AU2002364041A1 - Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step - Google Patents

Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step

Info

Publication number
AU2002364041A1
AU2002364041A1 AU2002364041A AU2002364041A AU2002364041A1 AU 2002364041 A1 AU2002364041 A1 AU 2002364041A1 AU 2002364041 A AU2002364041 A AU 2002364041A AU 2002364041 A AU2002364041 A AU 2002364041A AU 2002364041 A1 AU2002364041 A1 AU 2002364041A1
Authority
AU
Australia
Prior art keywords
polishing
time
substrates
calculating
controlling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002364041A
Other languages
English (en)
Inventor
Gerd Marxsen
Jan Raebiger
Dirk Wollstein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10208165A external-priority patent/DE10208165C1/de
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2002364041A1 publication Critical patent/AU2002364041A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/03—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AU2002364041A 2002-02-26 2002-12-20 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step Abandoned AU2002364041A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE10208165.4 2002-02-26
DE10208165A DE10208165C1 (de) 2002-02-26 2002-02-26 Verfahren, Steuerung und Vorrichtung zum Steuern des chemisch-mechanischen Polierens von Substraten
US10/261,612 2002-09-30
US10/261,612 US7268000B2 (en) 2002-02-26 2002-09-30 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
PCT/US2002/041668 WO2003072305A1 (en) 2002-02-26 2002-12-20 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step

Publications (1)

Publication Number Publication Date
AU2002364041A1 true AU2002364041A1 (en) 2003-09-09

Family

ID=27766677

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002364041A Abandoned AU2002364041A1 (en) 2002-02-26 2002-12-20 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step

Country Status (5)

Country Link
EP (1) EP1478494B1 (zh)
CN (1) CN100366386C (zh)
AU (1) AU2002364041A1 (zh)
TW (1) TWI267156B (zh)
WO (1) WO2003072305A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005000645B4 (de) * 2004-01-12 2010-08-05 Samsung Electronics Co., Ltd., Suwon Vorrichtung und ein Verfahren zum Behandeln von Substraten
US7542880B2 (en) * 2006-04-06 2009-06-02 Advanced Micro Devices, Inc. Time weighted moving average filter
CN105563301B (zh) * 2014-10-14 2017-11-21 中芯国际集成电路制造(上海)有限公司 化学机械抛光方法、其抛光时间制程的设置方法及晶圆
CN105700468B (zh) * 2016-01-13 2018-02-27 新维畅想数字科技（北京）有限公司 一种通过增量预计算优化三维雕刻损耗的方法
CN106312792B (zh) * 2016-11-09 2018-06-26 上海华力微电子有限公司 一种动态调整安全研磨时间限的方法
AU2021293507A1 (en) 2020-06-18 2023-02-02 F. Hoffmann-La Roche Ag Treatment with anti-TIGIT antibodies and PD-1 axis binding antagonists
CN112233975B (zh) * 2020-09-04 2024-02-09 北京晶亦精微科技股份有限公司 一种研磨时间控制方法、装置、设备及可读存储介质
CN113192829B (zh) * 2021-05-13 2023-04-18 上海芯物科技有限公司 动态调整晶片抛光时间的方法、装置、设备和存储介质
WO2023010094A2 (en) 2021-07-28 2023-02-02 Genentech, Inc. Methods and compositions for treating cancer
WO2023056403A1 (en) 2021-09-30 2023-04-06 Genentech, Inc. Methods for treatment of hematologic cancers using anti-tigit antibodies, anti-cd38 antibodies, and pd-1 axis binding antagonists
WO2023240058A2 (en) 2022-06-07 2023-12-14 Genentech, Inc. Prognostic and therapeutic methods for cancer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1174235A (ja) * 1997-08-29 1999-03-16 Sony Corp 研磨シミュレーション
US5880007A (en) * 1997-09-30 1999-03-09 Siemens Aktiengesellschaft Planarization of a non-conformal device layer in semiconductor fabrication
US6230069B1 (en) * 1998-06-26 2001-05-08 Advanced Micro Devices, Inc. System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control
US6506097B1 (en) * 2000-01-18 2003-01-14 Applied Materials, Inc. Optical monitoring in a two-step chemical mechanical polishing process

Also Published As

Publication number Publication date
CN100366386C (zh) 2008-02-06
CN1620357A (zh) 2005-05-25
WO2003072305A1 (en) 2003-09-04
EP1478494B1 (en) 2005-10-12
TWI267156B (en) 2006-11-21
EP1478494A1 (en) 2004-11-24
TW200305240A (en) 2003-10-16

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase