IT1306911B1 - Metodo per misurare lo spessore di uno strato di silicio danneggiatoda attacchi con plasma - Google Patents

Metodo per misurare lo spessore di uno strato di silicio danneggiatoda attacchi con plasma

Info

Publication number
IT1306911B1
IT1306911B1 IT1998MI001504A ITMI981504A IT1306911B1 IT 1306911 B1 IT1306911 B1 IT 1306911B1 IT 1998MI001504 A IT1998MI001504 A IT 1998MI001504A IT MI981504 A ITMI981504 A IT MI981504A IT 1306911 B1 IT1306911 B1 IT 1306911B1
Authority
IT
Italy
Prior art keywords
attachments
plasma
measuring
thickness
silicon layer
Prior art date
Application number
IT1998MI001504A
Other languages
English (en)
Inventor
Claudio Savoia
Simone Alba
Enrico Bellandi
Francesca Canali
Original Assignee
Stmicroelettronica Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stmicroelettronica Srl filed Critical Stmicroelettronica Srl
Priority to IT1998MI001504A priority Critical patent/IT1306911B1/it
Priority to US09/343,207 priority patent/US6233046B1/en
Publication of ITMI981504A1 publication Critical patent/ITMI981504A1/it
Application granted granted Critical
Publication of IT1306911B1 publication Critical patent/IT1306911B1/it

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0641—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of polarization
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties
    • G01N21/211—Ellipsometry

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
IT1998MI001504A 1998-06-30 1998-06-30 Metodo per misurare lo spessore di uno strato di silicio danneggiatoda attacchi con plasma IT1306911B1 (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT1998MI001504A IT1306911B1 (it) 1998-06-30 1998-06-30 Metodo per misurare lo spessore di uno strato di silicio danneggiatoda attacchi con plasma
US09/343,207 US6233046B1 (en) 1998-06-30 1999-06-29 Method of measuring the thickness of a layer of silicon damaged by plasma etching

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT1998MI001504A IT1306911B1 (it) 1998-06-30 1998-06-30 Metodo per misurare lo spessore di uno strato di silicio danneggiatoda attacchi con plasma

Publications (2)

Publication Number Publication Date
ITMI981504A1 ITMI981504A1 (it) 1999-12-30
IT1306911B1 true IT1306911B1 (it) 2001-10-11

Family

ID=11380357

Family Applications (1)

Application Number Title Priority Date Filing Date
IT1998MI001504A IT1306911B1 (it) 1998-06-30 1998-06-30 Metodo per misurare lo spessore di uno strato di silicio danneggiatoda attacchi con plasma

Country Status (2)

Country Link
US (1) US6233046B1 (it)
IT (1) IT1306911B1 (it)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW495631B (en) * 1998-02-06 2002-07-21 Toshiba Corp Method and system for inspecting polycrystalline semiconductor film
AU2001292780A1 (en) * 2000-09-20 2002-04-02 Sivakumar Manickavasagam A non-intrusive method and apparatus for characterizing particles based on scattering of elliptically polarized radiation
JP3878027B2 (ja) * 2002-02-18 2007-02-07 東京エレクトロン株式会社 偏光解析方法及び光学的膜厚測定装置
US6642066B1 (en) 2002-05-15 2003-11-04 Advanced Micro Devices, Inc. Integrated process for depositing layer of high-K dielectric with in-situ control of K value and thickness of high-K dielectric layer
JP2005015885A (ja) * 2003-06-27 2005-01-20 Ebara Corp 基板処理方法及び装置
DE10333119B3 (de) * 2003-07-21 2005-05-25 Infineon Technologies Ag Nichtinvasives Verfahren zur Charakterisierung und Identifizierung eingebetteter Mikrostrukturen
PL1632746T3 (pl) * 2004-09-07 2008-03-31 Applied Mat Gmbh & Co Kg Sposób oznaczania fizycznych właściwości warstwy optycznej lub układu warstw
US7179665B1 (en) 2005-02-17 2007-02-20 Midwest Research Institute Optical method for determining the doping depth profile in silicon
JP4476885B2 (ja) * 2005-07-06 2010-06-09 富士通マイクロエレクトロニクス株式会社 半導体装置の製造方法および半導体製造システム
US9442063B2 (en) * 2011-06-27 2016-09-13 Kla-Tencor Corporation Measurement of composition for thin films
CN102997852A (zh) * 2012-11-14 2013-03-27 彩虹（张家港）平板显示有限公司 一种玻璃基板粘合线的测量方法
US20230111160A1 (en) * 2021-10-13 2023-04-13 Changxin Memory Technologies, Inc. Method for measuring element concentration of material

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5091320A (en) * 1990-06-15 1992-02-25 Bell Communications Research, Inc. Ellipsometric control of material growth
US5665214A (en) * 1995-05-03 1997-09-09 Sony Corporation Automatic film deposition control method and system
US5835221A (en) * 1995-10-16 1998-11-10 Lucent Technologies Inc. Process for fabricating a device using polarized light to determine film thickness

Also Published As

Publication number Publication date
ITMI981504A1 (it) 1999-12-30
US6233046B1 (en) 2001-05-15

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