AU2002256996A1 - Three-dimensional microfluidics incorporating passive fluid control structures - Google Patents

Three-dimensional microfluidics incorporating passive fluid control structures

Info

Publication number
AU2002256996A1
AU2002256996A1 AU2002256996A AU2002256996A AU2002256996A1 AU 2002256996 A1 AU2002256996 A1 AU 2002256996A1 AU 2002256996 A AU2002256996 A AU 2002256996A AU 2002256996 A AU2002256996 A AU 2002256996A AU 2002256996 A1 AU2002256996 A1 AU 2002256996A1
Authority
AU
Australia
Prior art keywords
fluid control
control structures
passive fluid
incorporating passive
microfluidics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002256996A
Other languages
English (en)
Inventor
Nils Adey
Mark Spute
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Biomicro Systems Inc
Original Assignee
Biomicro Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Biomicro Systems Inc filed Critical Biomicro Systems Inc
Priority claimed from PCT/US2002/004045 external-priority patent/WO2003052428A1/en
Publication of AU2002256996A1 publication Critical patent/AU2002256996A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
AU2002256996A 2001-02-07 2002-02-07 Three-dimensional microfluidics incorporating passive fluid control structures Abandoned AU2002256996A1 (en)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US26715401P 2001-02-07 2001-02-07
US60/267,154 2001-02-07
US27438901P 2001-03-09 2001-03-09
US60/274,389 2001-03-09
US28442701P 2001-04-17 2001-04-17
US60/284,427 2001-04-17
US29020901P 2001-05-11 2001-05-11
US60/290,209 2001-05-11
US31370301P 2001-08-20 2001-08-20
US60/313,703 2001-08-20
US33985101P 2001-12-12 2001-12-12
US60/339,851 2001-12-12
PCT/US2002/004045 WO2003052428A1 (en) 2001-02-07 2002-02-07 Three-dimensional microfluidics incorporating passive fluid control structures

Publications (1)

Publication Number Publication Date
AU2002256996A1 true AU2002256996A1 (en) 2003-06-30

Family

ID=30119501

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002256996A Abandoned AU2002256996A1 (en) 2001-02-07 2002-02-07 Three-dimensional microfluidics incorporating passive fluid control structures

Country Status (4)

Country Link
EP (1) EP1386169A1 (ja)
JP (1) JP2005513441A (ja)
KR (1) KR20030090636A (ja)
AU (1) AU2002256996A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014083799A1 (ja) * 2012-11-27 2014-06-05 日本電気株式会社 流体チップとその廃液方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100612879B1 (ko) * 2004-12-06 2006-08-14 삼성전자주식회사 폐쇄 시스템에서 펌프와 밸브의 제어를 통한 혼성화 장치
KR100612880B1 (ko) * 2004-12-06 2006-08-14 삼성전자주식회사 챔버 샘플투입구의 패킹 장치
KR100644807B1 (ko) * 2004-12-10 2006-11-14 한국전자통신연구원 플라스틱 기판을 이용한 미소 가열기 및 그의 제조 방법
JP2006326474A (ja) * 2005-05-25 2006-12-07 Photo Precision Kk 積層チップ
WO2007049534A1 (ja) * 2005-10-28 2007-05-03 Arkray, Inc. 送液方法、およびこれに用いるカートリッジ
MX342351B (es) 2005-12-21 2016-09-26 Meso Scale Technologies Llc Modulos de ensayo que tienen reactivos de ensayo y metodos para hacer y utilizar los mismos.
JP5845156B2 (ja) * 2005-12-21 2016-01-20 メソ スケール テクノロジーズ エルエルシー アッセイ試薬を具備するアッセイモジュールとその製造方法およびその使用方法
CA3122671A1 (en) 2005-12-21 2008-05-15 Meso Scale Technologies, Llc. Assay apparatuses, methods and reagents
KR100790881B1 (ko) * 2006-07-06 2008-01-02 삼성전자주식회사 미세유체 반응칩 및 이의 제조방법
US10753927B2 (en) 2006-09-22 2020-08-25 ALERE TECHNOLOGIES GmbH Methods for detecting an analyte
KR100758285B1 (ko) * 2006-09-27 2007-09-12 한국전자통신연구원 바이오 센서, 그 제조방법 및 이를 구비한 바이오 감지장치
EP2089159B1 (en) * 2007-05-03 2013-01-23 Clondiag GmbH Assays
JP4466682B2 (ja) * 2007-05-28 2010-05-26 株式会社日立プラントテクノロジー 流体混合装置
JP5241209B2 (ja) * 2007-11-26 2013-07-17 株式会社日立ハイテクノロジーズ 試料前処理用デバイス及び試料分析方法
JP5155800B2 (ja) * 2008-09-29 2013-03-06 富士フイルム株式会社 反応方法及び反応装置
WO2011003689A2 (en) * 2009-07-07 2011-01-13 Boehringer Ingelheim Microparts Gmbh Plasma separation reservoir
KR20110027419A (ko) 2009-09-10 2011-03-16 삼성전자주식회사 유체 수용 챔버, 유체 수용 챔버를 구비한 미세 유동 장치, 및 유체 혼합 방법
EP3112869A1 (en) * 2015-06-30 2017-01-04 IMEC vzw Sensor device
KR102039230B1 (ko) * 2017-12-13 2019-10-31 인제대학교 산학협력단 버블 유입 방지용 시료주입 장치
WO2019107231A1 (ja) * 2017-11-29 2019-06-06 積水化学工業株式会社 マイクロ流体チップ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014083799A1 (ja) * 2012-11-27 2014-06-05 日本電気株式会社 流体チップとその廃液方法

Also Published As

Publication number Publication date
JP2005513441A (ja) 2005-05-12
KR20030090636A (ko) 2003-11-28
EP1386169A1 (en) 2004-02-04

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase