AU2002213294A1 - Carrier-based electronic module - Google Patents

Carrier-based electronic module

Info

Publication number
AU2002213294A1
AU2002213294A1 AU2002213294A AU1329402A AU2002213294A1 AU 2002213294 A1 AU2002213294 A1 AU 2002213294A1 AU 2002213294 A AU2002213294 A AU 2002213294A AU 1329402 A AU1329402 A AU 1329402A AU 2002213294 A1 AU2002213294 A1 AU 2002213294A1
Authority
AU
Australia
Prior art keywords
carrier
electronic module
based electronic
module
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002213294A
Inventor
Jason C. Engle
Kenneth J. Kledzik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Legacy Electronics Inc
Original Assignee
Legacy Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Legacy Electronics Inc filed Critical Legacy Electronics Inc
Publication of AU2002213294A1 publication Critical patent/AU2002213294A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
AU2002213294A 2000-10-16 2001-10-16 Carrier-based electronic module Abandoned AU2002213294A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/688,500 2000-10-16
US09/688,500 US6713854B1 (en) 2000-10-16 2000-10-16 Electronic circuit module with a carrier having a mounting pad array
PCT/US2001/032329 WO2002034021A2 (en) 2000-10-16 2001-10-16 Carrier-based electronic module

Publications (1)

Publication Number Publication Date
AU2002213294A1 true AU2002213294A1 (en) 2002-04-29

Family

ID=24764667

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002213294A Abandoned AU2002213294A1 (en) 2000-10-16 2001-10-16 Carrier-based electronic module

Country Status (7)

Country Link
US (2) US6713854B1 (en)
EP (1) EP1329143A2 (en)
JP (2) JP4190279B2 (en)
KR (1) KR100645861B1 (en)
CN (1) CN1483302A (en)
AU (1) AU2002213294A1 (en)
WO (1) WO2002034021A2 (en)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004077559A1 (en) * 2003-02-27 2004-09-10 Infineon Technologies Ag Integrated circuit package and method for producing it
US6943454B1 (en) * 2003-05-23 2005-09-13 White Electronic Designs Corp. Memory module
US20050077620A1 (en) * 2003-10-09 2005-04-14 Hsin Chung Hsien Miniaturized small memory card structure
JP4205553B2 (en) * 2003-11-06 2009-01-07 エルピーダメモリ株式会社 Memory module and memory system
TWM256569U (en) * 2003-12-09 2005-02-01 Optimum Care Int Tech Inc Memory module device
US7254036B2 (en) * 2004-04-09 2007-08-07 Netlist, Inc. High density memory module using stacked printed circuit boards
US7317250B2 (en) * 2004-09-30 2008-01-08 Kingston Technology Corporation High density memory card assembly
KR100843137B1 (en) * 2004-12-27 2008-07-02 삼성전자주식회사 Semiconductor device package
US7866564B2 (en) * 2005-02-04 2011-01-11 Chun-Hsin Ho Dual card system
US7303137B2 (en) * 2005-02-04 2007-12-04 Chun-Hsin Ho Dual integrated circuit card system
US20060288132A1 (en) * 2005-05-31 2006-12-21 Mccall James A Memory single-to-multi load repeater architecture
US7442050B1 (en) 2005-08-29 2008-10-28 Netlist, Inc. Circuit card with flexible connection for memory module with heat spreader
JP2007101576A (en) * 2005-09-30 2007-04-19 Fujitsu Hitachi Plasma Display Ltd Plasma display device
JP2007109932A (en) * 2005-10-14 2007-04-26 Toshiba Corp Semiconductor device
US7619893B1 (en) 2006-02-17 2009-11-17 Netlist, Inc. Heat spreader for electronic modules
US7990727B1 (en) * 2006-04-03 2011-08-02 Aprolase Development Co., Llc Ball grid array stack
KR101257912B1 (en) * 2007-02-14 2013-04-24 삼성전자주식회사 Semiconductor memory device and method of arranging terminals of the same, and memory module comprising the device and method of arranging terminals and lines on board of the same
US7652894B2 (en) * 2007-02-26 2010-01-26 Nichepac Technology Inc. Contact lead
KR100924547B1 (en) * 2007-11-09 2009-11-02 주식회사 하이닉스반도체 Semiconductor package module
US8228679B2 (en) * 2008-04-02 2012-07-24 Spansion Llc Connections for electronic devices on double-sided circuit board
US8018723B1 (en) 2008-04-30 2011-09-13 Netlist, Inc. Heat dissipation for electronic modules
US7986158B2 (en) * 2008-08-21 2011-07-26 OFID Microdevices, Inc. Methods, apparatuses, and products for a secure circuit
US8706049B2 (en) * 2008-12-31 2014-04-22 Intel Corporation Platform integrated phased array transmit/receive module
US8467737B2 (en) * 2008-12-31 2013-06-18 Intel Corporation Integrated array transmit/receive module
CN102792785A (en) * 2010-04-13 2012-11-21 株式会社村田制作所 Module substrate, production method for module substrate, and terminal connection board
AT12738U1 (en) * 2010-10-13 2012-10-15 Austria Tech & System Tech METHOD AND SYSTEM FOR PROVIDING AN IN PARTICULAR A MULTIPLE OF LADDER PLATE ELEMENTS CONTAINING PLATE-SHAPED OBJECTS
KR101796116B1 (en) 2010-10-20 2017-11-10 삼성전자 주식회사 Semiconductor device, memory module and memory system having the same and operating method thereof
US8513817B2 (en) 2011-07-12 2013-08-20 Invensas Corporation Memory module in a package
US8823165B2 (en) 2011-07-12 2014-09-02 Invensas Corporation Memory module in a package
US8502390B2 (en) 2011-07-12 2013-08-06 Tessera, Inc. De-skewed multi-die packages
KR101894825B1 (en) 2011-10-03 2018-10-04 인벤사스 코포레이션 Stub minimization for multi-die wirebond assemblies with parallel windows
US8659140B2 (en) 2011-10-03 2014-02-25 Invensas Corporation Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
US8513813B2 (en) 2011-10-03 2013-08-20 Invensas Corporation Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
US8441111B2 (en) 2011-10-03 2013-05-14 Invensas Corporation Stub minimization for multi-die wirebond assemblies with parallel windows
US8405207B1 (en) 2011-10-03 2013-03-26 Invensas Corporation Stub minimization for wirebond assemblies without windows
KR101945334B1 (en) * 2011-10-03 2019-02-07 인벤사스 코포레이션 Stub minimization for wirebond assemblies without windows
US8436457B2 (en) 2011-10-03 2013-05-07 Invensas Corporation Stub minimization for multi-die wirebond assemblies with parallel windows
US8610260B2 (en) 2011-10-03 2013-12-17 Invensas Corporation Stub minimization for assemblies without wirebonds to package substrate
JP5947904B2 (en) 2011-10-03 2016-07-06 インヴェンサス・コーポレイション Stub minimization for multi-die wirebond assemblies with orthogonal windows
EP2766928A1 (en) 2011-10-03 2014-08-20 Invensas Corporation Stub minimization with terminal grids offset from center of package
US9368477B2 (en) 2012-08-27 2016-06-14 Invensas Corporation Co-support circuit panel and microelectronic packages
US8848392B2 (en) 2012-08-27 2014-09-30 Invensas Corporation Co-support module and microelectronic assembly
US8848391B2 (en) 2012-08-27 2014-09-30 Invensas Corporation Co-support component and microelectronic assembly
US8787034B2 (en) 2012-08-27 2014-07-22 Invensas Corporation Co-support system and microelectronic assembly
US20140204539A1 (en) * 2013-01-24 2014-07-24 Bradley Dean Loomis Package and tray system for interchanging device components
CN203225947U (en) * 2013-03-28 2013-10-02 富士康(昆山)电脑接插件有限公司 Printed circuit board assembly
US9070423B2 (en) 2013-06-11 2015-06-30 Invensas Corporation Single package dual channel memory with co-support
US9831144B2 (en) * 2013-08-28 2017-11-28 Qubeicon Ltd. Semiconductor die and package jigsaw submount
US9123555B2 (en) 2013-10-25 2015-09-01 Invensas Corporation Co-support for XFD packaging
WO2015178880A1 (en) * 2014-05-19 2015-11-26 Hewlett-Packard Development Company, L.P. Substrate sprayer
US9281296B2 (en) 2014-07-31 2016-03-08 Invensas Corporation Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard design
US9252521B1 (en) * 2014-08-04 2016-02-02 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Short path circuit card
US9691437B2 (en) 2014-09-25 2017-06-27 Invensas Corporation Compact microelectronic assembly having reduced spacing between controller and memory packages
JP6224023B2 (en) * 2015-03-27 2017-11-01 矢崎総業株式会社 Electronic component unit and electrical junction box
WO2017059189A1 (en) * 2015-09-30 2017-04-06 Skyworks Solutions, Inc. Devices and methods related to fabrication of shielded modules
US9484080B1 (en) 2015-11-09 2016-11-01 Invensas Corporation High-bandwidth memory application with controlled impedance loading
KR102059610B1 (en) * 2015-12-18 2019-12-26 주식회사 엘지화학 Radiant heating system of printed circuit board using high conductance radiator pad
US9679613B1 (en) 2016-05-06 2017-06-13 Invensas Corporation TFD I/O partition for high-speed, high-density applications
CN107770956A (en) * 2016-08-16 2018-03-06 光宝电子(广州)有限公司 Board structure of circuit
US10645845B2 (en) 2018-04-12 2020-05-05 Northrop Grumman Systems Corporation Forced flow cooling temperature control method, system, and apparatus
US10782258B2 (en) 2018-09-04 2020-09-22 Northrop Grumman Systems Corporation Superconductor critical temperature measurement
US10854763B2 (en) 2018-09-17 2020-12-01 Gbt Technologies Inc. Multi-dimensional integrated circuit having multiple planes and memory architecture having a honeycomb or bee hive structure
US11862736B2 (en) 2018-09-17 2024-01-02 GBT Tokenize Corp. Multi-dimensional photonic integrated circuits and memory structure having optical components mounted on multiple planes of a multi-dimensional package
KR102149387B1 (en) 2019-02-13 2020-08-28 삼성전기주식회사 Electronic component module
US10575437B1 (en) 2019-03-20 2020-02-25 Northrop Grumman Systems Corporation Temperature control method, system, and apparatus
US10595441B1 (en) * 2019-04-03 2020-03-17 Northrop Grumman Systems Corporation Method and apparatus for separating a thermal load path from a structural load path in a circuit board environment
US20230240010A1 (en) * 2022-01-24 2023-07-27 Dell Products L.P. Systems and methods for processing printed circuit board for modular circuits
US11809797B1 (en) 2022-07-31 2023-11-07 Gbt Technologies Inc. Systems and methods of predictive manufacturing of three-dimensional, multi-planar semiconductors
CN115188734B (en) * 2022-09-06 2022-11-25 中诚华隆计算机技术有限公司 Chip interconnection structure and chip

