AU2003299606A1 - Method for aberration detection and measurement - Google Patents

Method for aberration detection and measurement

Info

Publication number
AU2003299606A1
AU2003299606A1 AU2003299606A AU2003299606A AU2003299606A1 AU 2003299606 A1 AU2003299606 A1 AU 2003299606A1 AU 2003299606 A AU2003299606 A AU 2003299606A AU 2003299606 A AU2003299606 A AU 2003299606A AU 2003299606 A1 AU2003299606 A1 AU 2003299606A1
Authority
AU
Australia
Prior art keywords
measurement
aberration detection
aberration
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003299606A
Other languages
English (en)
Inventor
Bruce W. Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2003299606A1 publication Critical patent/AU2003299606A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02—Testing optical properties
    • G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
    • G01M11/0257—Testing optical properties by measuring geometrical properties or aberrations by analyzing the image formed by the object to be tested
    • G01M11/0264—Testing optical properties by measuring geometrical properties or aberrations by analyzing the image formed by the object to be tested by using targets or reference patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement
AU2003299606A 2002-12-13 2003-12-12 Method for aberration detection and measurement Abandoned AU2003299606A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US43315302P 2002-12-13 2002-12-13
US60/433,153 2002-12-13
PCT/US2003/039457 WO2004055472A2 (en) 2002-12-13 2003-12-12 Method for aberration detection and measurement

Publications (1)

Publication Number Publication Date
AU2003299606A1 true AU2003299606A1 (en) 2004-07-09

Family

ID=32595124

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003299606A Abandoned AU2003299606A1 (en) 2002-12-13 2003-12-12 Method for aberration detection and measurement

Country Status (3)

Country Link
US (2) US7136143B2 (US20040174506A1-20040909-M00001.png)
AU (1) AU2003299606A1 (US20040174506A1-20040909-M00001.png)
WO (1) WO2004055472A2 (US20040174506A1-20040909-M00001.png)

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US8139844B2 (en) 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
US8432530B2 (en) * 2008-07-22 2013-04-30 Canon Kabushiki Kaisha Device, method, and system for measuring image profiles produced by an optical lithography system
KR101841897B1 (ko) 2008-07-28 2018-03-23 케이엘에이-텐코어 코오포레이션 웨이퍼 상의 메모리 디바이스 영역에서 검출된 결함들을 분류하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들
US8581190B2 (en) * 2008-09-25 2013-11-12 Hitachi High-Technologies Corporation Charged particle beam apparatus and geometrical aberration measurement method therefor
DE102008061122A1 (de) * 2008-12-09 2010-06-17 Fresenius Medical Care Deutschland Gmbh Verfahren und Vorrichtung zum Ermitteln und/oder Überwachen eines körperlichen Zustandes, insbesondere einer kardiovaskulären Größe, eines Patienten basierend auf einer Amplitude eines Drucksignals
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
JP5581248B2 (ja) * 2011-03-08 2014-08-27 株式会社日立ハイテクノロジーズ 走査電子顕微鏡
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
JP5969848B2 (ja) * 2012-07-19 2016-08-17 キヤノン株式会社 露光装置、調整対象の調整量を求める方法、プログラム及びデバイスの製造方法
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
WO2014149197A1 (en) 2013-02-01 2014-09-25 Kla-Tencor Corporation Detecting defects on a wafer using defect-specific and multi-channel information
US9442384B2 (en) * 2013-03-13 2016-09-13 Taiwan Semiconductor Manufacturing Company, Ltd. Extreme ultraviolet lithography process and mask
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
DE102014210641B4 (de) * 2014-06-04 2020-12-10 Carl Zeiss Ag Testobjekt, Verwendung eines Testobjekts sowie Einrichtung und Verfahren zur Messung der Punktbildfunktion eines optischen Systems
DE102015219330A1 (de) * 2015-10-07 2017-04-13 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zur Strahlanalyse
US10451564B2 (en) 2017-10-27 2019-10-22 Applied Materials, Inc. Empirical detection of lens aberration for diffraction-limited optical system

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Also Published As

Publication number Publication date
US20040174506A1 (en) 2004-09-09
US7136143B2 (en) 2006-11-14
US20070019171A1 (en) 2007-01-25
US7345735B2 (en) 2008-03-18
WO2004055472A2 (en) 2004-07-01
WO2004055472A3 (en) 2004-08-12

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase