EP1314171B1 - Electrical component and method for production thereof - Google Patents

Electrical component and method for production thereof Download PDF

Info

Publication number
EP1314171B1
EP1314171B1 EP01957747A EP01957747A EP1314171B1 EP 1314171 B1 EP1314171 B1 EP 1314171B1 EP 01957747 A EP01957747 A EP 01957747A EP 01957747 A EP01957747 A EP 01957747A EP 1314171 B1 EP1314171 B1 EP 1314171B1
Authority
EP
European Patent Office
Prior art keywords
intermediate layer
basic body
solution
liquid
protective layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP01957747A
Other languages
German (de)
French (fr)
Other versions
EP1314171A1 (en
Inventor
Roland Peinsipp
Franz Schrank
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP1314171A1 publication Critical patent/EP1314171A1/en
Application granted granted Critical
Publication of EP1314171B1 publication Critical patent/EP1314171B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • Y10T29/49085Thermally variable
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • Y10T29/49087Resistor making with envelope or housing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • Y10T29/49087Resistor making with envelope or housing
    • Y10T29/49098Applying terminal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base

Definitions

  • the invention relates to an electrical component with a A body comprising a ceramic material, and at least two contact areas arranged on the base body, where connecting elements are attached, which with a Enveloped with organic constituents protective layer is. Furthermore, the invention relates to a process for the preparation of the electrical component.
  • the document DE 198 51 869 A1 discloses electrical components of the type mentioned above, the thermistor temperature sensor from a disk-shaped ceramic Represent material. Next to the material attached Lead wires, the temperature sensor has an epoxy resin cladding, the one additional component with hydrophobic properties contains.
  • the known electrical component has the disadvantage that it is sensitive to moisture. Although it is a hydrophobic Envelope of epoxy resin possesses, for example, by Dipping can be made under action moisture and / or water as a result of migration effects Failures occur.
  • applied voltage is namely between the two electric poles of the ceramic element, in which the Connecting wires are attached, a potential difference. If Under the conditions of use in a humid environment forms closed water film between the electrodes, so starts a material transport (mediated by silver, Tin and lead from that used when soldering the leads Lot) from the anode to the cathode. This forms metallic Films that are suitable, similar to printed conductors to act on the surface of the ceramic.
  • Thermistor temperature sensors may therefore only be used for applications be provided, where a condensation or water on the temperature sensor not he follows.
  • the thermistor temperature sensor with a To provide glass cladding In this construction can However, due to the high process temperatures no isolated Connecting wires are used. There is also here the danger that under appropriate conditions of use Damage due to electrochemical corrosion of the wires or Migration over the vitreous can occur.
  • the aim of the present invention is therefore a component specify the type mentioned, which also under the influence moisture has a high useful life.
  • the invention provides an electrical component, with a Basic body comprising a ceramic material and at least two arranged on the body contact areas on which connecting elements are attached, that of an organic Ingredients containing protective layer is wrapped and a disposed between the base body and the protective layer Intermediate layer comprising an intermediate layer material which is both hydrophobic and lipophobic is.
  • the device according to the invention has the advantage that by the intermediate layer of hydrophobic material penetrate of moisture from the outside to the surface of the body the places where the main body of the intermediate layer is covered, can be effectively reduced.
  • the device according to the invention has the advantage that due to the lipophobic material property of the intermediate layer this compatible with the surrounding the body Protective layer is.
  • this can also be a migration of components of the Protective layer through the intermediate layer on the surface of the main body including thereby enabled Damage can be effectively prevented.
  • the intermediate layer the Main body of the device tightly encloses, so that at the entire surface of the main body of the admission of moisture is difficult.
  • a component is particularly advantageous in which the interlayer material is soluble in a liquid, with which the base body can be wetted.
  • Such a device has the advantage that the intermediate layer in a simple way by dipping the Base body can be made into a solution that the Liquid and the intermediate layer material dissolved therein contains.
  • a component is particularly advantageous in which the thickness of the intermediate layer at the thinnest point at least 1.5 microns. Because of this minimum thickness is guaranteed that at all points where the intermediate layer at Body is arranged, the access of moisture to Body is difficult.
  • a suitable material for the intermediate layer, the required Properties, for example, is a fluoropolymer. It is a perfluorinated carbon skeleton.
  • the carbon skeleton can consist of chains, from connected ring systems or even a mixed form of both be constructed.
  • polyethers are also usable, which have no C-C chains but C-O-C chains.
  • the molecular weight of the polymer is advantageously over 1000 g / mol.
  • a fluoropolymer that in certain solvents, preferably in perfluorinated ones Alkanes, is soluble.
  • the fluorine-containing polymer can furthermore have the advantage that it has a soft, waxy consistency, which Favorable to the thermal shock resistance of Layer and also of the entire component can affect.
  • the protective layer of the component can advantageously made of a material that is electrically insulating and at the same time to protect the intermediate layer from abrasion suitable is.
  • a protective layer of this material has the advantage that it is the device from the outside against protects electrical short circuits.
  • the protective layer has the advantage that they are the intermediate layer of a Fluoropolymer, which have low mechanical resistance and may have a soft, waxy consistency, effective against mechanical damage by, for example Abrasion can protect.
  • a protective layer with respect to the required properties the electrical insulation and the protection of the intermediate layer comprises, advantageously consists of epoxy resin, Silicone or urethane.
  • the invention provides a method for producing a electrical component, which starts from a base body, comprising a ceramic material. It has the Base body at least two contact areas on which connecting elements are attached.
  • the method comprises the following steps:
  • the main body is in a solution submerged, the one wetting the main body liquid and a hydrophobic and lipophobic dissolved in this liquid Interlayer material contains.
  • the base body is so immersed in the solution that the body is completely inside the solution.
  • the body is so out of the solution taken from that part of the solution as a the basic body completely enveloping film adheres to it.
  • the film contained therein Liquid deprived by evaporation, creating the intermediate layer arises.
  • the protective layer is applied to the intermediate layer.
  • the protective layer can advantageously turn by dipping of the body in a corresponding solution or Liquid are applied.
  • the inventive method for producing the electrical Component has the advantage that it is particularly simple is to be realized, since for the application of the intermediate layer only the main body of the device immersed in a solution must become. Furthermore, the method has the advantage that the preparation of the intermediate layer from the solution Evaporation of liquid in a liquid film happens. Such evaporation requires in addition to simple storage of the component z. B. at room temperature no further technical measures and is therefore very cost-effective to realize.
  • the method can be carried out particularly advantageously by the viscosity of the solution into which the base dips, by suitable choice of the content of the solution of interlayer material adjusted so that the at the base body sticky film leads to an intermediate layer, the on the thinnest point is at least 1.5 ⁇ m thick. Through this Measure is ensured that the interlayer at each Has the required minimum thickness.
  • the intermediate layer material dissolved in Contains mold advantageously, a perfluoroalkane can be used in which a suitable as an interlayer material Fluoropolymer is soluble.
  • the figure shows an example of an inventive electrical Component in schematic cross section.
  • the figure shows an electrical component with a base body 1, which consists of a polycrystalline ceramic of the spinel type, in particular, of the Mn-Ni spinel type and above In addition, further doping or minor components may contain. In addition, ceramics are also conceivable which consist of other main components.
  • the above Mn-Ni spinel type ceramic is usually used as a base body 1 used for thermistor temperature sensor. Just It is special with such thermistor temperature sensors important that the body has a stable electrical resistance which is not affected by the action of moisture is changed.
  • the figure also shows a first contact region 2 and a second contact area 3, which at the top or Underside of the base body 1 are applied. These Contact areas, for example, by a silver-baking paste be prepared.
  • a first connection element 4 is fixed, which for example a wire provided with an electrical insulation can be.
  • the attachment of such a wire on the first Contact area 2 is preferably carried out by soldering.
  • a second connection element 5 in Attached form of a soldered, insulated wire.
  • the main body 1 is enveloped by an intermediate layer 7, by immersing the body 1 in a solution of a Fluoropolymer is applied.
  • This fluoropolymer is off built up multi-cyclic monomer units and its molecular weight is about 2000 g / mol.
  • the concentration of the solution This polymer is between 1% and 30%. By the Concentration of the solution can adjust the viscosity of the solution be, whereby the thickness of the intermediate layer. 7 is determined.
  • solvents for example, the easy available perfluoroalkanes, in particular perfluorohexane or Perfluorooctane suitable.
  • the sheath with a Two-component epoxy encapsulated in the dipping process, causing the Protective layer 6 is formed.
  • the intermediate layer 7 it should be noted that due to the application of the layer in a dipping process a largely homogeneous layer thickness, as shown in the figure is, can not be achieved. Rather, the Layer at the edges of the body 1 much thinner be, for example, between the contact areas 2, 3. In the embodiment described here became an intermediate layer 7 made at the edges of the main body 1 a layer thickness of less than 2 microns and others Make thicknesses can have up to 5 microns.
  • the protective layer 6 is by means of the dipping method described so applied that it has a layer thickness between 100 microns and 1000 microns. Regarding the protective layer 6 applies their layer thickness the same as for the intermediate layer 7 said.
  • a protective layer 6 are all suitable Standard wrapping materials, for example based on Epoxy resin, which are electrically insulating and the minimum strength against the formation of cracks exhibit. In addition to epoxy resin also come PU resin or silicone varnish into consideration.
  • the protective layer 6 may be in addition to the dipping method also applied with another method be, for. B. with the powder coating process.
  • the base body 1 When producing the intermediate layer 7 or the Protective layer 6, the base body 1 is preferably in the immersed appropriate liquid that end portions 8, 9th the connection elements 4, 5 remain uncoated and so as electrical contacts for connecting the device in one Circuit can be used.
  • Temperature sensor was under different test conditions tested for its water resistance. This was for example a water storage at a temperature of 80 ° C and an applied DC voltage of 3 V over 2000 hours carried out. This test was done by the temperature sensor without Change in electrical resistance survived.
  • the invention is not limited to the illustrated embodiment, but becomes in its most general form defined by claim 1 or claim 8.

Abstract

An method for manufacturing an electrical component comprises providing a base body of a ceramic material with at least two contact regions with terminal elements secured thereto. The base body is immersed into a solution that contains a fluid that wets the base body and a hydrophobic and lipophobic intermediate layer material dissolved in the fluid. The base body is removed from the solution so that a part of the solution remains adhering thereto as a film that completely envelopes the base body. An intermediate layer is produced by evaporating the fluid contained in the film, and a protective layer is applied onto the intermediate layer.

Description

Die Erfindung betrifft ein elektrisches Bauelement mit einem Grundkörper, der ein keramisches Material umfaßt, und mit wenigstens zwei auf dem Grundkörper angeordneten Kontaktbereichen, an denen Anschlußelemente befestigt sind, das mit einer organische Bestandteile enthaltenden Schutzschicht umhüllt ist. Ferner betrifft die Erfindung ein Verfahren zur Herstellung des elektrischen Bauelements.The invention relates to an electrical component with a A body comprising a ceramic material, and at least two contact areas arranged on the base body, where connecting elements are attached, which with a Enveloped with organic constituents protective layer is. Furthermore, the invention relates to a process for the preparation of the electrical component.

Aus der Druckschrift DE 198 51 869 A1 sind elektrische Bauelemente der eingangs genannten Art bekannt, die einen Heißleiter-Temperaturfühler aus einem scheibenförmigen keramischen Werkstoff darstellen. Neben an dem Werkstoff angebrachten Anschlußdrähten besitzt der Temperaturfühler eine Epoxydharz-Umhüllung, die eine Zusatzkomponente mit hydrophoben Eigenschaften enthält.The document DE 198 51 869 A1 discloses electrical components of the type mentioned above, the thermistor temperature sensor from a disk-shaped ceramic Represent material. Next to the material attached Lead wires, the temperature sensor has an epoxy resin cladding, the one additional component with hydrophobic properties contains.

Das bekannte elektrische Bauelement hat den Nachteil, daß es empfindlich ist gegenüber Feuchte. Obwohl es eine hydrophobe Umhüllung aus Epoxydharz besitzt, die beispielsweise durch Eintauchen hergestellt werden kann, können unter Einwirkung von Feuchte und/oder Wasser in Folge von Migrationseffekten Ausfälle auftreten. Durch die bei dem Betrieb des Bauelements verwendete anliegende Spannung besteht nämlich zwischen den beiden elektrischen Polen des Keramikelements, an denen die Anschlußdrähte befestigt sind, eine Potentialdifferenz. Wenn sich unter den Einsatzbedingungen bei feuchter Umgebung ein geschlossener Wasserfilm zwischen den Elektroden ausbildet, so startet ein Materialtransport (vermittelt durch Silber, Zinn und Blei von dem beim Anlöten der Anschlußdrähte verwendeten Lot) von der Anode zur Kathode. Dabei bilden sich metallische Filme, die geeignet sind, ähnlich wie Leiterbahnen auf der Oberfläche der Keramik zu fungieren. Dadurch nimmt der Widerstand des Sensors derart stark ab, daß es unter ungünstigen Umständen durch einen Kurzschluß sogar zu einem Totalausfall des Heißleiter-Temperaturfühlers kommen kann. Derartige Heißleiter-Temperaturfühler dürfen deshalb nur für Anwendungsgebiete vorgesehen werden, bei denen eine Betauung beziehungsweise Wassereinwirkung am Temperaturfühler nicht erfolgt.The known electrical component has the disadvantage that it is sensitive to moisture. Although it is a hydrophobic Envelope of epoxy resin possesses, for example, by Dipping can be made under action moisture and / or water as a result of migration effects Failures occur. By in the operation of the device applied voltage is namely between the two electric poles of the ceramic element, in which the Connecting wires are attached, a potential difference. If Under the conditions of use in a humid environment forms closed water film between the electrodes, so starts a material transport (mediated by silver, Tin and lead from that used when soldering the leads Lot) from the anode to the cathode. This forms metallic Films that are suitable, similar to printed conductors to act on the surface of the ceramic. As a result, takes the resistance of the sensor from so strong that it is unfavorable Circumstances caused by a short circuit even to a total failure the thermistor temperature sensor can come. such Thermistor temperature sensors may therefore only be used for applications be provided, where a condensation or water on the temperature sensor not he follows.

Zur Umgehung des geschilderten Problems ist es aus dem Stand der Technik bekannt, den Heißleiter-Temperaturfühler mit einer Glasumhüllung zu versehen. Bei dieser Konstruktion können allerdings aufgrund der hohen Prozeßtemperaturen keine isolierten Anschlußdrähte eingesetzt werden. Außerdem besteht hier die Gefahr, daß bei entsprechenden Anwendungsbedingungen Schädigungen durch elektrochemische Korrosion der Drähte oder Migration über den Glaskörper auftreten können.To circumvent the problem described it is from the state known in the art, the thermistor temperature sensor with a To provide glass cladding. In this construction can However, due to the high process temperatures no isolated Connecting wires are used. There is also here the danger that under appropriate conditions of use Damage due to electrochemical corrosion of the wires or Migration over the vitreous can occur.

Ziel der vorliegenden Erfindung ist es daher, ein Bauelement der eingangs genannten Art anzugeben, das auch unter Einwirkung von Feuchtigkeit eine hohe Brauchbarkeitsdauer aufweist.The aim of the present invention is therefore a component specify the type mentioned, which also under the influence moisture has a high useful life.

Dieses Ziel wird erfindungsgemäß durch ein elektrisches Bauelement nach Patentanspruch 1 erreicht. Vorteilhafte Ausgestaltungen der Erfindung sowie ein Verfahren zur Herstellung der Erfindung sind den weiteren Ansprüchen zu entnehmen.This object is achieved by an electrical component achieved according to claim 1. Advantageous embodiments of the invention as well as a method for the production The invention can be found in the further claims.

Die Erfindung gibt ein elektrisches Bauelement an, mit einem Grundkörper umfassend ein keramisches Material und wenigstens zwei auf dem Grundkörper angeordneten Kontaktbereichen, an denen Anschlußelemente befestigt sind, das von einer organische Bestandteile enthaltenden Schutzschicht umhüllt ist und eine zwischen dem Grundkörper und der Schutzschicht angeordnete Zwischenschicht umfaßt, die aus einem Zwischenschichtmaterial besteht, welches sowohl hydrophob als auch lipophob ist.The invention provides an electrical component, with a Basic body comprising a ceramic material and at least two arranged on the body contact areas on which connecting elements are attached, that of an organic Ingredients containing protective layer is wrapped and a disposed between the base body and the protective layer Intermediate layer comprising an intermediate layer material which is both hydrophobic and lipophobic is.

Das erfindungsgemäße Bauelement hat den Vorteil, daß durch die Zwischenschicht aus hydrophobem Material das Eindringen von Feuchte von außen auf die Oberfläche des Grundkörpers an den Stellen, an denen der Grundkörper von der Zwischenschicht abgedeckt ist, wirksam reduziert werden kann.The device according to the invention has the advantage that by the intermediate layer of hydrophobic material penetrate of moisture from the outside to the surface of the body the places where the main body of the intermediate layer is covered, can be effectively reduced.

Desweiteren hat das erfindungsgemäße Bauelement den Vorteil, daß aufgrund der lipophoben Materialeigenschaft der Zwischenschicht diese verträglich mit der den Grundkörper umgebenden Schutzschicht ist. Insbesondere findet keine chemische Reaktion zwischen der Schutzschicht und der Zwischenschicht statt. Dadurch kann auch ein Wandern von Bestandteilen der Schutzschicht durch die Zwischenschicht auf die Oberfläche des Grundkörpers einschließlich der dadurch ermöglichten Schädigungen wirksam verhindert werden.Furthermore, the device according to the invention has the advantage that due to the lipophobic material property of the intermediate layer this compatible with the surrounding the body Protective layer is. In particular, there is no chemical reaction between the protective layer and the intermediate layer instead of. This can also be a migration of components of the Protective layer through the intermediate layer on the surface of the main body including thereby enabled Damage can be effectively prevented.

Besonders vorteilhaft ist es, wenn die Zwischenschicht den Grundkörper des Bauelements dicht umschließt, so daß an der gesamten Oberfläche des Grundkörpers der Zutritt von Feuchte erschwert ist.It is particularly advantageous if the intermediate layer the Main body of the device tightly encloses, so that at the entire surface of the main body of the admission of moisture is difficult.

Desweiteren ist ein Bauelement besonders vorteilhaft, bei dem das Zwischenschichtmaterial in einer Flüssigkeit löslich ist, mit der der Grundkörper benetzt werden kann.Furthermore, a component is particularly advantageous in which the interlayer material is soluble in a liquid, with which the base body can be wetted.

Ein solches Bauelement hat den Vorteil, daß die Zwischenschicht auf einfache Art und Weise durch Eintauchen des Grundkörpers in eine Lösung hergestellt werden kann, die die Flüssigkeit und das darin gelöste Zwischenschichtmaterial enthält.Such a device has the advantage that the intermediate layer in a simple way by dipping the Base body can be made into a solution that the Liquid and the intermediate layer material dissolved therein contains.

Dadurch, daß der Grundkörper von der Flüssigkeit benetzt werden kann, ergibt sich der Vorteil, daß der Grundkörper problemlos so mit der Zwischenschicht bedeckt werden kann, daß die Zwischenschicht den Grundkörper dicht umschließt.Characterized in that the body are wetted by the liquid can, there is the advantage that the body easily so can be covered with the intermediate layer, that the intermediate layer tightly encloses the base body.

Desweiteren ist ein Bauelement besonders vorteilhaft, bei dem die Dicke der Zwischenschicht an der dünnsten Stelle wenigstens 1,5 µm beträgt. Aufgrund dieser Mindestdicke ist garantiert, daß an allen Stellen, an denen die Zwischenschicht am Grundkörper angeordnet ist, der Zutritt von Feuchte zum Grundkörper erschwert ist.Furthermore, a component is particularly advantageous in which the thickness of the intermediate layer at the thinnest point at least 1.5 microns. Because of this minimum thickness is guaranteed that at all points where the intermediate layer at Body is arranged, the access of moisture to Body is difficult.

Ein für die Zwischenschicht geeignetes Material, das die geforderten Eigenschaften aufweist, ist beispielsweise ein Fluorpolymer. Dabei handelt es sich um ein perfluoriertes Kohlenstoffgerüst. Das Kohlenstoffgerüst kann dabei aus Ketten, aus verbundenen Ringsystemen oder auch einer Mischform beider aufgebaut sein. Insbesondere ist ein Zwischenschichtmaterial besonders vorteilhaft, das aus kondensierten perfluorierten Ringsystemen besteht. Desweiteren sind auch Polyether verwendbar, die keine C-C-Ketten, sondern C-O-C-Ketten aufweisen. Das Molekulargewicht des Polymers liegt vorteilhafterweise über 1000 g/mol. Vorteilhaft ist auch ein Fluorpolymer, das in bestimmten Lösungsmitteln, vorzugsweise in perfluorierten Alkanen, löslich ist.A suitable material for the intermediate layer, the required Properties, for example, is a fluoropolymer. It is a perfluorinated carbon skeleton. The carbon skeleton can consist of chains, from connected ring systems or even a mixed form of both be constructed. In particular, an intermediate layer material particularly advantageous, that of condensed perfluorinated Ringsystems exists. Furthermore, polyethers are also usable, which have no C-C chains but C-O-C chains. The molecular weight of the polymer is advantageously over 1000 g / mol. Also advantageous is a fluoropolymer, that in certain solvents, preferably in perfluorinated ones Alkanes, is soluble.

Das fluorhaltige Polymer kann weiterhin den Vorteil haben, daß es eine weiche, wachsartige Konsistenz aufweist, welche sich günstig auf die Temperaturwechselbeständigkeit der Schicht und auch des gesamten Bauelements auswirken kann.The fluorine-containing polymer can furthermore have the advantage that it has a soft, waxy consistency, which Favorable to the thermal shock resistance of Layer and also of the entire component can affect.

Die Schutzschicht des Bauelements kann dabei vorteilhafterweise aus einem Material bestehen, das elektrisch isolierend und gleichzeitig zum Schutz der Zwischenschicht vor Abrieb geeignet ist. Eine Schutzschicht aus diesem genannten Material hat den Vorteil, daß es das Bauelement von Außen gegen elektrische Kurzschlüsse schützt. Zum anderen hat die Schutzschicht den Vorteil, daß sie die Zwischenschicht aus einem Fluorpolymer, das eine geringe mechanische Beständigkeit haben und eine weiche, wachsartige Konsistenz aufweisen kann, wirksam vor mechanischen Beschädigungen durch zum Beispiel Abrieb schützen kann.The protective layer of the component can advantageously made of a material that is electrically insulating and at the same time to protect the intermediate layer from abrasion suitable is. A protective layer of this material has the advantage that it is the device from the outside against protects electrical short circuits. On the other hand, the protective layer has the advantage that they are the intermediate layer of a Fluoropolymer, which have low mechanical resistance and may have a soft, waxy consistency, effective against mechanical damage by, for example Abrasion can protect.

Eine Schutzschicht, die die geforderten Eigenschaften bezüglich der elektrischen Isolierung und dem Schutz der Zwischenschicht aufweist, besteht vorteilhafterweise aus Epoxydharz, Silikon oder auch Urethan.A protective layer with respect to the required properties the electrical insulation and the protection of the intermediate layer comprises, advantageously consists of epoxy resin, Silicone or urethane.

Ferner gibt die Erfindung ein Verfahren zur Herstellung eines elektrischen Bauelements an, das von einem Grundkörper ausgeht, der ein keramisches Material umfaßt. Dabei weist der Grundkörper wenigstens zwei Kontaktbereiche auf, an denen Anschlußelemente befestigt sind.Furthermore, the invention provides a method for producing a electrical component, which starts from a base body, comprising a ceramic material. It has the Base body at least two contact areas on which connecting elements are attached.

Das Verfahren umfaßt folgende Schritte:The method comprises the following steps:

In einem ersten Schritt wird der Grundkörper in eine Lösung eingetaucht, die eine den Grundkörper benetzende Flüssigkeit und ein in dieser Flüssigkeit gelöstes hydrophobes und lipophobes Zwischenschichtmaterial enthält. Vorteilhafterweise wird der Grundkörper dabei so in die Lösung eingetaucht, daß der Grundkörper sich ganz innerhalb der Lösung befindet.In a first step, the main body is in a solution submerged, the one wetting the main body liquid and a hydrophobic and lipophobic dissolved in this liquid Interlayer material contains. advantageously, the base body is so immersed in the solution that the body is completely inside the solution.

In einem weiteren Schritt wird der Grundkörper so aus der Lösung entnommen, daß ein Teil der Lösung als ein den Grundkörper vollständig umhüllender Film daran haften bleibt.In a further step, the body is so out of the solution taken from that part of the solution as a the basic body completely enveloping film adheres to it.

In einem weiteren Schritt wird dem Film die darin enthaltene Flüssigkeit durch Verdunsten entzogen, wodurch die Zwischenschicht entsteht.In a further step, the film contained therein Liquid deprived by evaporation, creating the intermediate layer arises.

In einem sich daran anschließenden Schritt wird schließlich die Schutzschicht auf die Zwischenschicht aufgebracht. Dabei kann die Schutzschicht vorteilhafterweise wiederum durch Tauchen des Grundkörpers in eine entsprechende Lösung beziehungsweise Flüssigkeit aufgebracht werden.In a subsequent step will eventually the protective layer is applied to the intermediate layer. there The protective layer can advantageously turn by dipping of the body in a corresponding solution or Liquid are applied.

Das erfindungsgemäße Verfahren zur Herstellung des elektrischen Bauelements hat den Vorteil, daß es besonders einfach zu realisieren ist, da zum Aufbringen der Zwischenschicht lediglich der Grundkörper des Bauelements in eine Lösung eingetaucht werden muß. Desweiteren hat das Verfahren den Vorteil, daß die Herstellung der Zwischenschicht aus der Lösung durch Verdunsten von Flüssigkeit in einem Flüssigkeitsfilm geschieht. Ein solches Verdunsten erfordert neben einfacher Lagerung des Bauelements z. B. bei Zimmertemperatur keine weiteren technischen Maßnahmen und ist somit sehr kostengünstig zu realisieren.The inventive method for producing the electrical Component has the advantage that it is particularly simple is to be realized, since for the application of the intermediate layer only the main body of the device immersed in a solution must become. Furthermore, the method has the advantage that the preparation of the intermediate layer from the solution Evaporation of liquid in a liquid film happens. Such evaporation requires in addition to simple storage of the component z. B. at room temperature no further technical measures and is therefore very cost-effective to realize.

Das Verfahren kann besonders vorteilhaft durchgeführt werden, indem die Viskosität der Lösung, in die der Grundkörper eintaucht, durch geeignete Wahl des Gehalts der Lösung an Zwischenschichtmaterial so eingestellt wird, daß der am Grundkörper haftende Film zu einer Zwischenschicht führt, die an der dünnsten Stelle wenigstens 1,5 µm dick ist. Durch diese Maßnahme ist gewährleistet, daß die Zwischenschicht an jeder Stelle die erforderliche Mindestdicke aufweist.The method can be carried out particularly advantageously by the viscosity of the solution into which the base dips, by suitable choice of the content of the solution of interlayer material adjusted so that the at the base body sticky film leads to an intermediate layer, the on the thinnest point is at least 1.5 μm thick. Through this Measure is ensured that the interlayer at each Has the required minimum thickness.

Als Flüssigkeit, die das Zwischenschichtmaterial in gelöster Form enthält, kann vorteilhafterweise ein Perfluoralkan verwendet werden, in dem ein als Zwischenschichtmaterial geeignetes Fluorpolymer löslich ist.As a liquid, the intermediate layer material dissolved in Contains mold, advantageously, a perfluoroalkane can be used in which a suitable as an interlayer material Fluoropolymer is soluble.

Im folgenden wird die Erfindung anhand eines Ausführungsbeispiels und der dazugehörigen Figur näher erläutert.In the following the invention with reference to an embodiment and the associated figure explained in more detail.

Die Figur zeigt beispielhaft ein erfindungsgemäßes elektrisches Bauelement im schematischen Querschnitt.The figure shows an example of an inventive electrical Component in schematic cross section.

Die Figur zeigt ein elektrisches Bauelement mit einem Grundkörper 1, der aus einer polykristallinen Keramik vom Spinelltyp, insbesondere vom Mn-Ni-Spinelltyp sein kann und darüber hinaus noch weitere Dotierungen beziehungsweise Nebenbestandteile enthalten kann. Daneben sind auch Keramiken denkbar, die aus anderen Hauptbestandteilen bestehen. Die oben genannte Keramik vom Mn-Ni-Spinelltyp wird üblicherweise als Grundkörper 1 für Heißleiter-Temperaturfühler verwendet. Gerade bei solchen Heißleiter-Temperaturfühlern ist es besonders wichtig, daß der Grundkörper einen stabilen elektrischen Widerstand aufweist, der nicht durch das Einwirken von Feuchte verändert wird.The figure shows an electrical component with a base body 1, which consists of a polycrystalline ceramic of the spinel type, in particular, of the Mn-Ni spinel type and above In addition, further doping or minor components may contain. In addition, ceramics are also conceivable which consist of other main components. The above Mn-Ni spinel type ceramic is usually used as a base body 1 used for thermistor temperature sensor. Just It is special with such thermistor temperature sensors important that the body has a stable electrical resistance which is not affected by the action of moisture is changed.

Die Figur zeigt weiterhin einen ersten Kontaktbereich 2 und einen zweiten Kontaktbereich 3, die an der Ober- beziehungsweise Unterseite des Grundkörpers 1 aufgebracht sind. Diese Kontaktbereiche können beispielsweise durch eine Silber-Einbrennpaste hergestellt sein. An dem ersten Kontaktbereich 2 ist ein erstes Anschlußelement 4 befestigt, das beispielsweise ein mit einer elektrischen Isolierung versehener Draht sein kann. Die Befestigung eines solchen Drahtes am ersten Kontaktbereich 2 erfolgt vorzugsweise durch Löten. In gleicher Weise wie auf dem ersten Kontaktbereich 2 ist auf dem zweiten Kontaktbereich 3 ein zweites Anschlußelement 5 in Form eines angelöteten, isolierten Drahtes befestigt.The figure also shows a first contact region 2 and a second contact area 3, which at the top or Underside of the base body 1 are applied. These Contact areas, for example, by a silver-baking paste be prepared. At the first contact area 2, a first connection element 4 is fixed, which for example a wire provided with an electrical insulation can be. The attachment of such a wire on the first Contact area 2 is preferably carried out by soldering. In the same Way as on the first contact area 2 is on the second contact region 3, a second connection element 5 in Attached form of a soldered, insulated wire.

Der Grundkörper 1 ist umhüllt von einer Zwischenschicht 7, die durch Eintauchen des Grundkörpers 1 in eine Lösung eines Fluorpolymers aufgebracht ist. Dieses Fluorpolymer ist aus mehrzyklischen Monomereinheiten aufgebaut und sein Molekulargewicht beträgt zirka 2000 g/mol. Die Konzentration der Lösung dieses Polymers liegt zwischen 1 % und 30 %. Durch die Konzentration der Lösung kann die Viskosität der Lösung eingestellt werden, wodurch auch die Dicke der Zwischenschicht 7 bestimmt wird. Als Lösemittel sind zum Beispiel die leicht erhältlichen Perfluoralkane, insbesondere Perfluorhexan oder Perfluoroktan geeignet.The main body 1 is enveloped by an intermediate layer 7, by immersing the body 1 in a solution of a Fluoropolymer is applied. This fluoropolymer is off built up multi-cyclic monomer units and its molecular weight is about 2000 g / mol. The concentration of the solution This polymer is between 1% and 30%. By the Concentration of the solution can adjust the viscosity of the solution be, whereby the thickness of the intermediate layer. 7 is determined. As solvents, for example, the easy available perfluoroalkanes, in particular perfluorohexane or Perfluorooctane suitable.

Nach Abtrocknen des Lösemittels wird die Umhüllung mit einem Zweikomponenten-Epoxyd im Tauchverfahren umhüllt, wodurch die Schutzschicht 6 entsteht.After drying the solvent, the sheath with a Two-component epoxy encapsulated in the dipping process, causing the Protective layer 6 is formed.

Bezüglich der Zwischenschicht 7 ist zu beachten, daß aufgrund der Aufbringung der Schicht in einem Tauchverfahren eine weitgehend homogene Schichtdicke, wie sie in der Figur dargestellt ist, nicht erreicht werden kann. Vielmehr wird die Schicht an den Kanten des Grundkörpers 1 wesentlich dünner sein, als beispielsweise zwischen den Kontaktbereichen 2, 3. In dem hier beschriebenen Ausführungsbeispiel wurde eine Zwischenschicht 7 hergestellt, die an den Kanten des Grundkörpers 1 eine Schichtdicke von weniger als 2 µm und an anderen Stellen Dicken bis zu 5 µm aufweisen kann.With regard to the intermediate layer 7, it should be noted that due to the application of the layer in a dipping process a largely homogeneous layer thickness, as shown in the figure is, can not be achieved. Rather, the Layer at the edges of the body 1 much thinner be, for example, between the contact areas 2, 3. In the embodiment described here became an intermediate layer 7 made at the edges of the main body 1 a layer thickness of less than 2 microns and others Make thicknesses can have up to 5 microns.

Die Schutzschicht 6 wird mittels des beschriebenen Tauchverfahrens so aufgebracht, daß sie eine Schichtdicke zwischen 100 µm und 1000 µm aufweist. Für die Schutzschicht 6 gilt bezüglich ihrer Schichtdicke dasselbe wie für die Zwischenschicht 7 Gesagte. Als Schutzschicht 6 kommen alle geeignete Standardumhüllmaterialien, beispielsweise auf der Basis von Epoxydharz in Betracht, die elektrisch isolierend sind und die eine Mindestfestigkeit gegenüber die Bildung von Rissen aufweisen. Neben Epoxydharz kommen auch PU-Harz oder Silikonlack in Betracht. Die Schutzschicht 6 kann neben dem Tauchverfahren auch noch mit einem anderen Verfahren aufgebracht werden, z. B. mit dem Pulverbeschichtungsverfahren.The protective layer 6 is by means of the dipping method described so applied that it has a layer thickness between 100 microns and 1000 microns. Regarding the protective layer 6 applies their layer thickness the same as for the intermediate layer 7 said. As a protective layer 6 are all suitable Standard wrapping materials, for example based on Epoxy resin, which are electrically insulating and the minimum strength against the formation of cracks exhibit. In addition to epoxy resin also come PU resin or silicone varnish into consideration. The protective layer 6 may be in addition to the dipping method also applied with another method be, for. B. with the powder coating process.

Beim Herstellen der Zwischenschicht 7 beziehungsweise der Schutzschicht 6 wird der Grundkörper 1 vorzugsweise so in die entsprechende Flüssigkeit eingetaucht, daß Endabschnitte 8, 9 der Anschlußelemente 4, 5 unbeschichtet bleiben und so als elektrische Kontakte zum Anschließen des Bauelements in einem Schaltkreis verwendet werden können.When producing the intermediate layer 7 or the Protective layer 6, the base body 1 is preferably in the immersed appropriate liquid that end portions 8, 9th the connection elements 4, 5 remain uncoated and so as electrical contacts for connecting the device in one Circuit can be used.

Ein nach dem beschriebenen Ausführungsbeispiel hergestellter Temperaturfühler wurde unter verschiedenen Testbedingungen auf seine Wasserbeständigkeit getestet. Dazu wurde beispielsweise eine Wasserlagerung bei einer Temperatur von 80°C und einer anliegenden Gleichspannung von 3 V über 2000 Stunden durchgeführt. Dieser Test wurde von dem Temperaturfühler ohne Veränderung des elektrischen Widerstands überstanden.A produced according to the described embodiment Temperature sensor was under different test conditions tested for its water resistance. This was for example a water storage at a temperature of 80 ° C and an applied DC voltage of 3 V over 2000 hours carried out. This test was done by the temperature sensor without Change in electrical resistance survived.

Auch weitere durchgeführte Tests, die eine Abfolge verschiedenartiger Belastungen beinhalteten, wie beispielsweise: Temperaturwechselbelastung, nachfolgend Vibration, anschließend Wasserlagerung bei 80°C und bei einer Gleichspannung von 3 V, danach elektrische Belastung mit einer Heizleistung von 60 mW, anschließend zyklische Betauung beziehungsweise Beeisung unter Anlegen einer elektrischen Spannung sowie nachfolgend Alterung bei einer Temperatur von 155°C und anschließender Lagerung des Temperaturfühlers bei 80°C in Wasser unter Anlegen einer Spannung von 3 V. Auch diese Abfolge von Belastungen wurde von dem Temperaturfühler ohne Beschädigung bestanden. Die Tests wurden bestanden, ohne daß der Temperaturfühler seinen elektrischen Widerstand verändert hätte.Also, further tests that are a succession of different types Loads included, for example: thermal cycling, subsequently vibration, then Water storage at 80 ° C and at a DC voltage of 3 V, then electrical load with a heat output of 60 mW, followed by cyclic condensation or defrosting under application of an electrical voltage and subsequently Aging at a temperature of 155 ° C and subsequent Store the temperature sensor at 80 ° C in water while applying a voltage of 3 V. Also this sequence of loads was passed by the temperature sensor without damage. The tests were passed without the temperature sensor would have changed its electrical resistance.

Dieselben Tests wurden mit einem ähnlichen Temperaturfühler durchgeführt, allerdings ohne Zwischenschicht 7. Solche Temperaturfühler fallen bereits bei einer Wasserlagerung bei 80°C unter Anlegen einer elektrischen Spannung von 3 V am Fühler nach weniger als 100 Stunden zu 100 % aus.The same tests were done with a similar temperature probe performed, but without interlayer 7. Such temperature sensor fall already in a water storage at 80 ° C under application of an electrical voltage of 3 V am Sensor turns 100% off in less than 100 hours.

Die Erfindung beschränkt sich nicht auf das dargestellte Ausführungsbeispiel, sondern wird in ihrer allgemeinsten Form durch Patentanspruch 1 beziehungsweise Patentanspruch 8 definiert.The invention is not limited to the illustrated embodiment, but becomes in its most general form defined by claim 1 or claim 8.

Claims (10)

  1. Electrical component having
    a basic body (1) comprising a ceramic material,
    at least two contact regions (2, 3) arranged on the basic body (1), connection elements (4, 5) being fixed to said contact regions,
    which is encapsulated by a protective layer (6) containing organic constituents, and
    which has an intermediate layer (7) arranged between the basic body (1) and the protective layer (6), said intermediate layer being composed of an intermediate layer material which is both hydrophobic and lipophobic.
  2. Component according to Claim 1,
    in which the intermediate layer material is soluble in a liquid with which the basic body (1) can be wetted.
  3. Component according to Claim 2,
    in which the intermediate layer (7) is produced by immersing the basic body (1) in a solution which contains the liquid and the intermediate layer material dissolved therein.
  4. Component according to Claims 1 - 3,
    in which the thickness of the intermediate layer (7), at the thinnest location, is at least 1.5 µm.
  5. Component according to Claims 1 - 4,
    in which the intermediate layer material comprises a fluoropolymer.
  6. Component according to Claims 1 - 5,
    in which the protective layer (6) is composed of a material which is electrically insulating and is suitable for protecting the intermediate layer (7) against abrasion.
  7. Component according to Claim 6,
    in which the protective layer (6) comprises an epoxy resin, silicone or a urethane.
  8. Method for producing an electrical component, which proceeds from a basic body (1) comprising a ceramic material, at least two contact regions (2, 3) with connection elements (4, 5) fixed thereto being provided on said basic body, and which comprises the following steps of:
    a) immersing the basic body (1) in a solution which contains a liquid that wets the basic body (1) and a hydrophobic and lipophobic intermediate layer material dissolved in said liquid
    b) removing the basic body (1) from the solution in such a way that a portion of the solution adheres thereto as a film that completely encapsulates the basic body (1)
    c) producing the intermediate layer (7) by evaporation of the liquid contained in the film
    d) applying the protective layer (6) to the intermediate layer (7).
  9. Method according to Claim 8,
    the viscosity of the solution being set by a suitable choice of the content of intermediate layer material in such a way that the film adhering to the basic body (1) leads to an intermediate layer (7) having a thickness of at least 1.5 µm at the thinnest location.
  10. Method according to Claim 8 or 9,
    a perfluoroalkane being used as the liquid and a fluoropolymer being used as the intermediate layer material.
EP01957747A 2000-08-30 2001-08-02 Electrical component and method for production thereof Expired - Lifetime EP1314171B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10042636 2000-08-30
DE10042636A DE10042636C1 (en) 2000-08-30 2000-08-30 Electrical component and method for its production
PCT/DE2001/002931 WO2002019348A1 (en) 2000-08-30 2001-08-02 Electrical component and method for production thereof

