AU2003207200A1 - Polarization analyzing method - Google Patents

Polarization analyzing method

Info

Publication number
AU2003207200A1
AU2003207200A1 AU2003207200A AU2003207200A AU2003207200A1 AU 2003207200 A1 AU2003207200 A1 AU 2003207200A1 AU 2003207200 A AU2003207200 A AU 2003207200A AU 2003207200 A AU2003207200 A AU 2003207200A AU 2003207200 A1 AU2003207200 A1 AU 2003207200A1
Authority
AU
Australia
Prior art keywords
analyzing method
polarization analyzing
polarization
analyzing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003207200A
Other languages
English (en)
Inventor
Toshihiko Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2003207200A1 publication Critical patent/AU2003207200A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0641—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of polarization
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties
    • G01N21/211—Ellipsometry

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
AU2003207200A 2002-02-18 2003-02-10 Polarization analyzing method Abandoned AU2003207200A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002040506A JP3878027B2 (ja) 2002-02-18 2002-02-18 偏光解析方法及び光学的膜厚測定装置
JP2002-40506 2002-02-18
PCT/JP2003/001370 WO2003069667A1 (fr) 2002-02-18 2003-02-10 Procede d'analyse de polarisation

Publications (1)

Publication Number Publication Date
AU2003207200A1 true AU2003207200A1 (en) 2003-09-04

Family

ID=27678309

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003207200A Abandoned AU2003207200A1 (en) 2002-02-18 2003-02-10 Polarization analyzing method

Country Status (5)

Country Link
US (1) US6950186B2 (enExample)
JP (1) JP3878027B2 (enExample)
CN (1) CN100521135C (enExample)
AU (1) AU2003207200A1 (enExample)
WO (1) WO2003069667A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10319843A1 (de) 2003-05-03 2004-12-02 Infineon Technologies Ag Verfahren zum Bestimmen der Tiefe einer vergrabenen Struktur
JP4317558B2 (ja) * 2006-08-23 2009-08-19 株式会社堀場製作所 試料解析方法、試料解析装置及びプログラム
US7688446B2 (en) 2005-11-29 2010-03-30 Horiba, Ltd. Sample analyzing method, sample analyzing apparatus, manufacturing method of organic EL element, manufacturing equipment, and recording medium
US20070178611A1 (en) * 2006-01-30 2007-08-02 Shoaib Zaidi Semiconductor wafer having measurement area feature for determining dielectric layer thickness
JP5264374B2 (ja) * 2008-09-02 2013-08-14 東京エレクトロン株式会社 パターン形状検査方法及び半導体装置の製造方法
JP5471367B2 (ja) * 2009-11-30 2014-04-16 株式会社島津製作所 膜厚測定方法及び膜厚測定装置
JP5857714B2 (ja) * 2011-12-16 2016-02-10 富士通セミコンダクター株式会社 パターン測定方法及び半導体装置の製造方法
CN102553787A (zh) * 2011-12-23 2012-07-11 广东工业大学 一种涂浆机上浆量检测装置及方法
FR2998047B1 (fr) * 2012-11-12 2015-10-02 Soitec Silicon On Insulator Procede de mesure des variations d'epaisseur d'une couche d'une structure semi-conductrice multicouche
CN103968948B (zh) * 2013-02-04 2016-04-27 清华大学 偏振光的检测方法
CN103968949B (zh) * 2013-02-04 2016-04-27 清华大学 偏振光检测系统
CN103674892B (zh) * 2013-11-21 2015-09-30 中国科学院上海技术物理研究所 一种基于全内反射偏振位相差测量来监控薄膜生长的方法
US11085754B2 (en) * 2017-12-12 2021-08-10 Kla Corporation Enhancing metrology target information content
US11852457B2 (en) * 2021-12-20 2023-12-26 GM Global Technology Operations LLC Contactless method for polymer coating thickness measurement
CN115284162B (zh) * 2022-07-19 2024-03-19 华虹半导体(无锡)有限公司 介质层的物理性能、半导体芯片性能的监测方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3781245B2 (ja) * 1997-12-26 2006-05-31 富士通株式会社 半導体装置の製造方法
US6483580B1 (en) * 1998-03-06 2002-11-19 Kla-Tencor Technologies Corporation Spectroscopic scatterometer system
IT1306911B1 (it) * 1998-06-30 2001-10-11 Stmicroelettronica Srl Metodo per misurare lo spessore di uno strato di silicio danneggiatoda attacchi con plasma

Also Published As

Publication number Publication date
JP3878027B2 (ja) 2007-02-07
CN100521135C (zh) 2009-07-29
CN1630940A (zh) 2005-06-22
US6950186B2 (en) 2005-09-27
US20050007592A1 (en) 2005-01-13
JP2003243467A (ja) 2003-08-29
WO2003069667A1 (fr) 2003-08-21

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase