JPH09245926A - Manufacture of heat seal connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate influence upon a flexible base member, facilitate dimensional control of a heat seal connector, and reduce the costs by hardening a thermo-setting resin at a low temp. without fear of its pot life. SOLUTION: A hardening agent or a resin binder containing containing hardening catalyst is applied to a flexible base material. Thereon a conductive paste containing hardening agent or a thermo-setting resin to react with hardening catalyst and an adhesive paste are provided. Thereby a conductive line and an anisotropically conducting means are formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection between electrodes of various circuit boards, particularly between electrodes of a substrate such as a liquid crystal display device and a plasma display and a circuit board on which a driving part thereof is mounted, or various types. The present invention relates to a method for manufacturing a heat seal connector used for connecting between electrodes of a circuit board.

[0002]

2. Description of the Related Art Conventionally, a heat seal connector as shown in FIGS. 2 and 3, for example, has been used for connection between electrodes of various circuit boards. In FIG. 2, the anisotropic conductive means is called anisotropic connection, and a conductive paste obtained by dissolving conductive powder and resin in a solvent is screen-printed on the flexible base material 21. , A conductive line 23 is formed, and a connection portion on the conductive line 23 [FIG.
In (a) both upper and lower sides], an adhesive paste composed of an adhesive 24 and conductive particles 25 is applied by screen printing, a roll coater or the like to form an anisotropic conductive adhesive layer 26, and a portion other than the connection site is formed. A resist film 27 is provided on the conductive lines 23 by screen-printing a resist paste. In FIG. 3, the anisotropic conductive means is called a monosotropic connection, and the conductive line 33 is formed by screen-printing a conductive paste containing conductive particles 35 on the flexible base material 31. Formed, the same adhesive paste as described above is applied to the entire surface by screen printing or a roll coater to form an adhesive layer 34, and then a resist paste is screen-printed if necessary, (in an imaginary line A resist film 37 is formed (in the area shown), and the remaining place is used as a connection site. In either case, the connection portion is thermocompression-bonded to the electrode of the substrate for electrical connection.

[0003]

The conductive line on the flexible base material constituting the heat seal connector is made of a thermosetting resin so as not to be melted or melted by heat when they are thermocompression bonded. Has been done. In addition, as the reliability of electronic devices has increased in recent years, heat resistance has also been required for adhesives and resist films, so these adhesives and resist films were also mixed with thermosetting resins. It has been transformed into thermoplastic and completely thermosetting. However, since the thermosetting resin has a short pot life, the resin and the curing agent are separately stored in two liquids at the time of screen printing or coating with a roll coater, and they are mixed immediately before the work to obtain a predetermined short time. It had to be used within the time, and it was complicated, and when the pot life was exceeded, the curing started and the material could not be used for printing or coating, increasing the material cost. In particular, the conductive line and the anisotropic conductive means contain precious metals such as gold and silver and are expensive, so that the cost is greatly affected.

Therefore, a resin has been proposed in which the functional group of the curing agent is chemically masked to extend the pot life to make it a one-pack type resin. However, this resin is used to start the curing reaction by removing the mask. Higher energy was required, especially high temperatures. However, such a high temperature makes it difficult to control the dimensions of the heat-sealed connector because the flexible base material is thin, and causes wrinkles and low molecular weight oligomers to be generated in the flexible base material. Moreover, the masked curing agent has low chemical stability, requires low temperature storage, and does not completely eliminate the pot life, so that the material cost is not significantly reduced. Therefore, the object of the present invention is to eliminate the influence on the flexible base material by curing at a lower temperature without fearing the pot life of the thermosetting resin, and to facilitate the dimensional control as a heat seal connector. It is an object of the present invention to provide a method for manufacturing a heat-seal connector, which can reduce the cost by eliminating waste of materials.

