AU2003254815A1 - Lead frame processing coining punch, method of manufacturing the coining punch, and lead frame - Google Patents
Lead frame processing coining punch, method of manufacturing the coining punch, and lead frameInfo
- Publication number
- AU2003254815A1 AU2003254815A1 AU2003254815A AU2003254815A AU2003254815A1 AU 2003254815 A1 AU2003254815 A1 AU 2003254815A1 AU 2003254815 A AU2003254815 A AU 2003254815A AU 2003254815 A AU2003254815 A AU 2003254815A AU 2003254815 A1 AU2003254815 A1 AU 2003254815A1
- Authority
- AU
- Australia
- Prior art keywords
- lead frame
- coining punch
- manufacturing
- coining
- punch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002-228817 | 2002-08-06 | ||
| JP2002228817A JP4194317B2 (ja) | 2002-08-06 | 2002-08-06 | リードフレーム加工用コイニングポンチ、及びコイニングポンチの製造方法 |
| PCT/JP2003/009976 WO2004016368A1 (ja) | 2002-08-06 | 2003-08-06 | リードフレーム加工用コイニングポンチ、そのコイニングポンチの製造方法、及びリードフレーム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2003254815A1 true AU2003254815A1 (en) | 2004-03-03 |
Family
ID=31884330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003254815A Abandoned AU2003254815A1 (en) | 2002-08-06 | 2003-08-06 | Lead frame processing coining punch, method of manufacturing the coining punch, and lead frame |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4194317B2 (ja) |
| AU (1) | AU2003254815A1 (ja) |
| WO (1) | WO2004016368A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103990706B (zh) * | 2014-06-05 | 2016-01-20 | 昆山电子羽电业制品有限公司 | 一种显示器背板凸包的冲压模具 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0239620Y2 (ja) * | 1985-05-16 | 1990-10-24 | ||
| JPH01125941A (ja) * | 1987-11-11 | 1989-05-18 | Mitsubishi Electric Corp | 半導体装置のリードフレーム |
| JPH01306031A (ja) * | 1988-05-30 | 1989-12-11 | Mitsubishi Electric Corp | 金型 |
| US5192560A (en) * | 1989-03-07 | 1993-03-09 | Canon Kabushiki Kaisha | Variable mold apparatus |
| JPH05211269A (ja) * | 1992-01-08 | 1993-08-20 | Nec Corp | 半導体装置用リードフレーム |
| JPH0621317A (ja) * | 1992-07-02 | 1994-01-28 | Seiko Epson Corp | 半導体パッケージの製造方法 |
| JP3517559B2 (ja) * | 1997-07-22 | 2004-04-12 | 太平洋工業株式会社 | コイニングによる抵抗溶接用リング溝の成形方法 |
| JP2001246425A (ja) * | 2000-03-03 | 2001-09-11 | Kyushu Sanei Kinzoku Kogyo Kk | 金属薄板に対する突起部形成装置及び金属外装ケースの製造方法並びにその製造方法を用いた金属外装ケース |
| JP3759401B2 (ja) * | 2000-11-10 | 2006-03-22 | 大岡技研株式会社 | 窓穴付き歯車及びその歯車の製造方法 |
-
2002
- 2002-08-06 JP JP2002228817A patent/JP4194317B2/ja not_active Expired - Fee Related
-
2003
- 2003-08-06 AU AU2003254815A patent/AU2003254815A1/en not_active Abandoned
- 2003-08-06 WO PCT/JP2003/009976 patent/WO2004016368A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| JP4194317B2 (ja) | 2008-12-10 |
| JP2004066296A (ja) | 2004-03-04 |
| WO2004016368A1 (ja) | 2004-02-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |