AU2014274823B2 - Computer thermal system - Google Patents

Computer thermal system Download PDF

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Publication number
AU2014274823B2
AU2014274823B2 AU2014274823A AU2014274823A AU2014274823B2 AU 2014274823 B2 AU2014274823 B2 AU 2014274823B2 AU 2014274823 A AU2014274823 A AU 2014274823A AU 2014274823 A AU2014274823 A AU 2014274823A AU 2014274823 B2 AU2014274823 B2 AU 2014274823B2
Authority
AU
Australia
Prior art keywords
airflow
central
housing
air
management system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
AU2014274823A
Other languages
English (en)
Other versions
AU2014274823A1 (en
Inventor
Joshua D. Banko
Jonathan L. BERK
Matthew P. Casebolt
Brett W. Degner
Connor R. Duke
Jesse T. Dybenko
Kevin S. Fetterman
Caitlin Elizabeth KALINOWSKI
Frank F. Liang
David H. Narajowski
Jay S. Nigen
Eric R. Prather
Christopher J. Stringer
Eric J. WEIRSHAUSER
Eugene A. WHANG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apple Inc
Original Assignee
Apple Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apple Inc filed Critical Apple Inc
Publication of AU2014274823A1 publication Critical patent/AU2014274823A1/en
Application granted granted Critical
Publication of AU2014274823B2 publication Critical patent/AU2014274823B2/en
Priority to AU2016204908A priority Critical patent/AU2016204908B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/181Enclosures
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
AU2014274823A 2013-06-07 2014-06-05 Computer thermal system Active AU2014274823B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2016204908A AU2016204908B2 (en) 2013-06-07 2016-07-13 Computer thermal system

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361832633P 2013-06-07 2013-06-07
US61/832,633 2013-06-07
PCT/US2014/041160 WO2014197731A1 (en) 2013-06-07 2014-06-05 Computer thermal system

Related Child Applications (1)

Application Number Title Priority Date Filing Date
AU2016204908A Division AU2016204908B2 (en) 2013-06-07 2016-07-13 Computer thermal system

Publications (2)

Publication Number Publication Date
AU2014274823A1 AU2014274823A1 (en) 2015-12-03
AU2014274823B2 true AU2014274823B2 (en) 2016-04-21

Family

ID=52008596

Family Applications (2)

Application Number Title Priority Date Filing Date
AU2014274823A Active AU2014274823B2 (en) 2013-06-07 2014-06-05 Computer thermal system
AU2016204908A Active AU2016204908B2 (en) 2013-06-07 2016-07-13 Computer thermal system

Family Applications After (1)

Application Number Title Priority Date Filing Date
AU2016204908A Active AU2016204908B2 (en) 2013-06-07 2016-07-13 Computer thermal system

Country Status (7)

Country Link
EP (1) EP3005020B1 (ja)
JP (1) JP6018716B2 (ja)
KR (1) KR101714955B1 (ja)
CN (2) CN104238693B (ja)
AU (2) AU2014274823B2 (ja)
TW (3) TWM513455U (ja)
WO (1) WO2014197731A1 (ja)

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* Cited by examiner, † Cited by third party
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EP3005020B1 (en) * 2013-06-07 2018-05-02 Apple Inc. Computer thermal system
US11899509B2 (en) 2013-06-07 2024-02-13 Apple Inc. Computer housing
US9395772B2 (en) 2013-06-07 2016-07-19 Apple Inc. Computer internal architecture
US10455202B2 (en) 2016-05-13 2019-10-22 Lenovo (Beijing) Co., Ltd. Heat dissipating apparatus and electronic device
CN105848454B (zh) * 2016-05-13 2019-03-29 联想(北京)有限公司 一种散热装置及其散热处理方法、电子设备
CN105916353B (zh) * 2016-05-17 2019-03-08 联想(北京)有限公司 一种散热装置、直立型系统支架、处理设备及电子设备
KR102522375B1 (ko) * 2017-10-16 2023-04-18 삼성전자주식회사 모듈 착탈식 전자 장치
CN111279288A (zh) * 2017-10-30 2020-06-12 瑞典爱立信有限公司 客厅会聚装置
USD914662S1 (en) 2018-02-24 2021-03-30 Telefonaktiebolaget Lm Ericsson (Publ) Electronic device
US10165667B1 (en) * 2018-03-14 2018-12-25 Microsoft Technologies Licensing, LLC Computing system with superconducting and non-superconducting components located on a common substrate
US10900723B2 (en) * 2018-09-17 2021-01-26 Pony Ai Inc. Cover for creating circular airflows inside an enclosure
TWI683508B (zh) * 2018-11-22 2020-01-21 財團法人工業技術研究院 散熱模組及包含此散熱模組之馬達驅動器
CN113366409A (zh) * 2019-01-08 2021-09-07 惠普发展公司,有限责任合伙企业 稳定处理设备的性能
EP3772246A1 (en) * 2019-08-02 2021-02-03 Hamilton Sundstrand Corporation Thermal management device and method of use
KR102335091B1 (ko) 2019-09-26 2021-12-03 구글 엘엘씨 레인지 익스텐더 장치
US11659692B2 (en) * 2019-12-20 2023-05-23 Microsoft Technology Licensing, Llc Rack assembly for vertical airflow cooled devices
USD940672S1 (en) 2020-10-30 2022-01-11 Telefonaktiebolaget Lm Ericsson (Publ) Media hub device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5424915A (en) * 1993-09-20 1995-06-13 Sansha Electric Manufacturing Company, Ltd. Cooling structure for power supply device
US6459577B1 (en) * 2001-07-06 2002-10-01 Apple Computer, Inc. Thermal chimney for a computer

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US6373697B1 (en) * 1999-06-28 2002-04-16 Sun Microsystems, Inc. Computer system housing and configuration
BR0315624A (pt) 2002-10-22 2005-08-23 Jason A Sullivan Sistema de processamento em computador personalizável robusto
EP1420331A1 (en) * 2002-11-14 2004-05-19 Saint Song Corporation Miniature computer and method for heat sink
EP1478020A1 (en) * 2003-05-14 2004-11-17 Thomson Licensing S.A. Streamline heat sink and method for manufacturing the heat sink
WO2006055387A1 (en) * 2004-11-14 2006-05-26 Liebert Corporation Integrated heat exchanger(s) in a rack for vertical board style computer systems
JP4499647B2 (ja) * 2005-10-07 2010-07-07 富士通株式会社 電子機器
JP2007113530A (ja) * 2005-10-21 2007-05-10 Sony Corp 噴流発生装置及び電子機器
US7492590B2 (en) * 2006-12-15 2009-02-17 Hong Fu Jin Pecision Industry (Shenzhen) Co., Ltd. Computer enclosure
ATE518183T1 (de) * 2007-09-07 2011-08-15 Kontron Ag Passiv gekühlter computer
CN201229538Y (zh) * 2008-07-04 2009-04-29 鸿富锦精密工业(深圳)有限公司 电脑机箱
CN201654638U (zh) 2009-11-26 2010-11-24 鸿富锦精密工业(深圳)有限公司 电脑系统
CN102238845B (zh) * 2010-04-23 2014-12-10 昊翔电能运动科技(昆山)有限公司 散热装置及含其的调速器
US20110299239A1 (en) * 2010-06-08 2011-12-08 Ez-Tech Corp (D/B/A Maingear) Computer Case with Upwardly Oriented Add-On Cards and Vertical Airflow
CN102012727A (zh) * 2010-12-20 2011-04-13 东莞市金翔电器设备有限公司 防尘电脑机箱
JP5814001B2 (ja) 2011-06-07 2015-11-17 株式会社アイピーコア研究所 電子機器収容装置
CN102968163B (zh) * 2012-12-13 2015-07-15 天津华锐源科技有限公司 电脑机箱
EP3005020B1 (en) * 2013-06-07 2018-05-02 Apple Inc. Computer thermal system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5424915A (en) * 1993-09-20 1995-06-13 Sansha Electric Manufacturing Company, Ltd. Cooling structure for power supply device
US6459577B1 (en) * 2001-07-06 2002-10-01 Apple Computer, Inc. Thermal chimney for a computer

Also Published As

Publication number Publication date
TWI528153B (zh) 2016-04-01
TWM513455U (zh) 2015-12-01
EP3005020A4 (en) 2017-01-18
KR101714955B1 (ko) 2017-03-09
KR20160007578A (ko) 2016-01-20
AU2016204908B2 (en) 2017-12-07
AU2016204908A1 (en) 2016-08-04
TWM504351U (zh) 2015-07-01
AU2014274823A1 (en) 2015-12-03
CN104238693B (zh) 2018-08-07
TW201510705A (zh) 2015-03-16
CN104238693A (zh) 2014-12-24
EP3005020B1 (en) 2018-05-02
WO2014197731A1 (en) 2014-12-11
JP6018716B2 (ja) 2016-11-02
EP3005020A1 (en) 2016-04-13
CN204189111U (zh) 2015-03-04
JP2016529566A (ja) 2016-09-23

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Legal Events

Date Code Title Description
FGA Letters patent sealed or granted (standard patent)