Family Cites Families (117)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3239719A (en) 1963-07-08 1966-03-08 Sperry Rand Corp Packaging and circuit connection means for microelectronic circuitry
US3665256A (en) 1968-10-15 1972-05-23 Rca Corp Heat dissipation for power integrated circuits
US3737986A (en) 1971-11-26 1973-06-12 Western Electric Co Explosive bonding of workpieces
US3777221A (en) 1972-12-18 1973-12-04 Ibm Multi-layer circuit package
US4038488A (en) 1975-05-12 1977-07-26 Cambridge Memories, Inc. Multilayer ceramic multi-chip, dual in-line packaging assembly
US4245877A (en) 1976-12-30 1981-01-20 Burndy Corporation Circuit package receptacle with movable base separation means
US4288841A (en) 1979-09-20 1981-09-08 Bell Telephone Laboratories, Incorporated Double cavity semiconductor chip carrier
US4322778A (en) 1980-01-25 1982-03-30 International Business Machines Corp. High performance semiconductor package assembly
US4398235A (en) 1980-09-11 1983-08-09 General Motors Corporation Vertical integrated circuit package integration
US4437235A (en) 1980-12-29 1984-03-20 Honeywell Information Systems Inc. Integrated circuit package
US4549200A (en) 1982-07-08 1985-10-22 International Business Machines Corporation Repairable multi-level overlay system for semiconductor device
US4616655A (en) 1984-01-20 1986-10-14 Cordis Corporation Implantable pulse generator having a single printed circuit board and a chip carrier
US4632293A (en) 1985-09-03 1986-12-30 Feinstein Dov Y Method of upgrading memory boards
US4696525A (en) * 1985-12-13 1987-09-29 Amp Incorporated Socket for stacking integrated circuit packages
US4763188A (en) 1986-08-08 1988-08-09 Thomas Johnson Packaging system for multiple semiconductor devices
DE3677601D1 (en) 1986-08-22 1991-03-28 Ibm Deutschland INTEGRATED WIRING SYSTEM FOR VERY HIGHLY INTEGRATED CIRCUITS.
US5138438A (en) 1987-06-24 1992-08-11 Akita Electronics Co. Ltd. Lead connections means for stacked tab packaged IC chips
KR970003915B1 (en) 1987-06-24 1997-03-22 미다 가쓰시게 Semiconductor device and the use memory module
JPS6480032A (en) 1987-09-21 1989-03-24 Hitachi Maxell Semiconductor device and manufacture thereof
US5107586A (en) 1988-09-27 1992-04-28 General Electric Company Method for interconnecting a stack of integrated circuits at a very high density
US5200362A (en) 1989-09-06 1993-04-06 Motorola, Inc. Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
US5182632A (en) * 1989-11-22 1993-01-26 Tactical Fabs, Inc. High density multichip package with interconnect structure and heatsink
US5191404A (en) 1989-12-20 1993-03-02 Digital Equipment Corporation High density memory array packaging
US5065227A (en) 1990-06-04 1991-11-12 International Business Machines Corporation Integrated circuit packaging using flexible substrate
US5241456A (en) 1990-07-02 1993-08-31 General Electric Company Compact high density interconnect structure
US5377077A (en) 1990-08-01 1994-12-27 Staktek Corporation Ultra high density integrated circuit packages method and apparatus
US5262594A (en) 1990-10-12 1993-11-16 Compaq Computer Corporation Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same
US5130894A (en) 1990-11-26 1992-07-14 At&T Bell Laboratories Three-dimensional circuit modules
US5311401A (en) 1991-07-09 1994-05-10 Hughes Aircraft Company Stacked chip assembly and manufacturing method therefor
US5239447A (en) 1991-09-13 1993-08-24 International Business Machines Corporation Stepped electronic device package
US5128831A (en) 1991-10-31 1992-07-07 Micron Technology, Inc. High-density electronic package comprising stacked sub-modules which are electrically interconnected by solder-filled vias
JPH05185777A (en) 1992-01-08 1993-07-27 Ryoden Kasei Co Ltd Ic card
US5311407A (en) 1992-04-30 1994-05-10 Siemens Components, Inc. Printed circuit based for mounted semiconductors and other electronic components
US5285352A (en) 1992-07-15 1994-02-08 Motorola, Inc. Pad array semiconductor device with thermal conductor and process for making the same
US5313366A (en) 1992-08-12 1994-05-17 International Business Machines Corporation Direct chip attach module (DCAM)
JPH0679990A (en) 1992-09-04 1994-03-22 Mitsubishi Electric Corp Ic memory card
KR100280762B1 (en) 1992-11-03 2001-03-02 비센트 비.인그라시아 Thermally Reinforced Semiconductor Devices Having Exposed Backsides and Methods of Manufacturing the Same
US5455740A (en) 1994-03-07 1995-10-03 Staktek Corporation Bus communication system for stacked high density integrated circuit packages
US5418688A (en) 1993-03-29 1995-05-23 Motorola, Inc. Cardlike electronic device
US5652462A (en) 1993-04-05 1997-07-29 Matsushita Electric Industrial Co., Ltd. Multilevel semiconductor integrated circuit device
US5412538A (en) 1993-07-19 1995-05-02 Cordata, Inc. Space-saving memory module
US5400904C1 (en) 1993-10-15 2001-01-16 Murphy R H Co Inc Tray for ball terminal integrated circuits
US5498906A (en) 1993-11-17 1996-03-12 Staktek Corporation Capacitive coupling configuration for an intergrated circuit package
JP2541487B2 (en) 1993-11-29 1996-10-09 日本電気株式会社 Semiconductor device package
US5492223A (en) 1994-02-04 1996-02-20 Motorola, Inc. Interlocking and invertible semiconductor device tray and test contactor mating thereto
KR0134648B1 (en) 1994-06-09 1998-04-20 김광호 Multi-chip package
JP2571021B2 (en) 1994-08-05 1997-01-16 日本電気株式会社 Connection adapter and mounting structure for semiconductor device
US5579207A (en) 1994-10-20 1996-11-26 Hughes Electronics Three-dimensional integrated circuit stacking
US5636745A (en) 1994-10-27 1997-06-10 Illinois Tool Works Inc. Tray for a component and an apparatus for accurately placing a component within the tray
KR0147259B1 (en) 1994-10-27 1998-08-01 김광호 Stack type semiconductor package and method for manufacturing the same
KR0137826B1 (en) * 1994-11-15 1998-04-28 문정환 Package method and device package
US6614110B1 (en) 1994-12-22 2003-09-02 Benedict G Pace Module with bumps for connection and support
US5701233A (en) 1995-01-23 1997-12-23 Irvine Sensors Corporation Stackable modules and multimodular assemblies
US5819394A (en) 1995-02-22 1998-10-13 Transition Automation, Inc. Method of making board matched nested support fixture
US5783870A (en) 1995-03-16 1998-07-21 National Semiconductor Corporation Method for connecting packages of a stacked ball grid array structure
US5514907A (en) 1995-03-21 1996-05-07 Simple Technology Incorporated Apparatus for stacking semiconductor chips
JP2725637B2 (en) 1995-05-31 1998-03-11 日本電気株式会社 Electronic circuit device and method of manufacturing the same
US5810609A (en) 1995-08-28 1998-09-22 Tessera, Inc. Socket for engaging bump leads on a microelectronic device and methods therefor
US5790378A (en) 1995-09-22 1998-08-04 National Semiconductor Corporation High density integrated circuit package including interposer
US5739581A (en) 1995-11-17 1998-04-14 National Semiconductor Corporation High density integrated circuit package assembly with a heatsink between stacked dies
KR0184076B1 (en) 1995-11-28 1999-03-20 김광호 Three-dimensional stacked package
US5754408A (en) * 1995-11-29 1998-05-19 Mitsubishi Semiconductor America, Inc. Stackable double-density integrated circuit assemblies
US5757079A (en) 1995-12-21 1998-05-26 International Business Machines Corporation Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure
JPH09214097A (en) * 1996-02-06 1997-08-15 Toshiba Corp Printed circuit board
JPH09245926A (en) 1996-03-08 1997-09-19 Shin Etsu Polymer Co Ltd Manufacture of heat seal connector
TW338180B (en) * 1996-03-29 1998-08-11 Mitsubishi Electric Corp Semiconductor and its manufacturing method
US5784260A (en) 1996-05-29 1998-07-21 International Business Machines Corporation Structure for constraining the flow of encapsulant applied to an I/C chip on a substrate
US5748452A (en) 1996-07-23 1998-05-05 International Business Machines Corporation Multi-electronic device package
JP3549340B2 (en) 1996-08-30 2004-08-04 新日本製鐵株式会社 Bump forming method and apparatus
DE19639025C2 (en) 1996-09-23 1999-10-28 Siemens Ag Chip module and method for producing a chip module
JPH10173122A (en) 1996-12-06 1998-06-26 Mitsubishi Electric Corp Memory module
US7149095B2 (en) * 1996-12-13 2006-12-12 Tessera, Inc. Stacked microelectronic assemblies
US6049972A (en) 1997-03-04 2000-04-18 Tessera, Inc. Universal unit strip/carrier frame assembly and methods
US6028352A (en) 1997-06-13 2000-02-22 Irvine Sensors Corporation IC stack utilizing secondary leadframes
US6014316A (en) 1997-06-13 2000-01-11 Irvine Sensors Corporation IC stack utilizing BGA contacts
US6107683A (en) 1997-06-20 2000-08-22 Substrate Technologies Incorporated Sequentially built integrated circuit package
JPH1197619A (en) 1997-07-25 1999-04-09 Oki Electric Ind Co Ltd Semiconductor device, manufacture thereof and mounting thereof
US5982633A (en) 1997-08-20 1999-11-09 Compaq Computer Corporation Opposed ball grid array mounting
JP2870528B1 (en) 1997-10-01 1999-03-17 日本電気株式会社 3D memory module
CA2218307C (en) 1997-10-10 2006-01-03 Gennum Corporation Three dimensional packaging configuration for multi-chip module assembly
JP3120763B2 (en) * 1997-11-12 2000-12-25 日本電気株式会社 Differential amplifier
US5869353A (en) * 1997-11-17 1999-02-09 Dense-Pac Microsystems, Inc. Modular panel stacking process
US5910885A (en) 1997-12-03 1999-06-08 White Electronic Designs Corporation Electronic stack module
US6222739B1 (en) * 1998-01-20 2001-04-24 Viking Components High-density computer module with stacked parallel-plane packaging
US6828666B1 (en) * 1998-03-21 2004-12-07 Advanced Micro Devices, Inc. Low inductance power distribution system for an integrated circuit chip
KR100266693B1 (en) 1998-05-30 2000-09-15 김영환 Stackable ball grid array semiconductor package and fabrication method thereof
US6428650B1 (en) 1998-06-23 2002-08-06 Amerasia International Technology, Inc. Cover for an optical device and method for making same
KR100514559B1 (en) 1998-07-01 2005-09-13 세이코 엡슨 가부시키가이샤 Semiconductor device, method of manufacture thereof, circuit board, and electronic device
JP2000031617A (en) 1998-07-10 2000-01-28 Hitachi Ltd Memory module and its manufacture
US6313522B1 (en) 1998-08-28 2001-11-06 Micron Technology, Inc. Semiconductor structure having stacked semiconductor devices
US6618267B1 (en) 1998-09-22 2003-09-09 International Business Machines Corporation Multi-level electronic package and method for making same
US6160718A (en) * 1998-12-08 2000-12-12 Viking Components Multi-chip package with stacked chips and interconnect bumps
US6081429A (en) 1999-01-20 2000-06-27 Micron Technology, Inc. Test interposer for use with ball grid array packages assemblies and ball grid array packages including same and methods
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
US6313998B1 (en) * 1999-04-02 2001-11-06 Legacy Electronics, Inc. Circuit board assembly having a three dimensional array of integrated circuit packages
US6222737B1 (en) * 1999-04-23 2001-04-24 Dense-Pac Microsystems, Inc. Universal package and method of forming the same
US6208526B1 (en) * 1999-07-23 2001-03-27 Motorola, Inc. Mounting multiple substrate frame and leadless surface mountable assembly using same
JP2001053243A (en) * 1999-08-06 2001-02-23 Hitachi Ltd Semiconductor memory device and memory module
JP2001062995A (en) 1999-08-30 2001-03-13 Minami Kk Screen printing machine
US6329220B1 (en) * 1999-11-23 2001-12-11 Micron Technology, Inc. Packages for semiconductor die
US6388335B1 (en) 1999-12-14 2002-05-14 Atmel Corporation Integrated circuit package formed at a wafer level
JP3681155B2 (en) 1999-12-22 2005-08-10 新光電気工業株式会社 Electronic component mounting structure, electronic component device, electronic component mounting method, and electronic component device manufacturing method
US6545868B1 (en) * 2000-03-13 2003-04-08 Legacy Electronics, Inc. Electronic module having canopy-type carriers
US7247932B1 (en) * 2000-05-19 2007-07-24 Megica Corporation Chip package with capacitor
US6683377B1 (en) * 2000-05-30 2004-01-27 Amkor Technology, Inc. Multi-stacked memory package
DE10029259A1 (en) 2000-06-14 2001-12-20 Orient Semiconductor Elect Ltd Stack module for chips has chips on top and bottom of stacked substrates enclosed by connections between substrates
US6404043B1 (en) 2000-06-21 2002-06-11 Dense-Pac Microsystems, Inc. Panel stacking of BGA devices to form three-dimensional modules
US6320757B1 (en) 2000-07-12 2001-11-20 Advanced Semiconductor Engineering, Inc. Electronic package
US6445591B1 (en) 2000-08-10 2002-09-03 Nortel Networks Limited Multilayer circuit board
US6665194B1 (en) 2000-11-09 2003-12-16 International Business Machines Corporation Chip package having connectors on at least two sides
US6543347B2 (en) 2001-01-10 2003-04-08 International Business Machines Corporation Apparatus for displacing an article during screening
US6559539B2 (en) 2001-01-24 2003-05-06 Hsiu Wen Tu Stacked package structure of image sensor
JP2002305284A (en) 2001-02-05 2002-10-18 Mitsubishi Electric Corp Semiconductor-device stacked structure
SG100635A1 (en) 2001-03-09 2003-12-26 Micron Technology Inc Die support structure
US6627984B2 (en) 2001-07-24 2003-09-30 Dense-Pac Microsystems, Inc. Chip stack with differing chip package types
US7323767B2 (en) * 2002-04-25 2008-01-29 Micron Technology, Inc. Standoffs for centralizing internals in packaging process
KR20040022063A (en) 2002-09-06 2004-03-11 주식회사 유니세미콘 A stack semiconductor package and it's manufacture method

Also Published As

Publication number Publication date
KR20030071764A (en) 2003-09-06
US7405471B2 (en) 2008-07-29
CN1483302A (en) 2004-03-17
US6713854B1 (en) 2004-03-30
WO2002034021A2 (en) 2002-04-25
US20040108590A1 (en) 2004-06-10
EP1329143A2 (en) 2003-07-23
JP4190279B2 (en) 2008-12-03
JP2004165617A (en) 2004-06-10
JP2004519843A (en) 2004-07-02
WO2002034021A3 (en) 2002-09-06
KR100645861B1 (en) 2006-11-14

Similar Documents

Publication Publication Date Title
AU2002213294A1 (en) Carrier-based electronic module
AU2001243426A1 (en) Electronic switch
AU2001229521A1 (en) Electronic provider-patient interface system
AU2001236895A1 (en) Integrated circuit
AUPQ564400A0 (en) Electronic credit card-ecc
AU2001269499A1 (en) Electronic poster system
AUPQ556600A0 (en) Electronic funds transfers-zipfund
AU2002301711A1 (en) Ejector circuit
EP1041715B8 (en) Electronic component
EP1143277A3 (en) Receptacle module
AU2002215886A1 (en) Multilayered hybrid electronic module
AU2001270594A1 (en) Filter module
AU5911200A (en) Circuit
AU2001280117A1 (en) Case for electronic parts
AU4878901A (en) Electronic tag
AU2002333632A1 (en) Tailgate module
AU2001285165A1 (en) Airbag module
AU3364201A (en) Electronic circuit
EP1199759A3 (en) Battery module
AU2002329164A1 (en) Electronic switching module
AU2000275768A1 (en) Electronic device
AU2001236941A1 (en) Electronic factoring
AU2001283994A1 (en) Electronic circuit
AU2000277689A1 (en) Electronic trade method
AU2001256840A1 (en) Learning board