AU2017323625B2 - Flexible circuit with redundant connection points for ultrasound array - Google Patents
Flexible circuit with redundant connection points for ultrasound array Download PDFInfo
- Publication number
- AU2017323625B2 AU2017323625B2 AU2017323625A AU2017323625A AU2017323625B2 AU 2017323625 B2 AU2017323625 B2 AU 2017323625B2 AU 2017323625 A AU2017323625 A AU 2017323625A AU 2017323625 A AU2017323625 A AU 2017323625A AU 2017323625 B2 AU2017323625 B2 AU 2017323625B2
- Authority
- AU
- Australia
- Prior art keywords
- conductive
- insulating layer
- conductive pads
- pads
- transducer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000002604 ultrasonography Methods 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0207—Driving circuits
- B06B1/0215—Driving circuits for generating pulses, e.g. bursts of oscillations, envelopes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/071—Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
- B06B2201/20—Application to multi-element transducer
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
- H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Signal Processing (AREA)
- Acoustics & Sound (AREA)
- Medical Informatics (AREA)
- General Health & Medical Sciences (AREA)
- Heart & Thoracic Surgery (AREA)
- Radiology & Medical Imaging (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- Biomedical Technology (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Pathology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Biophysics (AREA)
- Gynecology & Obstetrics (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662385806P | 2016-09-09 | 2016-09-09 | |
| US62/385,806 | 2016-09-09 | ||
| PCT/US2017/050768 WO2018049222A1 (en) | 2016-09-09 | 2017-09-08 | Flexible circuit with redundant connection points for ultrasound array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2017323625A1 AU2017323625A1 (en) | 2019-03-28 |
| AU2017323625B2 true AU2017323625B2 (en) | 2022-07-21 |
Family
ID=61558909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2017323625A Ceased AU2017323625B2 (en) | 2016-09-09 | 2017-09-08 | Flexible circuit with redundant connection points for ultrasound array |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10973494B2 (zh) |
| EP (1) | EP3510794A4 (zh) |
| JP (1) | JP7049323B2 (zh) |
| KR (1) | KR102397119B1 (zh) |
| CN (1) | CN109952768B (zh) |
| AU (1) | AU2017323625B2 (zh) |
| CA (1) | CA3035915A1 (zh) |
| RU (1) | RU2751578C2 (zh) |
| WO (1) | WO2018049222A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11596812B2 (en) * | 2018-04-06 | 2023-03-07 | Regents Of The University Of Minnesota | Wearable transcranial dual-mode ultrasound transducers for neuromodulation |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080178677A1 (en) * | 2007-01-30 | 2008-07-31 | Charles Edward Baumgartner | Ultrasound Probe Assembly and Method of Fabrication |
| US20080315331A1 (en) * | 2007-06-25 | 2008-12-25 | Robert Gideon Wodnicki | Ultrasound system with through via interconnect structure |
| US20090034370A1 (en) * | 2007-08-03 | 2009-02-05 | Xiaocong Guo | Diagnostic ultrasound transducer |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6894425B1 (en) * | 1999-03-31 | 2005-05-17 | Koninklijke Philips Electronics N.V. | Two-dimensional ultrasound phased array transducer |
| ATE289223T1 (de) | 1999-07-02 | 2005-03-15 | Prosonic Company Ltd | Gerader oder gekrümmter ultraschallwandler und anschlusstechnik dafür |
| US7288069B2 (en) * | 2000-02-07 | 2007-10-30 | Kabushiki Kaisha Toshiba | Ultrasonic probe and method of manufacturing the same |
| EP1915753B1 (en) * | 2005-08-08 | 2019-04-10 | Koninklijke Philips N.V. | Wide-bandwidth matrix transducer with polyethylene third matching layer |
| KR101151844B1 (ko) * | 2011-01-14 | 2012-06-01 | 경북대학교 산학협력단 | 전도성 흡음층 제조 방법 및 이를 구비하는 2차원 배열 초음파 트랜스듀서 |
| US8836203B2 (en) * | 2012-03-30 | 2014-09-16 | Measurement Specialties, Inc. | Signal return for ultrasonic transducers |
| CA2899311C (en) * | 2013-02-08 | 2021-05-11 | Acutus Medical, Inc. | Expandable catheter assembly with flexible printed circuit board (pcb) electrical pathways |
| JP6147532B2 (ja) * | 2013-03-21 | 2017-06-14 | 東芝メディカルシステムズ株式会社 | 超音波プローブ |
| US9419202B2 (en) * | 2013-06-21 | 2016-08-16 | General Electric Company | Ultrasound transducer and method for manufacturing an ultrasound transducer |
| JP6252280B2 (ja) * | 2014-03-20 | 2017-12-27 | セイコーエプソン株式会社 | 超音波デバイスユニットおよびプローブ並びに電子機器および超音波画像装置 |
| KR102293575B1 (ko) * | 2014-09-04 | 2021-08-26 | 삼성메디슨 주식회사 | 초음파 영상장치용 프로브 및 그 제조방법 |
| JP2016086956A (ja) * | 2014-10-31 | 2016-05-23 | セイコーエプソン株式会社 | 超音波プローブ並びに電子機器および超音波画像装置 |
| KR101685104B1 (ko) * | 2014-11-25 | 2016-12-09 | 주식회사 모다이노칩 | 압전 장치 및 그 제조 방법 |
-
2017
- 2017-09-08 CN CN201780068758.0A patent/CN109952768B/zh active Active
- 2017-09-08 WO PCT/US2017/050768 patent/WO2018049222A1/en unknown
- 2017-09-08 RU RU2019110260A patent/RU2751578C2/ru active
- 2017-09-08 AU AU2017323625A patent/AU2017323625B2/en not_active Ceased
- 2017-09-08 CA CA3035915A patent/CA3035915A1/en active Pending
- 2017-09-08 US US15/699,771 patent/US10973494B2/en active Active
- 2017-09-08 KR KR1020197009990A patent/KR102397119B1/ko active IP Right Grant
- 2017-09-08 EP EP17849652.7A patent/EP3510794A4/en not_active Withdrawn
- 2017-09-08 JP JP2019513798A patent/JP7049323B2/ja active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080178677A1 (en) * | 2007-01-30 | 2008-07-31 | Charles Edward Baumgartner | Ultrasound Probe Assembly and Method of Fabrication |
| US20080315331A1 (en) * | 2007-06-25 | 2008-12-25 | Robert Gideon Wodnicki | Ultrasound system with through via interconnect structure |
| US20090034370A1 (en) * | 2007-08-03 | 2009-02-05 | Xiaocong Guo | Diagnostic ultrasound transducer |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3510794A4 (en) | 2020-04-29 |
| CA3035915A1 (en) | 2018-03-15 |
| EP3510794A1 (en) | 2019-07-17 |
| US10973494B2 (en) | 2021-04-13 |
| JP2019530326A (ja) | 2019-10-17 |
| RU2019110260A (ru) | 2020-10-09 |
| RU2751578C2 (ru) | 2021-07-15 |
| RU2019110260A3 (zh) | 2021-01-15 |
| WO2018049222A1 (en) | 2018-03-15 |
| US20180070920A1 (en) | 2018-03-15 |
| JP7049323B2 (ja) | 2022-04-06 |
| CN109952768B (zh) | 2021-01-08 |
| KR20190040513A (ko) | 2019-04-18 |
| AU2017323625A1 (en) | 2019-03-28 |
| CN109952768A (zh) | 2019-06-28 |
| KR102397119B1 (ko) | 2022-05-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FGA | Letters patent sealed or granted (standard patent) | ||
| MK14 | Patent ceased section 143(a) (annual fees not paid) or expired |