AU2003272478A1 - Electrostatic chuck having a low level of particle generation and method of fabricating same - Google Patents

Electrostatic chuck having a low level of particle generation and method of fabricating same

Info

Publication number
AU2003272478A1
AU2003272478A1 AU2003272478A AU2003272478A AU2003272478A1 AU 2003272478 A1 AU2003272478 A1 AU 2003272478A1 AU 2003272478 A AU2003272478 A AU 2003272478A AU 2003272478 A AU2003272478 A AU 2003272478A AU 2003272478 A1 AU2003272478 A1 AU 2003272478A1
Authority
AU
Australia
Prior art keywords
low level
electrostatic chuck
particle generation
fabricating same
fabricating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003272478A
Other languages
English (en)
Inventor
Wendell G. Boyd Jr.
Ho T. Fang
Jose-Antonio Marin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/247,599 external-priority patent/US6894211B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of AU2003272478A1 publication Critical patent/AU2003272478A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
AU2003272478A 2002-09-19 2003-09-18 Electrostatic chuck having a low level of particle generation and method of fabricating same Abandoned AU2003272478A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/247,599 2002-09-19
US10/247,599 US6894211B2 (en) 2001-09-21 2002-09-19 Keyboard apparatus
PCT/US2003/029212 WO2004027839A2 (fr) 2002-09-19 2003-09-18 Mandrin electrostatique a faible niveau de generation de particules, et son procede de fabrication

Publications (1)

Publication Number Publication Date
AU2003272478A1 true AU2003272478A1 (en) 2004-04-08

Family

ID=32028974

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003272478A Abandoned AU2003272478A1 (en) 2002-09-19 2003-09-18 Electrostatic chuck having a low level of particle generation and method of fabricating same

Country Status (4)

Country Link
KR (1) KR20050054950A (fr)
CN (1) CN1685473A (fr)
AU (1) AU2003272478A1 (fr)
WO (1) WO2004027839A2 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100368591C (zh) * 2004-11-19 2008-02-13 上海华虹Nec电子有限公司 一种用于化学气相沉淀装置的电子吸着盘
EP1772901B1 (fr) * 2005-10-07 2012-07-25 Rohm and Haas Electronic Materials, L.L.C. Dispositif support de plaquette semiconductrice et méthode de traitement de semi-conducteurs
JP5295515B2 (ja) 2007-03-30 2013-09-18 東京エレクトロン株式会社 載置台の表面処理方法
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
US7884925B2 (en) * 2008-05-23 2011-02-08 Lam Research Corporation Electrical and optical system and methods for monitoring erosion of electrostatic chuck edge bead materials
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
JP5731485B2 (ja) 2009-05-15 2015-06-10 インテグリス・インコーポレーテッド ポリマー突起を有する静電チャック
KR101731136B1 (ko) 2010-05-28 2017-04-27 엔테그리스, 아이엔씨. 표면저항이 높은 정전 척
CN103140913B (zh) * 2010-10-29 2016-09-28 应用材料公司 用于物理气相沉积腔室的沉积环及静电夹盘
JP6238996B2 (ja) * 2012-11-02 2017-11-29 インテグリス・インコーポレーテッド 光パターン化可能な軟質突出部接触面を有する静電チャック
EP2956960B1 (fr) * 2013-02-13 2023-03-29 Entegris, Inc. Plateau à vide muni de bossages en polymère

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6117246A (en) * 1997-01-31 2000-09-12 Applied Materials, Inc. Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck
TW517265B (en) * 2000-06-23 2003-01-11 Applied Materials Inc Apparatus for supporting a substrate and method of fabricating same

Also Published As

Publication number Publication date
WO2004027839A3 (fr) 2004-05-21
WO2004027839A2 (fr) 2004-04-01
CN1685473A (zh) 2005-10-19
KR20050054950A (ko) 2005-06-10

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase