AU2001279578A1 - Electrical component and method for production thereof - Google Patents

Electrical component and method for production thereof

Info

Publication number
AU2001279578A1
AU2001279578A1 AU2001279578A AU7957801A AU2001279578A1 AU 2001279578 A1 AU2001279578 A1 AU 2001279578A1 AU 2001279578 A AU2001279578 A AU 2001279578A AU 7957801 A AU7957801 A AU 7957801A AU 2001279578 A1 AU2001279578 A1 AU 2001279578A1
Authority
AU
Australia
Prior art keywords
base body
intermediate layer
solution
electrical component
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001279578A
Inventor
Roland Peinsipp
Franz Schrank
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of AU2001279578A1 publication Critical patent/AU2001279578A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y10T29/49098—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Abstract

An method for manufacturing an electrical component comprises providing a base body of a ceramic material with at least two contact regions with terminal elements secured thereto. The base body is immersed into a solution that contains a fluid that wets the base body and a hydrophobic and lipophobic intermediate layer material dissolved in the fluid. The base body is removed from the solution so that a part of the solution remains adhering thereto as a film that completely envelopes the base body. An intermediate layer is produced by evaporating the fluid contained in the film, and a protective layer is applied onto the intermediate layer.
AU2001279578A 2000-08-30 2001-08-02 Electrical component and method for production thereof Abandoned AU2001279578A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10042636 2000-08-30
DE10042636A DE10042636C1 (en) 2000-08-30 2000-08-30 Electrical component and method for its production
PCT/DE2001/002931 WO2002019348A1 (en) 2000-08-30 2001-08-02 Electrical component and method for production thereof

Publications (1)

Publication Number Publication Date
AU2001279578A1 true AU2001279578A1 (en) 2002-03-13

Family

ID=7654326

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001279578A Abandoned AU2001279578A1 (en) 2000-08-30 2001-08-02 Electrical component and method for production thereof

Country Status (7)

Country Link
US (2) US7145430B2 (en)
EP (1) EP1314171B1 (en)
JP (2) JP5294528B2 (en)
AT (1) ATE298128T1 (en)
AU (1) AU2001279578A1 (en)
DE (2) DE10042636C1 (en)
WO (1) WO2002019348A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4430422B2 (en) * 2004-02-06 2010-03-10 株式会社日立製作所 Temperature sensor
ATE514767T1 (en) * 2004-07-16 2011-07-15 Danisco ENZYMATIC OIL GUMBERING PROCESS
DE102005021551A1 (en) * 2005-05-10 2006-11-16 BSH Bosch und Siemens Hausgeräte GmbH Refrigerating appliance with a water pipe
JP4744947B2 (en) * 2005-06-23 2011-08-10 本田技研工業株式会社 Electronic control unit and manufacturing method thereof
JP2007035766A (en) * 2005-07-25 2007-02-08 Hitachi Ltd Temperature sensing element
US7276839B1 (en) * 2005-11-30 2007-10-02 The United States Of America Represented By The Secretary Of The Navy Bondable fluoropolymer film as a water block/acoustic window for environmentally isolating acoustic devices
US7875812B2 (en) * 2008-07-31 2011-01-25 Ge Aviation Systems, Llc Method and apparatus for electrical component physical protection
JP2010141180A (en) * 2008-12-12 2010-06-24 Nichicon Corp Solid-state electrolytic capacitor, and method of manufacturing the same
US8684705B2 (en) * 2010-02-26 2014-04-01 Entegris, Inc. Method and system for controlling operation of a pump based on filter information in a filter information tag
KR101008310B1 (en) * 2010-07-30 2011-01-13 김선기 Ceramic chip assembly
DE102012109704A1 (en) * 2012-10-11 2014-04-17 Epcos Ag Ceramic component with protective layer and method for its production
JP6723690B2 (en) * 2015-06-01 2020-07-15 株式会社村田製作所 Coated lead type electronic component and manufacturing method thereof

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2741687A (en) * 1953-08-21 1956-04-10 Erie Resistor Corp Pyrolytic carbon resistors
US2885523A (en) * 1954-02-25 1959-05-05 Sprague Electric Co Molded resistors
US2883502A (en) * 1955-01-28 1959-04-21 Us Gasket Company Electrical resistors and other bodies with negligible temperature coefficient of expansion
US3666551A (en) * 1967-12-08 1972-05-30 Corning Glass Works Impregnating and coating composition for porous ceramic insulation
US3562007A (en) * 1968-04-25 1971-02-09 Corning Glass Works Flame-proof,moisture resistant coated article and process of making same
US3599139A (en) * 1969-03-14 1971-08-10 Blh Electronics Strain gage protective cover
US3655610A (en) * 1970-05-21 1972-04-11 Du Pont Fluoropolymer coating compositions
US3793716A (en) * 1972-09-08 1974-02-26 Raychem Corp Method of making self limiting heat elements
US3824328A (en) * 1972-10-24 1974-07-16 Texas Instruments Inc Encapsulated ptc heater packages
US4001655A (en) 1974-01-10 1977-01-04 P. R. Mallory & Co., Inc. Compressible intermediate layer for encapsulated electrical devices
IT1199770B (en) 1986-12-16 1988-12-30 Ausimont Spa EPOXY RESINS OBTAINED BY CORETICULATION OF FLUORINATED EPOXY PREPOLYMERS AND NON-FLUORINATED EPOXY PREPOLYMERS
JPS63137901U (en) * 1987-03-03 1988-09-12
JPS63317730A (en) * 1987-06-22 1988-12-26 Hitachi Heating Appliance Co Ltd Thermistor unit
US4804805A (en) * 1987-12-21 1989-02-14 Therm-O-Disc, Incorporated Protected solder connection and method
JP2578888B2 (en) * 1988-03-15 1997-02-05 松下電器産業株式会社 Zinc oxide varistor
JPH02152206A (en) * 1988-12-03 1990-06-12 Fujikura Ltd Insulating coating of electric element
JPH02303101A (en) * 1989-05-18 1990-12-17 Tdk Corp Ceramic electronic parts
JP3152352B2 (en) * 1990-11-14 2001-04-03 三菱マテリアル株式会社 Thermistor element
JPH04224896A (en) * 1990-12-26 1992-08-14 Nippon Kouyu:Kk Method and agent for preventing diffusion of grease
JP2839739B2 (en) * 1991-03-13 1998-12-16 日本碍子株式会社 Resistance element
JPH07201502A (en) * 1993-12-28 1995-08-04 Japan Gore Tex Inc Board mounding type electronic component
JPH08273912A (en) * 1995-03-30 1996-10-18 Matsushita Electric Ind Co Ltd Manufacture of electronic component
JPH08335502A (en) * 1995-06-07 1996-12-17 Tdk Corp Voltage nonlinear resistor and manufacture thereof
JPH0992662A (en) * 1995-09-25 1997-04-04 Chochi Sai Silicon semiconductor diode, its circuit module and structure with insulating material and those manufacture
US5661618A (en) * 1995-12-11 1997-08-26 International Business Machines Corporation Magnetic recording device having a improved slider
JP3344684B2 (en) * 1996-05-20 2002-11-11 株式会社村田製作所 Electronic components
JPH10233303A (en) * 1996-09-30 1998-09-02 Mitsubishi Materials Corp Ntc thermistor
JPH10335114A (en) 1997-04-04 1998-12-18 Murata Mfg Co Ltd Thermistor
JP3922761B2 (en) * 1997-06-04 2007-05-30 フクビ化学工業株式会社 Instrument pointer with white highly reflective paint
JPH11116278A (en) * 1997-10-20 1999-04-27 Central Glass Co Ltd Production of fluororesin coated body
JP3331953B2 (en) * 1998-03-19 2002-10-07 株式会社村田製作所 High voltage condenser
JPH11326689A (en) * 1998-05-18 1999-11-26 Asahi Glass Co Ltd Working method for front end part of plastic optical fiber
DE19851869B4 (en) * 1998-11-10 2007-08-02 Epcos Ag Thermistor temperature sensor
US6800176B1 (en) * 1999-06-17 2004-10-05 E. I. Du Pont De Nemours And Company Preservation of paper and textile materials

Also Published As

Publication number Publication date
DE10042636C1 (en) 2002-04-11
JP5294528B2 (en) 2013-09-18
WO2002019348A1 (en) 2002-03-07
DE50106534D1 (en) 2005-07-21
US7145430B2 (en) 2006-12-05
US20070040646A1 (en) 2007-02-22
EP1314171B1 (en) 2005-06-15
EP1314171A1 (en) 2003-05-28
JP2004508702A (en) 2004-03-18
JP5340350B2 (en) 2013-11-13
JP2011223030A (en) 2011-11-04
US7430797B2 (en) 2008-10-07
ATE298128T1 (en) 2005-07-15
US20040026106A1 (en) 2004-02-12

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