AU2001293294A1 - Real time monitoring for simultaneous imaging and exposure in charged particle beam systems - Google Patents

Real time monitoring for simultaneous imaging and exposure in charged particle beam systems

Info

Publication number
AU2001293294A1
AU2001293294A1 AU2001293294A AU9329401A AU2001293294A1 AU 2001293294 A1 AU2001293294 A1 AU 2001293294A1 AU 2001293294 A AU2001293294 A AU 2001293294A AU 9329401 A AU9329401 A AU 9329401A AU 2001293294 A1 AU2001293294 A1 AU 2001293294A1
Authority
AU
Australia
Prior art keywords
exposure
real time
charged particle
particle beam
time monitoring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001293294A
Inventor
Peter S. Chao
Steve Rosenberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FEI Co
Original Assignee
FEI Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FEI Co filed Critical FEI Co
Publication of AU2001293294A1 publication Critical patent/AU2001293294A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002—Details
    • H01J37/3005—Observing the objects or the point of impact on the object
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/304—Controlling tubes
    • H01J2237/30466—Detecting endpoint of process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
AU2001293294A 2000-09-20 2001-09-20 Real time monitoring for simultaneous imaging and exposure in charged particle beam systems Abandoned AU2001293294A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23400100P 2000-09-20 2000-09-20
US60234001 2000-09-20
PCT/US2001/042233 WO2002025692A1 (en) 2000-09-20 2001-09-20 Real time monitoring for simultaneous imaging and exposure in charged particle beam systems

Publications (1)

Publication Number Publication Date
AU2001293294A1 true AU2001293294A1 (en) 2002-04-02

Family

ID=22879471

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001293294A Abandoned AU2001293294A1 (en) 2000-09-20 2001-09-20 Real time monitoring for simultaneous imaging and exposure in charged particle beam systems

Country Status (5)

Country Link
US (1) US6649919B2 (en)
EP (1) EP1332510B1 (en)
JP (2) JP2004510295A (en)
AU (1) AU2001293294A1 (en)
WO (1) WO2002025692A1 (en)

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US7279046B2 (en) * 2002-03-27 2007-10-09 Nanoink, Inc. Method and apparatus for aligning patterns on a substrate
US7081369B2 (en) * 2003-02-28 2006-07-25 Intel Corporation Forming a semiconductor device feature using acquired parameters
US9159527B2 (en) 2003-10-16 2015-10-13 Carl Zeiss Microscopy, Llc Systems and methods for a gas field ionization source
US8110814B2 (en) 2003-10-16 2012-02-07 Alis Corporation Ion sources, systems and methods
JP4426871B2 (en) * 2004-02-25 2010-03-03 エスアイアイ・ナノテクノロジー株式会社 Image noise removal of FIB / SEM combined device
US6952014B1 (en) * 2004-04-06 2005-10-04 Qualcomm Inc End-point detection for FIB circuit modification
US7381968B2 (en) * 2004-04-16 2008-06-03 Hitachi High-Technologies Corporation Charged particle beam apparatus and specimen holder
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DE102004049518B3 (en) * 2004-10-11 2006-02-02 Infineon Technologies Ag Method for deep-resolved characterization of a layer of a carrier
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US7388218B2 (en) * 2005-04-04 2008-06-17 Fei Company Subsurface imaging using an electron beam
JP5431634B2 (en) * 2005-05-14 2014-03-05 エフ・イ−・アイ・カンパニー Compensation of deflection signal of charged particle beam
US7358510B2 (en) 2006-03-27 2008-04-15 Varian Semiconductor Equipment Associates, Inc. Ion implanter with variable scan frequency
US8093567B2 (en) * 2006-07-21 2012-01-10 Fibics Incorporated Method and system for counting secondary particles
US8975599B2 (en) * 2007-05-03 2015-03-10 Asml Netherlands B.V. Image sensor, lithographic apparatus comprising an image sensor and use of an image sensor in a lithographic apparatus
US7496885B1 (en) 2008-04-02 2009-02-24 International Business Machines Corporation Method of compensating for defective pattern generation data in a variable shaped electron beam system
US8106355B1 (en) * 2008-06-27 2012-01-31 Kla-Tencor Corporation Automated inspection using cell-cell subtraction perpendicular to stage motion direction
WO2010135444A2 (en) * 2009-05-20 2010-11-25 Carl Zeiss Nts, Llc Simultaneous sample modification and monitoring
WO2011025998A2 (en) 2009-08-28 2011-03-03 Fei Company Pattern modification schemes for improved fib patterning
DE102009055271A1 (en) * 2009-12-23 2011-06-30 Carl Zeiss NTS GmbH, 73447 Method for generating a representation of an object by means of a particle beam and particle beam apparatus for carrying out the method
JP5292348B2 (en) * 2010-03-26 2013-09-18 株式会社日立ハイテクノロジーズ Compound charged particle beam system
EP2575159B1 (en) * 2011-09-30 2016-04-20 Carl Zeiss Microscopy GmbH Particle beam system and method for operating the same
DE102012000650A1 (en) 2012-01-16 2013-07-18 Carl Zeiss Microscopy Gmbh METHOD AND DEVICE FOR ABRASING A SURFACE OF AN OBJECT WITH A PARTICLE BEAM
WO2014014446A1 (en) * 2012-07-16 2014-01-23 Fei Company Endpointing for focused ion beam processing
JP6250294B2 (en) * 2013-03-28 2017-12-20 株式会社日立ハイテクサイエンス Focused ion beam device, sample cross-section observation method using the same, and computer program for sample cross-section observation using a focused ion beam
EP2838107B1 (en) 2013-08-14 2016-06-01 Fei Company Circuit probe for charged particle beam system
WO2017183126A1 (en) * 2016-04-20 2017-10-26 株式会社日立製作所 Device machining method and device machining apparatus
JP6867015B2 (en) * 2017-03-27 2021-04-28 株式会社日立ハイテクサイエンス Automatic processing equipment
US11532760B2 (en) 2017-05-22 2022-12-20 Howmedica Osteonics Corp. Device for in-situ fabrication process monitoring and feedback control of an electron beam additive manufacturing process
AU2019206103A1 (en) 2018-07-19 2020-02-06 Howmedica Osteonics Corp. System and process for in-process electron beam profile and location analyses
US11848173B1 (en) * 2023-01-31 2023-12-19 Integrated Dynamic Electron Solutions, Inc. Methods and systems for event modulated electron microscopy

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JP3535394B2 (en) * 1998-10-27 2004-06-07 株式会社日立製作所 Beam scanning inspection equipment

Also Published As

Publication number Publication date
EP1332510A4 (en) 2007-04-04
WO2002025692A1 (en) 2002-03-28
EP1332510B1 (en) 2011-11-16
JP2004510295A (en) 2004-04-02
JP2013138023A (en) 2013-07-11
JP5675875B2 (en) 2015-02-25
US6649919B2 (en) 2003-11-18
US20020066863A1 (en) 2002-06-06
EP1332510A1 (en) 2003-08-06

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