AU2003251973A1 - Controlling the characteristics of ribbon-shaped implanter ion-beams - Google Patents

Controlling the characteristics of ribbon-shaped implanter ion-beams

Info

Publication number
AU2003251973A1
AU2003251973A1 AU2003251973A AU2003251973A AU2003251973A1 AU 2003251973 A1 AU2003251973 A1 AU 2003251973A1 AU 2003251973 A AU2003251973 A AU 2003251973A AU 2003251973 A AU2003251973 A AU 2003251973A AU 2003251973 A1 AU2003251973 A1 AU 2003251973A1
Authority
AU
Australia
Prior art keywords
ribbon
beams
controlling
shaped
implanter ion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003251973A
Other languages
English (en)
Inventor
Harald A. Enge
Kenneth H. Purser
Norman L. Turner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Semiconductor Equipment Associates Inc
Original Assignee
Varian Semiconductor Equipment Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=30116011&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU2003251973(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Varian Semiconductor Equipment Associates Inc filed Critical Varian Semiconductor Equipment Associates Inc
Publication of AU2003251973A1 publication Critical patent/AU2003251973A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/10—Lenses
    • H01J37/14—Lenses magnetic
    • H01J37/141—Electromagnetic lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/10—Lenses
    • H01J37/14—Lenses magnetic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
    • H01J37/1472—Deflecting along given lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/153—Electron-optical or ion-optical arrangements for the correction of image defects, e.g. stigmators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/315—Electron-beam or ion-beam tubes for localised treatment of objects for welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/10—Lenses
    • H01J2237/14—Lenses magnetic
    • H01J2237/1405—Constructional details
    • H01J2237/141—Coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/153—Correcting image defects, e.g. stigmators
    • H01J2237/1534—Aberrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/31701—Ion implantation
    • H01J2237/31703—Dosimetry

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Physical Vapour Deposition (AREA)
AU2003251973A 2002-07-17 2003-07-17 Controlling the characteristics of ribbon-shaped implanter ion-beams Abandoned AU2003251973A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US39632202P 2002-07-17 2002-07-17
US60/396,322 2002-07-17
PCT/US2003/022311 WO2004008476A1 (en) 2002-07-17 2003-07-17 Controlling the characteristics of ribbon-shaped implanter ion-beams

Publications (1)

Publication Number Publication Date
AU2003251973A1 true AU2003251973A1 (en) 2004-02-02

Family

ID=30116011

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003251973A Abandoned AU2003251973A1 (en) 2002-07-17 2003-07-17 Controlling the characteristics of ribbon-shaped implanter ion-beams

Country Status (6)

Country Link
US (5) US6933507B2 (https=)
EP (1) EP1532650A1 (https=)
JP (1) JP4509781B2 (https=)
KR (1) KR100926398B1 (https=)
AU (1) AU2003251973A1 (https=)
WO (1) WO2004008476A1 (https=)

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US6933507B2 (en) * 2002-07-17 2005-08-23 Kenneth H. Purser Controlling the characteristics of implanter ion-beams
US20060043316A1 (en) * 2003-06-10 2006-03-02 Varian Semiconductor Equipment Associates, Inc. Ion implanter having enhanced low energy ion beam transport
US7105839B2 (en) * 2003-10-15 2006-09-12 White Nicholas R Method and fine-control collimator for accurate collimation and precise parallel alignment of scanned ion beams
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JP5100963B2 (ja) * 2004-11-30 2012-12-19 株式会社Ｓｅｎ ビーム照射装置
WO2006060378A2 (en) * 2004-11-30 2006-06-08 Purser Kenneth H Broad energy-range ribbon ion beam collimation using a variable-gradient dipole
US20060124155A1 (en) * 2004-12-13 2006-06-15 Suuronen David E Technique for reducing backside particles
US7525103B2 (en) * 2006-01-20 2009-04-28 Varian Semiconductor Equipment Associates, Inc. Technique for improving uniformity of a ribbon beam
US7550751B2 (en) * 2006-04-10 2009-06-23 Axcelis Technologies, Inc. Ion beam scanning control methods and systems for ion implantation uniformity
US7584890B2 (en) 2006-06-23 2009-09-08 Global Payment Technologies, Inc. Validator linear array
US7619228B2 (en) * 2006-09-29 2009-11-17 Varian Semiconductor Equipment Associates, Inc. Technique for improved ion beam transport
US7528390B2 (en) * 2006-09-29 2009-05-05 Axcelis Technologies, Inc. Broad beam ion implantation architecture
US8124499B2 (en) 2006-11-06 2012-02-28 Silicon Genesis Corporation Method and structure for thick layer transfer using a linear accelerator
US20080116390A1 (en) * 2006-11-17 2008-05-22 Pyramid Technical Consultants, Inc. Delivery of a Charged Particle Beam
US7807983B2 (en) * 2007-01-12 2010-10-05 Varian Semiconductor Equipment Associates, Inc. Technique for reducing magnetic fields at an implant location
US8228658B2 (en) * 2007-02-08 2012-07-24 Axcelis Technologies, Inc. Variable frequency electrostatic clamping
WO2008115339A1 (en) * 2007-03-15 2008-09-25 White Nicholas R Open-ended electromagnetic corrector assembly and method for deflecting, focusing, and controlling the uniformity of a traveling ion beam
US7851767B2 (en) * 2007-03-21 2010-12-14 Advanced Ion Beam Technology, Inc. Beam control assembly for ribbon beam of ions for ion implantation
US7652270B2 (en) * 2007-06-05 2010-01-26 Varian Semiconductor Equipment Associates, Inc. Techniques for ion beam current measurement using a scanning beam current transformer
US7772571B2 (en) * 2007-10-08 2010-08-10 Advanced Ion Beam Technology, Inc. Implant beam utilization in an ion implanter
US20090124065A1 (en) * 2007-11-13 2009-05-14 Varian Semiconductor Equipment Associates, Inc. Particle beam assisted modification of thin film materials
US20090121122A1 (en) * 2007-11-13 2009-05-14 Varian Semiconductor Equipment Associates, Inc. Techniques for measuring and controlling ion beam angle and density uniformity
US7820985B2 (en) * 2007-12-28 2010-10-26 Varian Semiconductor Equipment Associates, Inc. High tilt implant angle performance using in-axis tilt
JP4365441B2 (ja) * 2008-03-31 2009-11-18 三井造船株式会社 イオン注入装置、イオン注入方法及びプログラム
US10991545B2 (en) 2008-06-30 2021-04-27 Nexgen Semi Holding, Inc. Method and device for spatial charged particle bunching
US10566169B1 (en) 2008-06-30 2020-02-18 Nexgen Semi Holding, Inc. Method and device for spatial charged particle bunching
US8263941B2 (en) * 2008-11-13 2012-09-11 Varian Semiconductor Equipment Associates, Inc. Mass analysis magnet for a ribbon beam
US8354654B2 (en) * 2009-03-18 2013-01-15 Kingstone Semiconductor Company Apparatus and method for ion beam implantation using scanning and spot beams with improved high dose beam quality
CN102612719B (zh) * 2009-11-10 2014-02-19 三菱电机株式会社 粒子射线照射系统及粒子射线照射方法
US8604443B2 (en) * 2009-11-13 2013-12-10 Varian Semiconductor Equipment Associates, Inc. System and method for manipulating an ion beam
US8089050B2 (en) * 2009-11-19 2012-01-03 Twin Creeks Technologies, Inc. Method and apparatus for modifying a ribbon-shaped ion beam
CN102791073A (zh) * 2011-05-17 2012-11-21 上海凯世通半导体有限公司 束流传输系统及其传输方法
JP5665679B2 (ja) * 2011-07-14 2015-02-04 住友重機械工業株式会社 不純物導入層形成装置及び静電チャック保護方法
KR101920236B1 (ko) * 2012-06-19 2018-11-20 삼성전자주식회사 배터리를 충전하기 위한 방법 및 그 전자 장치
US9177708B2 (en) * 2013-06-14 2015-11-03 Varian Semiconductor Equipment Associates, Inc. Annular cooling fluid passage for magnets
US8993980B1 (en) 2013-10-22 2015-03-31 Varian Semiconductor Equipment Associates, Inc. Dual stage scanner for ion beam control
US9029811B1 (en) 2013-10-22 2015-05-12 Varian Semiconductor Equipment Associates, Inc. Apparatus to control an ion beam
US20150228445A1 (en) * 2014-02-13 2015-08-13 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for three dimensional ion implantation
US9972475B2 (en) * 2014-12-16 2018-05-15 Varian Semiconductor Equipment Associates, Inc. Apparatus and method to control an ion beam
US9793087B2 (en) * 2015-09-10 2017-10-17 Varian Semiconductor Equipment Associates, Inc. Techniques and apparatus for manipulating an ion beam
US9734982B1 (en) 2016-05-24 2017-08-15 Nissin Ion Equipment Co., Ltd. Beam current density distribution adjustment device and ion implanter
JP6831245B2 (ja) * 2017-01-06 2021-02-17 住友重機械イオンテクノロジー株式会社 イオン注入方法およびイオン注入装置
DE102017205231B3 (de) * 2017-03-28 2018-08-09 Carl Zeiss Microscopy Gmbh Teilchenoptische Vorrichtung und Teilchenstrahlsystem
US10290463B2 (en) * 2017-04-27 2019-05-14 Imatrex, Inc. Compact deflecting magnet
CN108231523A (zh) * 2018-01-18 2018-06-29 德淮半导体有限公司 离子植入机及其使用方法
US10720357B2 (en) * 2018-03-01 2020-07-21 Varian Semiconductor Equipment Associates, Inc. Method of forming transistor device having fin cut regions
US11320476B2 (en) * 2019-07-15 2022-05-03 The Boeing Company Eddy current system for use with electrically-insulative structures and methods for inductively heating or inductively inspecting
US12170182B2 (en) * 2021-07-02 2024-12-17 Advanced Ion Beam Technology, Inc. Ribbon beam angle adjustment in an ion implantation system
US12493005B1 (en) 2022-06-07 2025-12-09 Nexgen Semi Holding, Inc. Extended range active illumination imager
TWI908494B (zh) * 2024-11-25 2025-12-11 漢辰科技股份有限公司 離子佈植機

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JP4287671B2 (ja) 2003-02-19 2009-07-01 株式会社日立ハイテクノロジーズ 測長用標準部材およびその作製方法、並びにそれを用いた電子ビーム測長装置
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Also Published As

Publication number Publication date
US20060169924A1 (en) 2006-08-03
KR20050048589A (ko) 2005-05-24
EP1532650A1 (en) 2005-05-25
US7301156B2 (en) 2007-11-27
US7351984B2 (en) 2008-04-01
US20070181832A1 (en) 2007-08-09
US7897943B2 (en) 2011-03-01
US7888660B2 (en) 2011-02-15
WO2004008476A1 (en) 2004-01-22
US20050242294A1 (en) 2005-11-03
JP4509781B2 (ja) 2010-07-21
KR100926398B1 (ko) 2009-11-12
US20040097058A1 (en) 2004-05-20
US6933507B2 (en) 2005-08-23
JP2005533353A (ja) 2005-11-04
US20070023697A1 (en) 2007-02-01

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