AU2001290415A1 - Method of etching, as well as frame element, mask and prefabricated substrate element for use in such etching - Google Patents

Method of etching, as well as frame element, mask and prefabricated substrate element for use in such etching

Info

Publication number
AU2001290415A1
AU2001290415A1 AU2001290415A AU9041501A AU2001290415A1 AU 2001290415 A1 AU2001290415 A1 AU 2001290415A1 AU 2001290415 A AU2001290415 A AU 2001290415A AU 9041501 A AU9041501 A AU 9041501A AU 2001290415 A1 AU2001290415 A1 AU 2001290415A1
Authority
AU
Australia
Prior art keywords
etching
mask
well
prefabricated substrate
frame element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001290415A
Inventor
Gust Bierings
Bjarni Bjarnason
Goran Frennesson
Mikael Gustavsson
Per Pettersson
Jenny Sjoberg
Bin Xie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Obducat AB
Original Assignee
Obducat AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SE0003326A external-priority patent/SE519478C2/en
Application filed by Obducat AB filed Critical Obducat AB
Publication of AU2001290415A1 publication Critical patent/AU2001290415A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
AU2001290415A 2000-09-18 2001-09-18 Method of etching, as well as frame element, mask and prefabricated substrate element for use in such etching Abandoned AU2001290415A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US23342100P 2000-09-18 2000-09-18
US60233421 2000-09-18
SE0003326 2000-09-19
SE0003326A SE519478C2 (en) 2000-09-19 2000-09-19 Substrate etching method for manufacturing LCD panel, involves mounting frame on substrate such that it is adjacent to central circuit portion of substrate, before etching substrate
PCT/SE2001/001989 WO2002022916A1 (en) 2000-09-18 2001-09-18 Method of etching, as well as frame element, mask and prefabricated substrate element for use in such etching

Publications (1)

Publication Number Publication Date
AU2001290415A1 true AU2001290415A1 (en) 2002-03-26

Family

ID=26655239

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001290415A Abandoned AU2001290415A1 (en) 2000-09-18 2001-09-18 Method of etching, as well as frame element, mask and prefabricated substrate element for use in such etching

Country Status (3)

Country Link
AU (1) AU2001290415A1 (en)
TW (1) TW511432B (en)
WO (1) WO2002022916A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1303793B1 (en) 2000-07-17 2015-01-28 Board Of Regents, The University Of Texas System Method and system of automatic fluid dispensing for imprint lithography processes
US8850980B2 (en) 2006-04-03 2014-10-07 Canon Nanotechnologies, Inc. Tessellated patterns in imprint lithography
US7906274B2 (en) 2007-11-21 2011-03-15 Molecular Imprints, Inc. Method of creating a template employing a lift-off process

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5558552A (en) * 1978-10-25 1980-05-01 Chiyou Lsi Gijutsu Kenkyu Kumiai Metal wiring
JPH0444291A (en) * 1990-06-08 1992-02-14 Furukawa Electric Co Ltd:The Manufacture of circuit substrate for thick film conductor
JPH04168789A (en) * 1990-11-01 1992-06-16 Kawasaki Steel Corp Manufacture of ceramic circuit board
US5126016A (en) * 1991-02-01 1992-06-30 International Business Machines Corporation Circuitization of polymeric circuit boards with galvanic removal of chromium adhesion layers

Also Published As

Publication number Publication date
TW511432B (en) 2002-11-21
WO2002022916A1 (en) 2002-03-21

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