[0005]

In order to solve the above-mentioned problems, the present inventor has based on a completely new idea such as a method for fixing a curing agent to a flexible substrate, a fixing material and a method for activating the same.
As a result of conducting a wide range of research, instead of printing and coating a curing agent with a thermosetting resin as in the past, it is possible to pre-exist the curing agent only on a flexible substrate and then perform thermosetting. It was found that when the resin of (1) is printed and coated, the thermosetting resin is activated at the same time to start the curing, and the present invention has been completed. That is, in the method for manufacturing the heat-seal connector according to the present invention, a flexible base material is coated with a resin binder containing a curing agent and / or a curing catalyst, and then the curing agent and / or the curing catalyst is applied thereon. The present invention is characterized in that a conductive line and an anisotropic paste containing a reactive thermosetting resin are processed to form a conductive line and an anisotropic conductive means. According to the present invention, a thermosetting resin as a main material, a curing agent for curing the resin, and / or
Alternatively, by separately treating the curing catalyst and the flexible substrate on the flexible base material, the conductive paste and the adhesive paste are not trapped in the pot life, and curing at high temperature is not necessary. As a result, it is possible to facilitate dimensional control, reduce waste of materials, and reduce costs.

[0006]

DETAILED DESCRIPTION OF THE INVENTION The details of the present invention will be described below with reference to FIG. Note that FIG. 7A is a plan view, FIG. 8B is a vertical cross-sectional view taken along the line AA of FIG. 9A, and FIG. 9C is a vertical cross-sectional view taken along the line BB. In the figure, 1 is a flexible substrate, 2 is a layer of a resin binder containing a curing agent and / or a curing catalyst applied / formed on the flexible substrate 1, and 3 are arranged in parallel at a predetermined interval. The plurality of conductive lines are formed by screen printing using a conductive paste. At the terminal connection portion of the conductive line 3, there is an anisotropic conductive adhesive layer 6 formed in the same manner using an adhesive paste composed of an adhesive 4 and conductive particles 5, and the other conductive lines In a place where 3 is exposed, a resist film 7 similarly formed by using a resist paste can be provided to protect the conductive line 3 and ensure insulation.

The flexible substrate 1 used in the present invention may be any material having electrical insulation and flexibility. Examples of such materials include polyimide, polyethylene terephthalate, polycarbonate, polyphenylene sulfide, Polybutylene terephthalate, polyethylene naphthalate, poly-1,4-cyclohexane dimethylene terephthalate, polyarylate, liquid crystal polymer and the like can be used, and they can be used alone or in combination of two or more, but heat resistance, moisture resistance, Polyethylene terephthalate is generally used in terms of dimensional stability and economy. The thickness of the flexible substrate is usually 5 to 50 μm, but the flexibility,
In consideration of handleability, a particle size of 10 to 40 μm is preferable.

Next, a resin binder containing a curing agent and / or a curing catalyst is applied onto this flexible substrate. The curing agent and / or the curing catalyst used here is
It has a property of reacting or substituting with a reactive functional group of a thermosetting resin described later to cure the resin. Examples of such a curing agent include tolylene diisocyanate (TDI) and diphenylmethane diisocyanate. ,
These dimers and trimers, isocyanates such as polymethylene polyphenyl isocyanate; carboxylic acids such as maleic acid, succinic acid, sebacic acid, phthalic acid and pyromellitic acid; maleic anhydride, succinic anhydride, sebacic anhydride Carboxylic anhydrides such as phthalic anhydride and pyromellitic anhydride; 1,1,3,3-tetramethylbutylhydroperoxide, 2,5-dimethylhexane-2,5-dihydroperoxide, cyclohexanone peroxide, diqua Peroxides such as mill peroxide, benzoyl peroxide; alcohols such as 1,4-butanediol, 2,3-butanediol, 1,1,1-trimethylolpropane; 6-butylamino-1,3,5
-Thiols such as triazine-2,4-dithiol and 1,4-propanedithiol; triglycidyl isocyanurate,
Epoxy compounds such as ethylene glycol diglycidyl ether; sulfur chloride, 4,4'-dithiodimorpholine, N, N '
-Sulfur compounds such as dithiobis (hexahydro-2H-azebinone-2); amines such as diethylenetriamine, triethylenetriamine, 4,4'-diaminodiphenylmethane, m-phenylenediamine; trichloromelamine, hexachlorocyclopentadiene, trichloromethanesulfochloride Halogen compounds such as benzotrichloride;
Metal oxides such as zinc oxide and lead oxide; tetraisopropyl titanate, tetra-n-butyl titanate, tetra-n
Examples include metal alkoxides such as butoxyzirconium or organic metal compounds, silane compounds such as vinyltris (β-methoxyethoxy) silane, vinyltriacetylsilane, styryldiaminosilane, and aminodi (trimethyl) silane.

On the other hand, the curing catalyst includes, for example, metals such as selenium and tellurium; metal oxides such as magnesium oxide, zinc oxide, lead oxide (litharge, lead tin); 2-mercaptobenzothiazole, its zinc salt or copper. Sulfur compounds or organometallic compounds such as salts, tetramethylthiuram disulfide, zinc dimethyldithiocarbamate, tellurium diethyldithiocarbamate, ethylenethiourea (EUR), diethylthiourea, dibutyltin dilaurylate, tetra-n-butyltin; N, N'- Dimethylcyclohexylamine, N, N ', N "-tris (dimethylaminopropyl) hexahydro-S-hydrazine, dicyclohexylamine, monoethanolamine, triethylenediamine (TEDA), 1,
Amine such as 4-diazabicyclo-2,2,2-octane and 1,8-diazabicyclo-5,4,0-undecene-7; stearic acid
Fatty acids such as oleic acid and lauric acid; and metallic soaps such as calcium naphthenate and cobalt octylate. Each of these curing agents and curing catalysts is 1
Used alone or in combination of two or more.

As a method for applying a curing agent and / or a curing catalyst to a flexible substrate, a curing agent and / or a curing catalyst which does not react with the curing agent and / or a curing catalyst (for example, ethylene thiourea in polyester resin) is added to a resin binder, A method of dissolving and mixing in a solvent to apply and form on the surface of a flexible substrate,
There is a method of dissolving and mixing a resin binder and a curing agent and / or a curing catalyst (for example, tolylene diisocyanate in polyester resin) that reacts with the resin binder, and coating and forming it on the surface of a flexible substrate. . In the above method, in consideration of the amount of the curing agent lost by the reaction, a curing agent in an amount larger than the theoretical equivalent is mixed in advance with the resin binder to form a coating on the surface of the flexible substrate. In this case, the coating is usually performed at a solid content concentration of about 0.1 to 10% by weight, so that the molecular spacing between the resin binder and the curing agent is wide, the collision probability between them is low, the curing speed as a solution is slow, and the pot life is long. Since it is long, workability is not deteriorated. Further, the resin binder and the curing agent may not be completely cured, and a drying temperature sufficient to evaporate the solvent in which these are dissolved is sufficient. That is, at this stage, the curing agent may be present on the flexible substrate, and the resin binder for fixing the curing agent may be cured or uncured. Therefore, there is an advantage that work can be performed without worrying about pot life and dimensional changes.

The concentration of the curing agent and / or the curing catalyst in the resin binder is determined in consideration of the adhesiveness of the resin binder to the flexible substrate, the curing reactivity of the conductive line, the adhesive and the resist film. However, if the concentration of the curing agent and / or the curing catalyst is too high, the adhesion to the flexible substrate may be reduced and peeling may occur, so 90% by weight or less, particularly 80% by weight or less is preferable. On the contrary, if it is too low, the curing reaction will not proceed reliably, so 0.1% by weight or more, especially 1% by weight
It is better to do the above. The coating thickness is determined in consideration of the printability of the conductive paste, adhesive paste, resist paste and the reactivity of the curing reaction. If it is too thick, the surface may become rough and the printability may be impaired. , Especially 10 μm or less is preferable, and if it is too thin, the amount of curing agent / catalyst required for the reaction cannot be secured, so 0.1
It is preferable that the thickness is at least μm, especially at least 1 μm. As the resin binder used here, a resin selected from the same as the thermosetting resins contained in the conductive paste, adhesive paste and resist paste described later is used.

A thermosetting resin having a reactive functional group, which is contained in a conductive paste, an adhesive paste and a resist paste and reacts with the above curing agent and / or curing catalyst applied on a flexible substrate. For example, phenol resin, amino resin, epoxy resin, polyester resin, polyurethane resin, acrylic resin, polyamide resin, polyimide resin, natural rubber, butadiene rubber, chloroprene rubber, polysulfide rubber, diene rubber such as SBR, NBR Examples thereof include rubber-containing copolymers, and graft-polymerized modified products having various functional groups introduced therein. These thermosetting resins have hydroxyl groups, amino groups, carboxyl groups, cyano groups, mercapto groups, epoxy groups, isocyanate groups, halogen groups, acid anhydrides, double bonds, etc. It has a functional group.

When the thermosetting resin having this reactive functional group is contained in the conductive paste, the conductive line is formed on the flexible base material and, at the same time, the solvent in the conductive paste makes it flexible. The thermosetting resin on the base material is dissolved and swelled to activate the curing agent and / or curing catalyst, and this curing agent and / or curing catalyst causes a curing reaction or a curing accelerating reaction with the conductive paste, and Curing proceeds. The drying after forming the conductive line is sufficient to dry the solvent in the conductive paste, and the high temperature of curing required for curing is not necessary. The conductive paste can be obtained by adding conductive powder to the thermosetting resin and dissolving it in a solvent. As the conductive powder, silver, silver-plated copper, copper, gold, nickel, palladium, such as spherical, granular, scaly, plate-shaped, dendritic, dice-shaped, sponge-shaped particles having an outer diameter of 0.1 to 10 μm,
Further, those alloys, resin powders obtained by plating one or more of these, carbon blacks such as furnace black and channel black, and graphite powders and the like, which are appropriately selected from one or two or more, may be mentioned. The thermosetting resin is dispersed and mixed in a proportion of 10 to 90% by weight. Further, if necessary, additives such as a leveling agent, a dispersion stabilizer, an antifoaming agent and a thixotropic agent may be appropriately added. The proportion of each component in the conductive paste is preferably 5 to 30% by weight of the thermosetting resin, 50 to 90% by weight of conductive powder, and 10 to 40% by weight of solvent.

After that, an anisotropic conductive means (and a resist film) is formed by using an adhesive paste containing a thermosetting resin similarly having a reactive functional group (and a resist paste if necessary). If done, the heat seal connector of the present invention can be obtained. As a method for forming the conductive lines, the adhesive layer and the resist film, screen printing or roll coating is used as in the conventional method, and no special method is required. The ratio of each component in the adhesive paste is 5 to 50% by weight of the thermosetting resin, 1 to 50% by weight of additives such as deterioration inhibitor, heat resistance additive, tackifier, softening agent, coloring agent, and solvent. 40-70% by weight, the proportion of each component in the resist paste is 5-50% by weight of the thermosetting resin, the same additive 1-50% by weight as that added to the adhesive paste,
The solvent is preferably 20 to 70% by weight. As the conductive particles used for the anisotropic conductive means, gold, silver, copper, nickel, palladium, stainless steel, brass, metal particles such as solder, ceramic particles such as tungsten carbide, silica carbide, the surface of the above metal For example, coated plastic particles are used. Curing agent and / or
Alternatively, if the curing catalyst is a combination that does not start the curing reaction only with the curing catalyst (for example, polyester resin + tertiary amine) or a combination that does not cure without both the curing agent and the curing catalyst, one of these is used. May be mixed in the conductive paste, adhesive paste or resist paste.

As a solvent for a resin binder for a curing agent and / or a curing catalyst, a conductive paste, an adhesive paste or a resist paste, ester-based, ketone-based, ether ester-based, chlorine-based, ether-based, alcohol-based,
Hydrocarbon-based, such as methyl acetate, ethyl acetate,
Isopropyl acetate, isobutyl acetate, butyl acetate, amyl acetate, methyl ethyl ketone, methyl isobutyl ketone, methyl isoamyl ketone, methyl amyl ketone, ethyl amyl ketone, isobutyl ketone, methoxymethylpentanone, cyclohexanone, diacetoalcohol,
Methyl cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, methoxybutyl acetate, methyl carbitol acetate, ethyl carbitol acetate, dibutyl carbitol acetate, trichloroethane, trichloroethylene, n
-Butyl ether, diisoamyl ether, n-butyl phenyl ether, propylene oxide, furfural, isopropyl alcohol, isobutyl alcohol,
Examples include amyl alcohol, cyclohexanol, benzene, toluene, xylene, isopropylbenzene, petroleum spirit, petroleum naphtha and the like.

The difference in SP value between the resin binder for fixing the curing agent and / or the curing catalyst and the conductive paste, adhesive paste and resist paste which is cured by the curing agent and / or the curing catalyst is within ± 2. And the difference in SP value between the thermosetting resin and the solvent that dissolves the resin is within ± 2.
When the difference between these SP values is more than ± 2, when the conductive paste, the adhesive paste, the resist paste and the resin binder are applied, the curing agent in the resin binder cannot be activated, and the curing of these The reaction does not proceed and the curing is insufficient. As a result, the heat resistance of the conductive line, the adhesive layer, and the resist film may not be improved.

[0017]

EXAMPLES Specific embodiments of the present invention will be described below with reference to examples and comparative examples. 1) Immobilization of curing agent and / or curing catalyst on a flexible substrate: 100 g of saturated polyester resin having an acid value of 1 and an OH value of 1,0
0.5g of powdered sulfur dissolved in 00g of methyl ethyl ketone,
1 g of EUR was mixed, coated on a PET film having a thickness of 25 μm with a bar coater, and dried. The thickness of the resin binder after drying was 5 μm. 100 g of saturated polyester resin with an acid value of 1 and OH value of 4 is dissolved in 1,000 g of methyl ethyl ketone, and 6.4 g of TDI trimer is mixed to obtain a PET film having a thickness of 25 μm.
The film was coated with a bar coater and dried. The thickness of the resin binder after drying was 5 μm. 2) Production of conductive paste: 100 g of chloroprene, 4 g of magnesium oxide, 5 g of zinc oxide, 700 g of scale-like silver powder, and butyl cellosolve acetate.
Dissolved in 200 g and mixed to obtain a conductive paste. 100 g of saturated polyester resin with acid value 1 and OH value 4, TEDA
0.1g, scale-like silver powder 700g, butyl cellosolve acetate
A conductive paste was obtained by dissolving and mixing in 200 g.

3) Production of adhesive paste: 100 g of chloroprene, 4 g of magnesium oxide, 5 g of zinc oxide, 50 g of styrene / ethylene / butylene / styrene copolymer (SEBS), 40 g of terpene phenol resin, and gold-plated nickel particles having an average particle size of 20 μm. 5 g was dissolved and mixed in 300 g of butyl cellosolve acetate to obtain an anisotropic conductive adhesive paste. 100 g of saturated polyester resin with acid value 1 and OH value 4, TEDA
0.1 g, 50 g of NBR, and 5 g of gold-plated nickel particles having an average particle size of 20 μm were dissolved and mixed in 175 g of butyl cellosolve acetate to obtain an anisotropic conductive adhesive paste. 4) Production of resist paste 100 g of chloroprene, 4 g of magnesium oxide, 5 g of zinc oxide and 50 g of SEBS were dissolved in 250 g of butyl cellosolve acetate and mixed to obtain a resist paste. 100 g of saturated polyester resin with acid value 1 and OH value 4, TEDA
0.1 g and SEBS 50 g were dissolved in butyl cellosolve acetate 250 g and mixed to obtain a resist paste.

5) Production of heat seal connector (Example 1) After fixing the curing agent and / or the curing catalyst on the flexible substrate as described above, screen printing with the above-mentioned conductive paste was performed thereon. Conductive lines with a pitch of 0.3 mm were formed, passed through an infrared oven having a furnace length of 3 m and having a peak temperature on the film of 140 ° C. for 2 minutes, and dried and cured. Next, the adhesive paste was formed on the connection terminal portion of the conductive line by screen printing, dried and cured using the same infrared furnace as above. Further, a resist film was formed on the exposed portion of the conductive line by screen printing with the above resist paste, and similarly dried and cured to obtain the heat seal connector of Example 1.

(Example 2) After fixing the curing agent and / or the curing catalyst on the flexible substrate as described above, 0.3 mm pitch conductive lines were formed thereon by screen printing with the conductive paste. Formed and the peak temperature on the film is
It was dried and cured by passing through an infrared furnace having a furnace length of 3 m and having a temperature of 140 ° C. for 2 minutes. Next, the adhesive paste was formed on the connection terminal portion of the conductive line by screen printing, dried and cured using the same infrared furnace as above. Further, a resist film is formed on the exposed portion of the conductive line by screen printing with the above resist paste, and similarly dried,
When cured, a heat seal connector of Example 2 was obtained.

(Comparative Example 1) The above conductive paste 1,000
4.3 g of TDI trimer was mixed in g, and 0.3 mm was obtained by screen printing on PET film on which no curing agent was fixed.
Pitch conductive lines were formed, passed through an infrared furnace having a furnace length of 3 m and having a peak temperature on the film of 140 ° C. for 2 minutes, and dried and cured. The pot life (screen printable time) of this conductive paste was 1 hour. Next, 4.3 g of a trimer of TDI was mixed with 325 g of the adhesive paste, formed by screen printing on the connection terminal portion of the conductive line, dried and cured using the same infrared furnace as above.
The pot life (screen printable time) of this adhesive paste was 1 hour. In addition, 400 g of the above resist paste was added to the exposed part of the conductive line and 3 of TDI
4.3 g of the monomer was mixed, a resist film was formed by screen printing, and similarly dried and cured to obtain a heat seal connector of Comparative Example 1. The pot life (screen printable time) of this resist paste was 1 hour.

(Comparative Example 2) The above conductive paste 1,000
5g of phenol-masked TDI trimer was mixed in g to form a 0.3mm pitch conductive line on the PET film on which the curing agent was not fixed by screen printing, and the peak temperature on the film was 140 ℃. Was passed through an infrared furnace having a furnace length of 3 m for 2 minutes to dry and cure. The pot life (screen printable time) of this conductive paste was 5 hours. Connect this conductive line to a hot air drying oven at 150 ° C.
It was left for a time to complete the curing of the conductive line. Phenol-masked TDI in 325 g of the following adhesive paste
5 g of the above trimer was mixed, formed by screen printing on the connection terminal portion of the conductive line, dried and cured using the same infrared furnace as above. The pot life (screen printable time) of this anisotropic conductive adhesive paste was 5 hours.
This anisotropic conductive adhesive was left in a hot air drying oven at 150 ° C. for 3 hours to complete the curing of the anisotropic conductive adhesive. Further, on the exposed portion of the conductive line, the above-mentioned resist paste 400
5g of phenol-masked TDI trimer is mixed with
A resist film was formed by screen printing, and similarly dried and cured. The pot life (screen printable time) of this resist paste was 5 hours. This resist film was allowed to stand in a hot air drying oven at 150 ° C. for 3 hours to complete the curing of the resist film to obtain a heat seal connector of Comparative Example 2.

6) Evaluation of heat-sealing connector The total pitch dimension (each n = 1) of the heat-sealing connectors obtained in Examples 1 and 2 and Comparative Examples 1 and 2.
0), pot life of each paste used (viscosity 1,000
Time to reach P), workability, amount of discarded paste (
We measured and evaluated the total amount of each paste that could not be used after the pot life to make 1,000 products.
The results are shown in Table 1.

[0024]

[Table 1]

[0025]

According to the method for manufacturing a heat-seal connector of the present invention, even if a thermosetting resin which has been required in recent years is used for the conductive line, the anisotropic conductive means and the resist film, the pot life is restricted. Without the need for discarding expensive conductive paste or adhesive paste, the cost can be reduced and an inexpensive heat seal connector can be supplied. Furthermore, since the curing due to high heat for thermosetting is not required, the dimension control is easy, and the time for curing is not required, so that the cycle time of the process can be improved.

[Brief description of drawings]

1A and 1B show an example of a heat seal connector obtained by the method of the present invention, FIG. 1A is a plan view, and FIG. 1B is a vertical sectional view taken along the line AA of FIG. 1A. FIG. 6C is a vertical sectional view taken along the line BB of FIG.

2A and 2B show an example of a heat seal connector obtained by a conventional method, where FIG. 2A is a plan view and FIG.
Is a vertical cross-sectional view taken along the line C-C of FIG. (A), and FIG. (C) is a vertical cross-sectional view taken along the line D-D of FIG.

3A and 3B show another example of a heat seal connector obtained by a conventional method, in which FIG. 3A is a plan view and FIG. 3B is a vertical sectional view taken along the line EE of FIG. 3A. Is.

[Explanation of symbols]

1, 21, 31 ... Flexible substrate, 2 ... Layer of resin binder,
3, 23, 33 ... Conductive line, 4, 24, 34 ... Adhesive layer, 5,
25, 35 ... Conductive particles, 6, 26 ... Anisotropic conductive adhesive layer, 7, 2
7, 37 ... Resist film.

Claims (1)

Reference number P395095 [Claims] 1. A flexible base material is coated with a resin binder containing a curing agent and / or a curing catalyst, and a thermosetting resin that reacts with the curing agent and / or the curing catalyst is further coated thereon. A method for manufacturing a heat-seal connector, characterized in that a conductive line and an anisotropic conductive means are formed by treating the contained conductive paste and adhesive paste.