AU2003268637A1 - Method for processing substrate - Google Patents

Method for processing substrate

Info

Publication number
AU2003268637A1
AU2003268637A1 AU2003268637A AU2003268637A AU2003268637A1 AU 2003268637 A1 AU2003268637 A1 AU 2003268637A1 AU 2003268637 A AU2003268637 A AU 2003268637A AU 2003268637 A AU2003268637 A AU 2003268637A AU 2003268637 A1 AU2003268637 A1 AU 2003268637A1
Authority
AU
Australia
Prior art keywords
processing substrate
substrate
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003268637A
Inventor
Keiichi Enjoji
Mitsuhiro Yuasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2003268637A1 publication Critical patent/AU2003268637A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00896—Temporary protection during separation into individual elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Materials For Photolithography (AREA)
  • Drying Of Semiconductors (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
AU2003268637A 2002-09-11 2003-09-11 Method for processing substrate Abandoned AU2003268637A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002265650A JP2004098245A (en) 2002-09-11 2002-09-11 Substrate treatment method
JP2002/265650 2002-09-11
PCT/JP2003/011627 WO2004024619A1 (en) 2002-09-11 2003-09-11 Method for processing substrate

Publications (1)

Publication Number Publication Date
AU2003268637A1 true AU2003268637A1 (en) 2004-04-30

Family

ID=31986594

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003268637A Abandoned AU2003268637A1 (en) 2002-09-11 2003-09-11 Method for processing substrate

Country Status (3)

Country Link
JP (1) JP2004098245A (en)
AU (1) AU2003268637A1 (en)
WO (1) WO2004024619A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4571870B2 (en) * 2005-02-02 2010-10-27 株式会社ディスコ Exposure equipment
JP4586841B2 (en) * 2007-05-30 2010-11-24 カシオ計算機株式会社 Thin film transistor manufacturing method
JP2015138858A (en) * 2014-01-22 2015-07-30 株式会社ディスコ Wafer processing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3548375B2 (en) * 1997-04-07 2004-07-28 キヤノン株式会社 Coating method and apparatus
JPH11214356A (en) * 1998-01-29 1999-08-06 Sony Corp Dry etching method of silicon board
JPH11243080A (en) * 1998-02-25 1999-09-07 Nec Corp Etching method of semiconductor substrate
US6383948B1 (en) * 1999-12-20 2002-05-07 Tokyo Electron Limited Coating film forming apparatus and coating film forming method
JP4387007B2 (en) * 1999-10-26 2009-12-16 株式会社ディスコ Method for dividing semiconductor wafer

Also Published As

Publication number Publication date
WO2004024619A1 (en) 2004-03-25
JP2004098245A (en) 2004-04-02

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase