AU2003226175A1 - Thermosetting adhesive sheet with electroconductive and thermoconductive properties - Google Patents
Thermosetting adhesive sheet with electroconductive and thermoconductive propertiesInfo
- Publication number
- AU2003226175A1 AU2003226175A1 AU2003226175A AU2003226175A AU2003226175A1 AU 2003226175 A1 AU2003226175 A1 AU 2003226175A1 AU 2003226175 A AU2003226175 A AU 2003226175A AU 2003226175 A AU2003226175 A AU 2003226175A AU 2003226175 A1 AU2003226175 A1 AU 2003226175A1
- Authority
- AU
- Australia
- Prior art keywords
- electroconductive
- adhesive sheet
- thermosetting adhesive
- thermoconductive properties
- thermoconductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/26—Natural polymers, natural resins or derivatives thereof according to C08L1/00 - C08L5/00, C08L89/00, C08L93/00, C08L97/00 or C08L99/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
- C08L93/04—Rosin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002100200A JP2003292908A (ja) | 2002-04-02 | 2002-04-02 | 導電性及び熱伝導性を有する熱硬化型接着シート |
JP2002-100200 | 2002-04-02 | ||
PCT/US2003/009907 WO2003085733A1 (en) | 2002-04-02 | 2003-04-01 | Thermosetting adhesive sheet with electroconductive and thermoconductive properties |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003226175A1 true AU2003226175A1 (en) | 2003-10-20 |
Family
ID=28786231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003226175A Abandoned AU2003226175A1 (en) | 2002-04-02 | 2003-04-01 | Thermosetting adhesive sheet with electroconductive and thermoconductive properties |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1490904A1 (ja) |
JP (1) | JP2003292908A (ja) |
KR (1) | KR20040105832A (ja) |
CN (1) | CN1653610A (ja) |
AU (1) | AU2003226175A1 (ja) |
WO (1) | WO2003085733A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005217369A (ja) * | 2004-02-02 | 2005-08-11 | Three M Innovative Properties Co | 発光ダイオード装置用接着シート及び発光ダイオード装置 |
US20060118601A1 (en) * | 2004-12-06 | 2006-06-08 | Brandenburg Scott D | Epoxy-solder thermally conductive structure for an integrated circuit |
JP5060474B2 (ja) * | 2006-06-02 | 2012-10-31 | 昭和電工株式会社 | 感光性樹脂および感光性樹脂組成物 |
WO2011019132A1 (ko) * | 2009-08-14 | 2011-02-17 | 중앙대학교 산학협력단 | 도전성 접착제, 이를 이용한 반도체의 실장방법 및 웨이퍼 레벨 패키지 |
JP5297418B2 (ja) * | 2010-06-21 | 2013-09-25 | デクセリアルズ株式会社 | 異方性導電材料及びその製造方法、並びに実装体及びその製造方法 |
CN102002325B (zh) * | 2010-12-10 | 2013-08-21 | 浙江华正新材料股份有限公司 | 一种绝缘粘结片的制造方法 |
CN111440564A (zh) * | 2020-03-25 | 2020-07-24 | 无锡睿穗电子材料科技有限公司 | 一种兼具导热和导电性能的热固型材料及其制作方法 |
CN111394017A (zh) * | 2020-04-24 | 2020-07-10 | 无锡睿穗电子材料科技有限公司 | 一种具有高导热率和导电性的热固型粘合材料 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4606962A (en) * | 1983-06-13 | 1986-08-19 | Minnesota Mining And Manufacturing Company | Electrically and thermally conductive adhesive transfer tape |
EP0537965B1 (en) * | 1991-10-12 | 1997-03-05 | Sumitomo Special Metals Company Limited | Process of manufacturing a heat-conductive material |
US5275856A (en) * | 1991-11-12 | 1994-01-04 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive web |
JP2001107009A (ja) * | 1999-09-30 | 2001-04-17 | Three M Innovative Properties Co | 熱硬化性接着剤組成物及びそれを用いた接着構造 |
JP3830726B2 (ja) * | 2000-04-26 | 2006-10-11 | 松下電器産業株式会社 | 熱伝導基板とその製造方法およびパワーモジュール |
-
2002
- 2002-04-02 JP JP2002100200A patent/JP2003292908A/ja active Pending
-
2003
- 2003-04-01 EP EP03745717A patent/EP1490904A1/en not_active Withdrawn
- 2003-04-01 WO PCT/US2003/009907 patent/WO2003085733A1/en active Application Filing
- 2003-04-01 CN CNA038103087A patent/CN1653610A/zh active Pending
- 2003-04-01 AU AU2003226175A patent/AU2003226175A1/en not_active Abandoned
- 2003-04-01 KR KR10-2004-7015601A patent/KR20040105832A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2003292908A (ja) | 2003-10-15 |
CN1653610A (zh) | 2005-08-10 |
EP1490904A1 (en) | 2004-12-29 |
KR20040105832A (ko) | 2004-12-16 |
WO2003085733A1 (en) | 2003-10-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |