AU2002212737A1 - Hollow laminate and heat sink using the same - Google Patents

Hollow laminate and heat sink using the same

Info

Publication number
AU2002212737A1
AU2002212737A1 AU2002212737A AU1273702A AU2002212737A1 AU 2002212737 A1 AU2002212737 A1 AU 2002212737A1 AU 2002212737 A AU2002212737 A AU 2002212737A AU 1273702 A AU1273702 A AU 1273702A AU 2002212737 A1 AU2002212737 A1 AU 2002212737A1
Authority
AU
Australia
Prior art keywords
same
heat sink
hollow laminate
laminate
hollow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002212737A
Other languages
English (en)
Inventor
Tsuguo Kawamura
Shinji Ohsawa
Hiroaki Okamoto
Kinji Saijo
Kazuo Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Kohan Co Ltd
Original Assignee
Toyo Kohan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Kohan Co Ltd filed Critical Toyo Kohan Co Ltd
Publication of AU2002212737A1 publication Critical patent/AU2002212737A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/24—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Discharge Lamp (AREA)
AU2002212737A 2000-11-13 2001-11-09 Hollow laminate and heat sink using the same Abandoned AU2002212737A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000344643 2000-11-13
JP2000-344643 2000-11-13
PCT/JP2001/009797 WO2002039046A1 (fr) 2000-11-13 2001-11-09 Lamine creux et puits thermique utilisant ce lamine

Publications (1)

Publication Number Publication Date
AU2002212737A1 true AU2002212737A1 (en) 2002-05-21

Family

ID=18818809

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002212737A Abandoned AU2002212737A1 (en) 2000-11-13 2001-11-09 Hollow laminate and heat sink using the same

Country Status (7)

Country Link
US (1) US20040069463A1 (fr)
EP (1) EP1335172A1 (fr)
JP (1) JPWO2002039046A1 (fr)
KR (1) KR20030096234A (fr)
CN (1) CN1474928A (fr)
AU (1) AU2002212737A1 (fr)
WO (1) WO2002039046A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010054016A1 (de) * 2010-12-10 2012-06-14 Ziemek Cable Technology Gmbh Verfahren zum Verbinden eines Aluminiumbandes mit einem Kupferband
KR101227014B1 (ko) * 2011-01-12 2013-01-28 한국기계연구원 고강도 고전기전도도 나노결정립 다층 동합금 판재 및 이의 제조방법
EP2677261B1 (fr) * 2012-06-20 2018-10-10 ABB Schweiz AG Système de refroidissement biphasé pour composants électroniques
CN107994292A (zh) * 2017-11-27 2018-05-04 常州常发制冷科技有限公司 用于汽车电池散热的底冷板
CN108453362A (zh) * 2018-03-07 2018-08-28 哈尔滨工业大学（威海） 一种铝合金表面活化辅助直接扩散焊方法
CN112015249A (zh) * 2019-05-29 2020-12-01 华为技术有限公司 一种导热件及电子设备
CN110369854B (zh) * 2019-08-08 2022-08-30 广东省纵鑫电子科技有限公司 热压式复合散热板的制作工艺
CN110385382A (zh) * 2019-08-08 2019-10-29 东莞市纵鑫电子科技有限公司 冲压与热压相结合之复合散热板的制作工艺
CN113319533A (zh) * 2021-06-07 2021-08-31 楚岳(惠州)热传科技有限公司 用于服务器的散热器组件制备工艺

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3053514A (en) * 1949-11-18 1962-09-11 Olin Mathieson Sheet metal fabrications
US2795402A (en) * 1951-01-13 1957-06-11 Modine Mfg Co Fluid conduit structure
US3136037A (en) * 1955-10-31 1964-06-09 Olin Mathieson Method of constructing finned heat exchangers from bonded metal sheets
US2857659A (en) * 1955-12-01 1958-10-28 Reynolds Metals Co Expansion of pressure welded passageway panels
US2859509A (en) * 1956-02-24 1958-11-11 Olin Mathieson Fabrication of hollow articles
US2966728A (en) * 1956-03-16 1961-01-03 Reynolds Metals Co Method of making pressure welded expanded passageway panels
US3173195A (en) * 1957-02-19 1965-03-16 Jerome H Lemelson Method of making ducted panelling
US2828533A (en) * 1956-12-19 1958-04-01 Howard A Fromson Method of making integral sheet and tubing products
US3222763A (en) * 1960-02-26 1965-12-14 Olin Mathieson Method of making a hollow article
US3394446A (en) * 1965-08-30 1968-07-30 Olin Mathieson Method of making composite metal structure
US4220276A (en) * 1978-08-25 1980-09-02 Rockwell International Corporation Method for fabricating superplastically formed/diffusion bonded structures
US4209886A (en) * 1978-08-28 1980-07-01 Olin Corporation Process and apparatus for making heat exchanger panels
JPS5971994A (ja) * 1982-10-19 1984-04-23 Nippon Alum Mfg Co Ltd:The 多条膨管式熱交換素板およびその製造法
US4678027A (en) * 1984-12-14 1987-07-07 Paul Mueller Company Dual-walled coiled plate heat exchanger with vented interface
JPH08296986A (ja) * 1995-04-26 1996-11-12 Tokuden Co Ltd 均温平板装置
TW346566B (en) * 1996-08-29 1998-12-01 Showa Aluminiun Co Ltd Radiator for portable electronic apparatus
JPH1137678A (ja) * 1997-07-22 1999-02-12 Showa Alum Corp ヒートパイプ式放熱器
JPH11304381A (ja) * 1998-04-23 1999-11-05 Fujikura Ltd ヒートパイプ
JP2000039273A (ja) * 1998-07-24 2000-02-08 Showa Alum Corp 板状熱交換器
JP2000161878A (ja) * 1998-11-30 2000-06-16 Furukawa Electric Co Ltd:The 平面型ヒートパイプ
US6679316B1 (en) * 2000-10-02 2004-01-20 The United States Of America As Represented By The Secretary Of The Air Force Passive thermal spreader and method
JP7055384B2 (ja) * 2016-12-16 2022-04-18 株式会社エイクラ通信 動揺測定システム

Also Published As

Publication number Publication date
JPWO2002039046A1 (ja) 2004-03-18
KR20030096234A (ko) 2003-12-24
CN1474928A (zh) 2004-02-11
US20040069463A1 (en) 2004-04-15
EP1335172A1 (fr) 2003-08-13
WO2002039046A1 (fr) 2002-05-16

Similar Documents

Publication Publication Date Title
AU2001286632A1 (en) Thermal cycler
AU2002249990A1 (en) Selectively biased tool and methods of using the same
AU2001278689A1 (en) Integrated heat exchanger
AU2002219135A1 (en) Substituted 2-anilino-benzimidazoles and the use thereof as NHE-inhibitors
AU2001264258A1 (en) Nonwoven-fabric laminate and use thereof
AU2001240637A1 (en) Novel imidazotriazinones and the use thereof
AU2002211717A1 (en) Stresscopins and their uses
AU2003273520A1 (en) Transformer and transformer unit having the same
AU2001292936A1 (en) Octahydro-indolizines and quinolizines and hexahydro-pyrrolizines
AU2001261750A1 (en) Laminate and its use
AU7458201A (en) Laminate and use thereof
AU2002212737A1 (en) Hollow laminate and heat sink using the same
AU2002213429A1 (en) Antiviral methods and compounds
AU2001295185A1 (en) Multiplexing-interleaving and demultiplexing-deinterleaving
AU2002224876A1 (en) Isolated luciferases and the use thereof
AU2001240394A1 (en) Energy element
AU2000231564A1 (en) Phosphororganic compounds and the use thereof
AU2001276258A1 (en) Ceramic component and the use thereof
AU2001295422A1 (en) Heat cabin
AU6042601A (en) Compounds and their uses
AU2001277689A1 (en) The easy-parker-indicator
GB0104881D0 (en) Heat shrinkable laminate
AU2001222340A1 (en) Heat sink
AU2001225610A1 (en) Thin-webbed profile member and panel using the same
TW474558U (en) Heat sink structure