AU2001296662A1 - Amorphized barrier layer for integrated circuit interconnects - Google Patents

Amorphized barrier layer for integrated circuit interconnects

Info

Publication number
AU2001296662A1
AU2001296662A1 AU2001296662A AU9666201A AU2001296662A1 AU 2001296662 A1 AU2001296662 A1 AU 2001296662A1 AU 2001296662 A AU2001296662 A AU 2001296662A AU 9666201 A AU9666201 A AU 9666201A AU 2001296662 A1 AU2001296662 A1 AU 2001296662A1
Authority
AU
Australia
Prior art keywords
integrated circuit
barrier layer
circuit interconnects
amorphized
amorphized barrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001296662A
Inventor
Sergey D. Lopatin
Minh Van Ngo
Minh Quoc Tran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2001296662A1 publication Critical patent/AU2001296662A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76853—Barrier, adhesion or liner layers characterized by particular after-treatment steps
    • H01L21/76861—Post-treatment or after-treatment not introducing additional chemical elements into the layer
    • H01L21/76862—Bombardment with particles, e.g. treatment in noble gas plasmas; UV irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
    • H01L21/76873—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroplating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53214—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
    • H01L23/53223—Additional layers associated with aluminium layers, e.g. adhesion, barrier, cladding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
AU2001296662A 2000-11-18 2001-10-04 Amorphized barrier layer for integrated circuit interconnects Abandoned AU2001296662A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/715,702 2000-11-18
US09/715,702 US6348732B1 (en) 2000-11-18 2000-11-18 Amorphized barrier layer for integrated circuit interconnects
PCT/US2001/031297 WO2002041391A2 (en) 2000-11-18 2001-10-04 Amorphized barrier layer for integrated circuit interconnects

Publications (1)

Publication Number Publication Date
AU2001296662A1 true AU2001296662A1 (en) 2002-05-27

Family

ID=24875137

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001296662A Abandoned AU2001296662A1 (en) 2000-11-18 2001-10-04 Amorphized barrier layer for integrated circuit interconnects

Country Status (4)

Country Link
US (2) US6348732B1 (en)
AU (1) AU2001296662A1 (en)
TW (1) TW533486B (en)
WO (1) WO2002041391A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6465867B1 (en) * 2001-02-21 2002-10-15 Advanced Micro Devices, Inc. Amorphous and gradated barrier layer for integrated circuit interconnects
US6541860B1 (en) * 2001-06-05 2003-04-01 Advanced Micro Devices, Inc. Barrier-to-seed layer alloying in integrated circuit interconnects
US6653236B2 (en) * 2002-03-29 2003-11-25 Micron Technology, Inc. Methods of forming metal-containing films over surfaces of semiconductor substrates; and semiconductor constructions
US7341947B2 (en) * 2002-03-29 2008-03-11 Micron Technology, Inc. Methods of forming metal-containing films over surfaces of semiconductor substrates
DE10241154A1 (en) 2002-09-05 2004-03-11 Infineon Technologies Ag Integrated switching arrangement comprises a metallization layer, a conducting pathway dielectric, a conducting pathway intermediate material, conducting connecting sections, dielectric, and connecting section intermediate material
US7566964B2 (en) * 2003-04-10 2009-07-28 Agere Systems Inc. Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures
EP1793013B1 (en) * 2005-12-05 2017-07-19 Rohm and Haas Electronic Materials LLC Metallization of dielectrics
US8304863B2 (en) 2010-02-09 2012-11-06 International Business Machines Corporation Electromigration immune through-substrate vias
US8907483B2 (en) 2012-10-10 2014-12-09 Globalfoundries Inc. Semiconductor device having a self-forming barrier layer at via bottom

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326511A (en) * 1992-05-18 1993-12-10 Oki Electric Ind Co Ltd Manufacture method of semiconductor element
KR0144956B1 (en) * 1994-06-10 1998-08-17 김광호 Forming method of wiring
KR100243286B1 (en) * 1997-03-05 2000-03-02 윤종용 Method for manufacturing a semiconductor device
US6136682A (en) * 1997-10-20 2000-10-24 Motorola Inc. Method for forming a conductive structure having a composite or amorphous barrier layer
US5882738A (en) * 1997-12-19 1999-03-16 Advanced Micro Devices, Inc. Apparatus and method to improve electromigration performance by use of amorphous barrier layer
US6870263B1 (en) * 1998-03-31 2005-03-22 Infineon Technologies Ag Device interconnection
US6181012B1 (en) * 1998-04-27 2001-01-30 International Business Machines Corporation Copper interconnection structure incorporating a metal seed layer
JP3221397B2 (en) * 1998-05-21 2001-10-22 日本電気株式会社 Method for manufacturing semiconductor device
US6150268A (en) * 1998-11-04 2000-11-21 Advanced Micro Devices, Inc. Barrier materials for metal interconnect
US6184137B1 (en) * 1998-11-25 2001-02-06 Applied Materials, Inc. Structure and method for improving low temperature copper reflow in semiconductor features
JP2000183064A (en) * 1998-12-16 2000-06-30 Matsushita Electronics Industry Corp Semiconductor device and manufacture thereof
US6294836B1 (en) * 1998-12-22 2001-09-25 Cvc Products Inc. Semiconductor chip interconnect barrier material and fabrication method
US6380084B1 (en) * 2000-10-02 2002-04-30 Chartered Semiconductor Manufacturing Inc. Method to form high performance copper damascene interconnects by de-coupling via and metal line filling

Also Published As

Publication number Publication date
WO2002041391A3 (en) 2003-01-09
TW533486B (en) 2003-05-21
US6583051B2 (en) 2003-06-24
US20020061644A1 (en) 2002-05-23
US6348732B1 (en) 2002-02-19
WO2002041391A2 (en) 2002-05-23

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