AU2003266566A1 - Substrate processing apparatus - Google Patents

Substrate processing apparatus

Info

Publication number
AU2003266566A1
AU2003266566A1 AU2003266566A AU2003266566A AU2003266566A1 AU 2003266566 A1 AU2003266566 A1 AU 2003266566A1 AU 2003266566 A AU2003266566 A AU 2003266566A AU 2003266566 A AU2003266566 A AU 2003266566A AU 2003266566 A1 AU2003266566 A1 AU 2003266566A1
Authority
AU
Australia
Prior art keywords
processing apparatus
substrate processing
substrate
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003266566A
Inventor
Takahiro Horiguchi
Ryo Kuwajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2003266566A1 publication Critical patent/AU2003266566A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563Gas nozzles
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
AU2003266566A 2002-09-24 2003-09-22 Substrate processing apparatus Abandoned AU2003266566A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-278200 2002-09-24
JP2002278200A JP2004119523A (en) 2002-09-24 2002-09-24 Substrate processing equipment
PCT/JP2003/012086 WO2004030066A1 (en) 2002-09-24 2003-09-22 Substrate processing apparatus

Publications (1)

Publication Number Publication Date
AU2003266566A1 true AU2003266566A1 (en) 2004-04-19

Family

ID=32040424

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003266566A Abandoned AU2003266566A1 (en) 2002-09-24 2003-09-22 Substrate processing apparatus

Country Status (4)

Country Link
JP (1) JP2004119523A (en)
AU (1) AU2003266566A1 (en)
TW (1) TWI238453B (en)
WO (1) WO2004030066A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011145529A1 (en) * 2010-05-17 2011-11-24 株式会社アルバック Vacuum processing apparatus, method for processing object to be processed, and film forming apparatus
JP2019047042A (en) * 2017-09-05 2019-03-22 東芝メモリ株式会社 Semiconductor manufacturing device
US11104496B2 (en) * 2019-08-16 2021-08-31 Gudeng Precision Industrial Co., Ltd. Non-sealed reticle storage device
TWI775073B (en) * 2020-05-07 2022-08-21 台灣積體電路製造股份有限公司 Method and apparatus for light curing

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0377315A (en) * 1989-08-21 1991-04-02 Daiwa Handotai Sochi Kk Semiconductor manufacturing apparatus using mo-cvd method
JP3035953B2 (en) * 1990-02-22 2000-04-24 ソニー株式会社 (III)-(V) Group Compound Semiconductor Vapor Phase Growth Method
JP3338884B2 (en) * 1993-09-20 2002-10-28 株式会社日立製作所 Semiconductor processing equipment
JP2000068215A (en) * 1998-08-18 2000-03-03 Shin Etsu Handotai Co Ltd Method for growing vapor phase thin film and device therefor

Also Published As

Publication number Publication date
TWI238453B (en) 2005-08-21
JP2004119523A (en) 2004-04-15
WO2004030066A1 (en) 2004-04-08
TW200421433A (en) 2004-10-16

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase