AU2003297814A8 - Measuring alignment between a wafer chuck and polishing/plating receptacle - Google Patents

Measuring alignment between a wafer chuck and polishing/plating receptacle

Info

Publication number
AU2003297814A8
AU2003297814A8 AU2003297814A AU2003297814A AU2003297814A8 AU 2003297814 A8 AU2003297814 A8 AU 2003297814A8 AU 2003297814 A AU2003297814 A AU 2003297814A AU 2003297814 A AU2003297814 A AU 2003297814A AU 2003297814 A8 AU2003297814 A8 AU 2003297814A8
Authority
AU
Australia
Prior art keywords
polishing
wafer chuck
measuring alignment
receptacle
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003297814A
Other versions
AU2003297814A1 (en
Inventor
Voha Nuch
Hui Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ACM Research Inc
Original Assignee
ACM Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ACM Research Inc filed Critical ACM Research Inc
Publication of AU2003297814A8 publication Critical patent/AU2003297814A8/en
Publication of AU2003297814A1 publication Critical patent/AU2003297814A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electrodes Of Semiconductors (AREA)
AU2003297814A 2002-12-09 2003-12-09 Measuring alignment between a wafer chuck and polishing/plating receptacle Abandoned AU2003297814A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US43191602P 2002-12-09 2002-12-09
US60/431,916 2002-12-09
PCT/US2003/039221 WO2004053942A2 (en) 2002-12-09 2003-12-09 Measuring alignment between a wafer chuck and polishing/plating receptacle

Publications (2)

Publication Number Publication Date
AU2003297814A8 true AU2003297814A8 (en) 2004-06-30
AU2003297814A1 AU2003297814A1 (en) 2004-06-30

Family

ID=32507823

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003297814A Abandoned AU2003297814A1 (en) 2002-12-09 2003-12-09 Measuring alignment between a wafer chuck and polishing/plating receptacle

Country Status (5)

Country Link
JP (1) JP2006517055A (en)
KR (1) KR101299701B1 (en)
CN (1) CN100514581C (en)
AU (1) AU2003297814A1 (en)
WO (1) WO2004053942A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5281358B2 (en) * 2008-10-27 2013-09-04 学校法人常翔学園 Polymer, transepithelial absorption promoter, and pharmaceutical preparation
CN103590092B (en) * 2012-08-16 2017-05-10 盛美半导体设备（上海）有限公司 Device and method used for electrochemical polishing/electroplating
CN105088328B (en) * 2014-05-07 2018-11-06 盛美半导体设备（上海）有限公司 Electrochemical polish liquid feed device
CN111272089B (en) * 2020-03-03 2022-06-28 中国科学院光电技术研究所 In-situ gap detection device and detection method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140529A (en) * 1986-12-02 1988-06-13 Toshiba Corp Gap controller
JP2547905B2 (en) * 1991-08-30 1996-10-30 株式会社東芝 Axis system abnormality detection device
JP2988168B2 (en) * 1992-12-25 1999-12-06 日立プラント建設株式会社 Automatic piping groove alignment device
JP3800616B2 (en) * 1994-06-27 2006-07-26 株式会社ニコン Target moving device, positioning device, and movable stage device
AU743394B2 (en) * 1997-04-04 2002-01-24 University Of Southern California Article, method, and apparatus for electrochemical fabrication
US6391166B1 (en) * 1998-02-12 2002-05-21 Acm Research, Inc. Plating apparatus and method
US6395152B1 (en) * 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
JP2002193780A (en) 1998-12-22 2002-07-10 Marine Bio Kk Ultraviolet light screening agent
US6586342B1 (en) * 2000-04-25 2003-07-01 Novellus Systems, Inc. Edge bevel removal of copper from silicon wafers
JP2002310153A (en) 2001-04-18 2002-10-23 Meidensha Corp Rotating machine having magnetic bearing

Also Published As

Publication number Publication date
CN101233607A (en) 2008-07-30
JP2006517055A (en) 2006-07-13
WO2004053942A3 (en) 2006-12-07
AU2003297814A1 (en) 2004-06-30
WO2004053942A2 (en) 2004-06-24
KR20050084196A (en) 2005-08-26
KR101299701B1 (en) 2013-08-28
CN100514581C (en) 2009-07-15

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase