electronic devices of a vehicle.
BACKGROUND
[0002] General objects have a sound insulation effect, but a board with an average sound insulation (a piece of infinite material is placed between a sound source and a measured point in an infinite space) exceeding 30 dB is referred to as a sound insulation board. Sound insulation boards are generally made of high-density materials. Pasting boards used in electrical and electronic devices of a vehicle often do not have a good sound insulation effect, and cannot dissipate heat and insulate shock of the electrical and electronic devices of the vehicle. In view of the above problems, a sound insulation pasting board for electrical and electronic devices of a vehicle is provided.
SUMMARY
[0003] An objective of the present disclosure is to provide a sound insulation pasting board for electrical and electronic devices of a vehicle to solve the problems in the above background.
[0004] In order to achieve the above objective, the present disclosure provides the following technical solution: A sound insulation pasting board for electrical and electronic devices of a vehicle, including an aluminum alloy outer frame, where an inner side wall of the aluminum alloy outer frame is provided with a heat conduction column, an upper end of the aluminum alloy outer frame is provided with a radiation-proof electromagnetic wave atomic particle filling layer, a lower end of the radiation-proof electromagnetic wave atomic particle filling layer is provided with a heat dissipation hole filling layer, a lower end of the heat dissipation hole filling layer is provided with a shock-proof sponge filling layer, a lower end of the shock-proof sponge filling layer is provided with a sound insulation structure placement layer, the sound insulation structure placement layer includes a resonant sound insulation structure layer, a porous sound insulation structure layer and a cavity, the cavity is located between the resonant sound insulation structure layer and the porous sound insulation structure layer, and a lower end of the sound insulation structure placement layer is provided with an adhesive layer.
[0005] Preferably, heat dissipation holes are uniformly formed in the heat dissipation hole filling layer, and the heat dissipation holes each have a cross-sectional radius greater than 9.2 mm.
[0006] Preferably, the resonant sound insulation structure layer is located outside the porous sound insulation structure layer.
[0007] Preferably, an outer side wall of the aluminum alloy outer frame is provided with sound insulation felt.
[0008] Compared with the prior art, the present disclosure has the following beneficial effects: A sound insulation pasting board for electrical and electronic devices of a vehicle is simple in structure, ingenious in design and convenient to use. A resonant sound insulation structure layer, a porous sound insulation structure layer and a cavity can effectively insulate sound of the electrical and electronic devices of the vehicle, a shock-proof sponge filling layer can effectively insulate shock of the electrical and electronic devices of the vehicle, and a heat conduction column and a heat dissipation hole filling layer can effectively dissipate heat of the electrical and electronic devices of the vehicle.
BRIEF DESCRIPTION OF DRAWINGS
[0009] FIG. 1 is a schematic structural diagram according to the present disclosure; and
[0010] FIG. 2 is a cross-sectional view according to the present disclosure.
[0011] In the drawings: 1. aluminum alloy outer frame, 2. heat conduction column, 3. electromagnetic wave atomic particle filling layer, 4. heat dissipation hole filling layer, 5. shock-proof sponge filling layer, 6. sound insulation structure placement layer, 61. resonant sound insulation structure layer, 62. porous sound insulation structure layer, 63. cavity, 7. adhesive layer, 8. sound insulation felt.
DETAILED DESCRIPTION
[0012] The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are merely some rather than all of the embodiments of the present disclosure. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present disclosure without creative efforts fall within the protection scope of the present disclosure.
[0013] Referring to FIGs. 1-2, this present disclosure provides a technical solution: A sound insulation pasting board for electrical and electronic devices of a vehicle, including an aluminum alloy outer frame 1, where an inner side wall of the aluminum alloy outer frame 1 is provided with a heat conduction column 2, an upper end of the aluminum alloy outer frame 1 is provided with a radiation-proof electromagnetic wave atomic particle filling layer 3, a lower end of the radiation-proof electromagnetic wave atomic particle filling layer 3 is provided with a heat dissipation hole filling layer 4, a lower end of the heat dissipation hole filling layer 4 is provided with a shock-proof sponge filling layer 5, a lower end of the shock-proof sponge filling layer 5 is provided with a sound insulation structure placement layer 6, the sound insulation structure placement layer 6 includes a resonant sound insulation structure layer 61, a porous sound insulation structure layer 62 and a cavity 63, the cavity 63 is located between the resonant sound insulation structure layer 61 and the porous sound insulation structure layer 62, and a lower end of the sound insulation structure placement layer 6 is provided with an adhesive layer 7. The sound insulation pasting board for electrical and electronic devices of a vehicle is simple in structure, ingenious in design and convenient to use. The resonant sound insulation structure layer 61, the porous sound insulation structure layer 62 and the cavity 63 can effectively insulate sound of the electrical and electronic devices of the vehicle, the shock-proof sponge filling layer 5 can effectively insulate shock of the electrical and electronic devices of the vehicle, and the heat conduction column 2 and the heat dissipation hole filling layer 4 can effectively dissipate heat of the electrical and electronic devices of the vehicle.
[0014] Specifically, heat dissipation holes 41 are uniformly formed in the heat dissipation hole filling layer 4, and the heat dissipation holes 41 each have a cross-sectional radius greater than 9.2 mm, which can ensure the heat dissipation efficiency of the sound insulation pasting board for electrical and electronic devices of a vehicle.
[0015] Specifically, the resonant sound insulation structure layer 61 is located outside the porous sound insulation structure layer 62, which enables the sound insulation pasting board for electrical and electronic devices of a vehicle to better insulate sound.
[0016] Specifically, an outer side wall of the aluminum alloy outer frame 1 is provided with sound insulation felt 8, which can increase the sound insulation effect of the sound insulation pasting board for electrical and electronic devices of a vehicle.
[0017] Working principle: In use, the sound insulation pasting board for electrical and electronic devices of a vehicle is pasted to an electrical and electronic device via the adhesive layer 7; the resonant sound insulation structure layer 61, the porous sound insulation structure layer 62 and the cavity 63 can effectively insulate sound of the electrical and electronic device of the vehicle, the shock-proof sponge filling layer 5 can effectively insulate shock of the electrical and electronic device of the vehicle, and the heat conduction column 2 and the heat dissipation hole filling layer 4 can dissipate heat of the electrical and electronic device of the vehicle.
[0018] Although embodiments of the present disclosure have been shown and described, it can be understood by those of ordinary skill in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims and equivalents thereof.

Claims (4)

WHAT IS CLAIMED IS:
1. A sound insulation pasting board for electrical and electronic devices of a vehicle, comprising an aluminum alloy outer frame (1), wherein an inner side wall of the aluminum alloy outer frame (1) is provided with a heat conduction column (2), an upper end of the aluminum alloy outer frame (1) is provided with a radiation-proof electromagnetic wave atomic particle filling layer (3), a lower end of the radiation-proof electromagnetic wave atomic particle filling layer (3) is provided with a heat dissipation hole filling layer (4), a lower end of the heat dissipation hole filling layer (4) is provided with a shock-proof sponge filling layer (5), a lower end of the shock-proof sponge filling layer (5) is provided with a sound insulation structure placement layer (6), the sound insulation structure placement layer (6) comprises a resonant sound insulation structure layer (61), a porous sound insulation structure layer (62) and a cavity (63), the cavity (63) is located between the resonant sound insulation structure layer (61) and the porous sound insulation structure layer (62), and a lower end of the sound insulation structure placement layer (6) is provided with an adhesive layer (7).
2. The sound insulation pasting board for electrical and electronic devices of a vehicle according to claim 1, wherein heat dissipation holes (41) are uniformly formed in the heat dissipation hole filling layer (4), and the heat dissipation holes (41) each have a cross sectional radius greater than 9.2 mm.
3. The sound insulation pasting board for electrical and electronic devices of a vehicle according to claim 1, wherein the resonant sound insulation structure layer (61) is located outside the porous sound insulation structure layer (62).
4. The sound insulation pasting board for electrical and electronic devices of a vehicle according to claim 1, wherein an outer side wall of the aluminum alloy outer frame (1) is provided with sound insulation felt (8).
AU2021101303A 2021-03-12 2021-03-12 Sound insulation pasting board for electrical and electronic devices of vehicle Ceased AU2021101303A4 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2021101303A AU2021101303A4 (en) 2021-03-12 2021-03-12 Sound insulation pasting board for electrical and electronic devices of vehicle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AU2021101303A AU2021101303A4 (en) 2021-03-12 2021-03-12 Sound insulation pasting board for electrical and electronic devices of vehicle

Publications (1)

Publication Number Publication Date
AU2021101303A4 true AU2021101303A4 (en) 2021-07-01

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Country Status (1)

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AU (1) AU2021101303A4 (en)

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MK22 Patent ceased section 143a(d), or expired - non payment of renewal fee or expiry