AU2002316990A1 - Vertically contacted stacked chips - Google Patents

Vertically contacted stacked chips

Info

Publication number
AU2002316990A1
AU2002316990A1 AU2002316990A AU2002316990A AU2002316990A1 AU 2002316990 A1 AU2002316990 A1 AU 2002316990A1 AU 2002316990 A AU2002316990 A AU 2002316990A AU 2002316990 A AU2002316990 A AU 2002316990A AU 2002316990 A1 AU2002316990 A1 AU 2002316990A1
Authority
AU
Australia
Prior art keywords
contact surface
contact
surface zones
size
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002316990A
Other languages
English (en)
Inventor
Thomas Grassl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient GmbH
Original Assignee
Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Publication of AU2002316990A1 publication Critical patent/AU2002316990A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/297—Configurations of stacked chips characterised by the through-semiconductor vias [TSVs] in the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Crushing And Grinding (AREA)
  • Battery Mounting, Suspending (AREA)
  • Bipolar Transistors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AU2002316990A 2001-06-21 2002-06-20 Vertically contacted stacked chips Abandoned AU2002316990A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10130864.7 2001-06-21
DE10130864A DE10130864A1 (de) 2001-06-21 2001-06-21 Vertikal kontaktierte, übereinander gestapelte Chips
PCT/EP2002/006861 WO2003001597A2 (de) 2001-06-21 2002-06-20 Vertikal kontaktierte, übereinander gestapelte chips

Publications (1)

Publication Number Publication Date
AU2002316990A1 true AU2002316990A1 (en) 2003-01-08

Family

ID=7689553

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002316990A Abandoned AU2002316990A1 (en) 2001-06-21 2002-06-20 Vertically contacted stacked chips

Country Status (6)

Country Link
EP (1) EP1402575B1 (https=)
JP (1) JP4481638B2 (https=)
AT (1) ATE414328T1 (https=)
AU (1) AU2002316990A1 (https=)
DE (2) DE10130864A1 (https=)
WO (1) WO2003001597A2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8124429B2 (en) 2006-12-15 2012-02-28 Richard Norman Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
WO2008137511A1 (en) 2007-05-04 2008-11-13 Crossfire Technologies, Inc. Accessing or interconnecting integrated circuits

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61206249A (ja) * 1985-03-11 1986-09-12 Hitachi Ltd 積層半導体集積回路装置
EP0481703B1 (en) * 1990-10-15 2003-09-17 Aptix Corporation Interconnect substrate having integrated circuit for programmable interconnection and sample testing
US5424589A (en) * 1993-02-12 1995-06-13 The Board Of Trustees Of The Leland Stanford Junior University Electrically programmable inter-chip interconnect architecture
DE4314907C1 (de) * 1993-05-05 1994-08-25 Siemens Ag Verfahren zur Herstellung von vertikal miteinander elektrisch leitend kontaktierten Halbleiterbauelementen
DE19702121C1 (de) * 1997-01-22 1998-06-18 Siemens Ag Verfahren zur Herstellung von vertikalen Chipverbindungen
DE19813239C1 (de) * 1998-03-26 1999-12-23 Fraunhofer Ges Forschung Verdrahtungsverfahren zur Herstellung einer vertikalen integrierten Schaltungsstruktur und vertikale integrierte Schaltungsstruktur
JP2001127243A (ja) * 1999-10-26 2001-05-11 Sharp Corp 積層半導体装置

Also Published As

Publication number Publication date
DE10130864A1 (de) 2003-01-02
EP1402575A2 (de) 2004-03-31
JP2004531083A (ja) 2004-10-07
WO2003001597A2 (de) 2003-01-03
EP1402575B1 (de) 2008-11-12
ATE414328T1 (de) 2008-11-15
JP4481638B2 (ja) 2010-06-16
WO2003001597A3 (de) 2003-12-18
DE50213010D1 (de) 2008-12-24

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase