AU2002348254A1 - Method of laser milling using constant tool path algorithm - Google Patents

Method of laser milling using constant tool path algorithm

Info

Publication number
AU2002348254A1
AU2002348254A1 AU2002348254A AU2002348254A AU2002348254A1 AU 2002348254 A1 AU2002348254 A1 AU 2002348254A1 AU 2002348254 A AU2002348254 A AU 2002348254A AU 2002348254 A AU2002348254 A AU 2002348254A AU 2002348254 A1 AU2002348254 A1 AU 2002348254A1
Authority
AU
Australia
Prior art keywords
tool path
path algorithm
laser milling
constant tool
constant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002348254A
Other languages
English (en)
Inventor
Chen-Hsiung Cheng
Xinbing Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/266,934 external-priority patent/US6897405B2/en
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of AU2002348254A1 publication Critical patent/AU2002348254A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Numerical Control (AREA)
AU2002348254A 2001-11-30 2002-11-27 Method of laser milling using constant tool path algorithm Abandoned AU2002348254A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US33474601P 2001-11-30 2001-11-30
US60/334,746 2001-11-30
US10/266,934 2002-10-08
US10/266,934 US6897405B2 (en) 2001-11-30 2002-10-08 Method of laser milling using constant tool path algorithm
PCT/US2002/037962 WO2003047805A1 (en) 2001-11-30 2002-11-27 Method of laser milling using constant tool path algorithm

Publications (1)

Publication Number Publication Date
AU2002348254A1 true AU2002348254A1 (en) 2003-06-17

Family

ID=26952122

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002348254A Abandoned AU2002348254A1 (en) 2001-11-30 2002-11-27 Method of laser milling using constant tool path algorithm

Country Status (4)

Country Link
EP (1) EP1448336A4 (de)
JP (1) JP4455884B2 (de)
CN (1) CN1295052C (de)
AU (1) AU2002348254A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7259354B2 (en) * 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
JP5178022B2 (ja) * 2006-02-03 2013-04-10 株式会社半導体エネルギー研究所 記憶素子の作製方法
WO2007088795A1 (en) * 2006-02-03 2007-08-09 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of memory element, laser irradiation apparatus, and laser irradiation method
US8580700B2 (en) 2006-02-17 2013-11-12 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US7532378B2 (en) 2006-02-21 2009-05-12 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus, method of laser irradiation, and method for manufacturing semiconductor device
JP4833773B2 (ja) * 2006-08-31 2011-12-07 本田技研工業株式会社 微細穴開け加工方法
JP5122833B2 (ja) * 2007-02-20 2013-01-16 ファナック株式会社 レーザ加工方法及びレーザ加工装置
US8481887B2 (en) * 2007-05-03 2013-07-09 Electro Scientific Industries, Inc. Method for machining tapered micro holes
EP2163339B1 (de) * 2008-09-11 2016-11-02 Bystronic Laser AG Laserschneidanlage zum Schneiden eines Werkstücks mit einem Laserstrahl mit einer variablen Schneidgeschwindigkeit
CN101811229B (zh) * 2009-02-19 2013-12-25 株式会社日立高科技 激光加工方法、激光加工装置以及太阳能电池板制造方法
US9289858B2 (en) * 2011-12-20 2016-03-22 Electro Scientific Industries, Inc. Drilling holes with minimal taper in cured silicone
DE102012111771B4 (de) * 2012-12-04 2020-12-03 Ewag Ag Verfahren zur Bearbeitung eines Werkstücks unter Verwendung einer Laserbearbeitungsvorrichtung zur Herstellung eines Schneidwerkzeugs
CN104439716A (zh) * 2014-11-17 2015-03-25 深圳锜宏伟科技有限公司 激光加工系统及激光加工方法
CN104985329B (zh) * 2015-06-16 2016-09-21 沈阳飞机工业（集团）有限公司 双曲率立体化铣零件激光刻型加工方法
CN111136389A (zh) * 2020-01-22 2020-05-12 苏州德龙激光股份有限公司 激光成像法切割pi网板的装置及其方法
CN113427137A (zh) * 2020-03-06 2021-09-24 大族激光科技产业集团股份有限公司 孔加工方法
CN111822887B (zh) * 2020-07-14 2022-04-26 深圳中科光子科技有限公司 一种激光打孔厚玻璃的加工系统及方法
EP4275906A4 (de) 2021-01-05 2024-02-21 Konica Minolta, Inc. Tintenstrahlkopfdüsenplatte, herstellungsverfahren dafür, tintenstrahlkopf und tintenstrahlaufzeichnungsvorrichtung
CN117733358B (zh) * 2024-01-04 2024-07-23 江苏富乐华半导体科技股份有限公司 一种覆铜板雕刻二维码的返工方法
CN118060708B (zh) * 2024-04-22 2024-08-27 深圳市圭华智能科技有限公司 一种电池激光加工设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2241850C3 (de) * 1972-08-25 1978-06-29 European Rotogravure Association, 8000 Muenchen Verfahren zur Herstellung von Druckformen mittels eines Energiestrahles
DE2829851A1 (de) * 1978-07-07 1980-01-24 Precitec Gmbh Anordnung zur messung des abstands zwischen einem metallischen werkstueck und einem bearbeitungswerkzeug
US4270421A (en) * 1979-03-22 1981-06-02 The United States Of America As Represented By The United States Department Of Energy Apparatus for correcting precision errors in slide straightness in machine tools
US4718418A (en) * 1983-11-17 1988-01-12 Lri L.P. Apparatus for ophthalmological surgery
US4754208A (en) * 1986-11-17 1988-06-28 Nippon Kokan Kabushiki Kaisha Circular path control apparatus and method for multi-axis servomechanisms
WO1988006504A1 (en) * 1987-02-24 1988-09-07 Nippon Steel Corporation Method and apparatus for dull finish of roll with pulse laser
JP2797684B2 (ja) * 1990-10-04 1998-09-17 ブラザー工業株式会社 ノズルの製造方法および製造装置
US5751585A (en) * 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
JPH11281814A (ja) * 1998-03-30 1999-10-15 Sekisui Chem Co Ltd カラーフィルタの製造方法
US6231566B1 (en) * 1998-08-12 2001-05-15 Katana Research, Inc. Method for scanning a pulsed laser beam for surface ablation

Also Published As

Publication number Publication date
JP4455884B2 (ja) 2010-04-21
CN1596172A (zh) 2005-03-16
CN1295052C (zh) 2007-01-17
EP1448336A1 (de) 2004-08-25
EP1448336A4 (de) 2006-03-15
JP2005511312A (ja) 2005-04-28

Similar Documents

Publication Publication Date Title
AU2002348254A1 (en) Method of laser milling using constant tool path algorithm
AU2003220847A1 (en) Laser beam machining method
AU2003262079A1 (en) Laser beam machining method
TWI297628B (en) Laser machining method
AU2002360703A1 (en) Laser optics integrated control system and method of operation
GB0214419D0 (en) Laser beam machining apparatus and laser beam machining method
AU2002359405A1 (en) Methods and systems for treating presbyopia via laser ablation
HK1098985A1 (en) Laser machining apparatus
AU2003262987A1 (en) Cutting tool for rough and finish milling
AU2003210239A1 (en) Tilted cavity semiconductor laser (tcsl) and method of making same
EP1684935B8 (de) Laserbearbeitungsmaschine und laserbearbeitungsverfahren
AU2002318383A1 (en) Method of laser machining a fluid slot
AU2003278847A1 (en) Reduced splattering of unpassivated laser fuses
AU2003261895A1 (en) Method of laser beam machining and laser beam machining apparatus
PL355306A1 (en) Method of effecting laser impact treatment of workpieces
AU2003220842A1 (en) Laser beam machining method
AU2003267781A1 (en) Laser modification of complex objects
AU2002336497A1 (en) Multi-wavelength laser apparatus and method
AU2003281628A1 (en) Glass capable of being machined by laser
AU2002358539A1 (en) Machining tool
AU2002220741A1 (en) Cutting gas and method for laser beam gas cutting
AUPR670001A0 (en) Laser ablation of workpieces
AU2003300468A1 (en) Milling device and method for machining roadway surfaces
AU2002258304A1 (en) High power three-dimensional laser amplifier
AU2002317971A1 (en) Laser apparatus

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase