AU2001293221A1 - Method for making micromechanical structures having at least one lateral, small gap therebetween and micromechanical device produced thereby - Google Patents

Method for making micromechanical structures having at least one lateral, small gap therebetween and micromechanical device produced thereby

Info

Publication number
AU2001293221A1
AU2001293221A1 AU2001293221A AU9322101A AU2001293221A1 AU 2001293221 A1 AU2001293221 A1 AU 2001293221A1 AU 2001293221 A AU2001293221 A AU 2001293221A AU 9322101 A AU9322101 A AU 9322101A AU 2001293221 A1 AU2001293221 A1 AU 2001293221A1
Authority
AU
Australia
Prior art keywords
micromechanical
lateral
gap therebetween
small gap
device produced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001293221A
Other languages
English (en)
Inventor
John R Clark
Wan-Thai Hsu
Clark T.-C. Nguyen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Michigan
Original Assignee
University of Michigan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Michigan filed Critical University of Michigan
Publication of AU2001293221A1 publication Critical patent/AU2001293221A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/0019—Flexible or deformable structures not provided for in groups B81C1/00142 - B81C1/00182
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00626—Processes for achieving a desired geometry not provided for in groups B81C1/00563 - B81C1/00619
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/013—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for obtaining desired frequency or temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H9/02338—Suspension means
    • H03H9/02362—Folded-flexure
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2436—Disk resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/462—Microelectro-mechanical filters
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/48—Coupling means therefor
    • H03H9/50—Mechanical coupling means
    • H03H9/505—Mechanical coupling means for microelectro-mechanical filters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0271—Resonators; ultrasonic resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0307—Anchors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02488—Vibration modes
    • H03H2009/02496—Horizontal, i.e. parallel to the substrate plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Acoustics & Sound (AREA)
  • Geometry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
AU2001293221A 2000-08-24 2001-08-24 Method for making micromechanical structures having at least one lateral, small gap therebetween and micromechanical device produced thereby Abandoned AU2001293221A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22750700P 2000-08-24 2000-08-24
US60/227,507 2000-08-24
PCT/US2001/041874 WO2002016256A2 (fr) 2000-08-24 2001-08-24 Procede servant a fabriquer des structures micromecaniques possedant au moins un espace intermediaire limite et dispositif micromecanique fabrique au moyen de ce procede

Publications (1)

Publication Number Publication Date
AU2001293221A1 true AU2001293221A1 (en) 2002-03-04

Family

ID=22853357

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001293221A Abandoned AU2001293221A1 (en) 2000-08-24 2001-08-24 Method for making micromechanical structures having at least one lateral, small gap therebetween and micromechanical device produced thereby

Country Status (4)

Country Link
US (2) US20020070816A1 (fr)
EP (1) EP1311455A2 (fr)
AU (1) AU2001293221A1 (fr)
WO (1) WO2002016256A2 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003213570A1 (en) 2002-02-26 2003-09-09 The Regents Of The University Of Michigan Mems-based, computer systems, clock generation and oscillator circuits and lc-tank apparatus for use therein
US7172917B2 (en) * 2003-04-17 2007-02-06 Robert Bosch Gmbh Method of making a nanogap for variable capacitive elements, and device having a nanogap
JP4086023B2 (ja) * 2003-12-04 2008-05-14 セイコーエプソン株式会社 マイクロメカニカル静電振動子
US7551043B2 (en) * 2005-08-29 2009-06-23 The Regents Of The University Of Michigan Micromechanical structures having a capacitive transducer gap filled with a dielectric and method of making same
US7816166B1 (en) 2007-03-09 2010-10-19 Silicon Labs Sc, Inc. Method to form a MEMS structure having a suspended portion
US7514760B1 (en) 2007-03-09 2009-04-07 Silicon Clocks, Inc. IC-compatible MEMS structure
US7858422B1 (en) 2007-03-09 2010-12-28 Silicon Labs Sc, Inc. MEMS coupler and method to form the same
US20090315644A1 (en) * 2008-06-19 2009-12-24 Honeywell International Inc. High-q disk nano resonator device and method of fabricating the same
TWI434803B (zh) 2010-06-30 2014-04-21 Ind Tech Res Inst 微機電元件與電路晶片之整合裝置及其製造方法
CN108883927B (zh) * 2016-02-29 2023-06-13 密歇根大学董事会 制造三维微结构器件的方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082242A (en) 1989-12-27 1992-01-21 Ulrich Bonne Electronic microvalve apparatus and fabrication
US5620931A (en) * 1990-08-17 1997-04-15 Analog Devices, Inc. Methods for fabricating monolithic device containing circuitry and suspended microstructure
US5491604A (en) 1992-12-11 1996-02-13 The Regents Of The University Of California Q-controlled microresonators and tunable electronic filters using such resonators
WO1994014240A1 (fr) 1992-12-11 1994-06-23 The Regents Of The University Of California Processeurs de signal a elements microelectromecaniques
US5839062A (en) 1994-03-18 1998-11-17 The Regents Of The University Of California Mixing, modulation and demodulation via electromechanical resonators
US5640133A (en) 1995-06-23 1997-06-17 Cornell Research Foundation, Inc. Capacitance based tunable micromechanical resonators
US5914553A (en) 1997-06-16 1999-06-22 Cornell Research Foundation, Inc. Multistable tunable micromechanical resonators
US6167757B1 (en) 1997-09-08 2001-01-02 The Regents Of The University Of Michigan Single-side microelectromechanical capacitive accelerometer and method of making same
JP3147048B2 (ja) 1997-09-12 2001-03-19 日本電気株式会社 半導体装置
JP3003670B2 (ja) 1998-05-25 2000-01-31 日本電気株式会社 マイクロアクチュエータとその製造方法
FI108583B (fi) 1998-06-02 2002-02-15 Nokia Corp Resonaattorirakenteita
US6249073B1 (en) 1999-01-14 2001-06-19 The Regents Of The University Of Michigan Device including a micromechanical resonator having an operating frequency and method of extending same
EP1173893A4 (fr) 1999-01-15 2007-08-01 Univ California Films de polysilicium-germanium permettant de realiser des systemes micro-electromecaniques
US6347237B1 (en) * 1999-03-16 2002-02-12 Superconductor Technologies, Inc. High temperature superconductor tunable filter
US6305779B1 (en) 1999-04-09 2001-10-23 Eastman Kodak Company MEMS inkjet nozzle cleaning and closing mechanism
US6429034B1 (en) * 1999-12-16 2002-08-06 Corning Incorporated Method of making high aspect ratio features during surface micromachining
US6393913B1 (en) 2000-02-08 2002-05-28 Sandia Corporation Microelectromechanical dual-mass resonator structure

Also Published As

Publication number Publication date
WO2002016256A3 (fr) 2002-09-12
US20040150057A1 (en) 2004-08-05
EP1311455A2 (fr) 2003-05-21
US20020070816A1 (en) 2002-06-13
WO2002016256A2 (fr) 2002-02-28
US6846691B2 (en) 2005-01-25

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