Publications (2)

Publication Number Publication Date
EP1314171A1 EP1314171A1 (en) 2003-05-28
EP1314171B1 true EP1314171B1 (en) 2005-06-15

Family

ID=7654326

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01957747A Expired - Lifetime EP1314171B1 (en) 2000-08-30 2001-08-02 Electrical component and method for production thereof

Country Status (7)

Country Link
US (2) US7145430B2 (en)
EP (1) EP1314171B1 (en)
JP (2) JP5294528B2 (en)
AT (1) ATE298128T1 (en)
AU (1) AU2001279578A1 (en)
DE (2) DE10042636C1 (en)
WO (1) WO2002019348A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4430422B2 (en) * 2004-02-06 2010-03-10 株式会社日立製作所 Temperature sensor
PL1791933T3 (en) * 2004-07-16 2011-12-30 Dupont Nutrition Biosci Aps Enzymatic oil-degumming method
DE102005021551A1 (en) * 2005-05-10 2006-11-16 BSH Bosch und Siemens Hausgeräte GmbH Refrigerating appliance with a water pipe
JP4744947B2 (en) * 2005-06-23 2011-08-10 本田技研工業株式会社 Electronic control unit and manufacturing method thereof
JP2007035766A (en) * 2005-07-25 2007-02-08 Hitachi Ltd Temperature sensing element
US7276839B1 (en) * 2005-11-30 2007-10-02 The United States Of America Represented By The Secretary Of The Navy Bondable fluoropolymer film as a water block/acoustic window for environmentally isolating acoustic devices
US7875812B2 (en) * 2008-07-31 2011-01-25 Ge Aviation Systems, Llc Method and apparatus for electrical component physical protection
JP2010141180A (en) * 2008-12-12 2010-06-24 Nichicon Corp Solid-state electrolytic capacitor, and method of manufacturing the same
US8684705B2 (en) * 2010-02-26 2014-04-01 Entegris, Inc. Method and system for controlling operation of a pump based on filter information in a filter information tag
KR101008310B1 (en) * 2010-07-30 2011-01-13 김선기 Ceramic chip assembly
DE102012109704A1 (en) * 2012-10-11 2014-04-17 Epcos Ag Ceramic component with protective layer and method for its production
JP6723690B2 (en) * 2015-06-01 2020-07-15 株式会社村田製作所 Coated lead type electronic component and manufacturing method thereof

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2741687A (en) * 1953-08-21 1956-04-10 Erie Resistor Corp Pyrolytic carbon resistors
US2885523A (en) * 1954-02-25 1959-05-05 Sprague Electric Co Molded resistors
US2883502A (en) * 1955-01-28 1959-04-21 Us Gasket Company Electrical resistors and other bodies with negligible temperature coefficient of expansion
US3666551A (en) * 1967-12-08 1972-05-30 Corning Glass Works Impregnating and coating composition for porous ceramic insulation
US3562007A (en) * 1968-04-25 1971-02-09 Corning Glass Works Flame-proof,moisture resistant coated article and process of making same
US3599139A (en) * 1969-03-14 1971-08-10 Blh Electronics Strain gage protective cover
US3655610A (en) * 1970-05-21 1972-04-11 Du Pont Fluoropolymer coating compositions
US3793716A (en) * 1972-09-08 1974-02-26 Raychem Corp Method of making self limiting heat elements
US3824328A (en) 1972-10-24 1974-07-16 Texas Instruments Inc Encapsulated ptc heater packages
US4001655A (en) * 1974-01-10 1977-01-04 P. R. Mallory & Co., Inc. Compressible intermediate layer for encapsulated electrical devices
IT1199770B (en) 1986-12-16 1988-12-30 Ausimont Spa EPOXY RESINS OBTAINED BY CORETICULATION OF FLUORINATED EPOXY PREPOLYMERS AND NON-FLUORINATED EPOXY PREPOLYMERS
JPS63137901U (en) * 1987-03-03 1988-09-12
JPS63317730A (en) * 1987-06-22 1988-12-26 Hitachi Heating Appliance Co Ltd Thermistor unit
US4804805A (en) * 1987-12-21 1989-02-14 Therm-O-Disc, Incorporated Protected solder connection and method
JP2578888B2 (en) * 1988-03-15 1997-02-05 松下電器産業株式会社 Zinc oxide varistor
JPH02152206A (en) * 1988-12-03 1990-06-12 Fujikura Ltd Insulating coating of electric element
JPH02303101A (en) * 1989-05-18 1990-12-17 Tdk Corp Ceramic electronic parts
JP3152352B2 (en) * 1990-11-14 2001-04-03 三菱マテリアル株式会社 Thermistor element
JPH04224896A (en) * 1990-12-26 1992-08-14 Nippon Kouyu:Kk Method and agent for preventing diffusion of grease
JP2839739B2 (en) * 1991-03-13 1998-12-16 日本碍子株式会社 Resistance element
JPH07201502A (en) * 1993-12-28 1995-08-04 Japan Gore Tex Inc Board mounding type electronic component
JPH08273912A (en) * 1995-03-30 1996-10-18 Matsushita Electric Ind Co Ltd Manufacture of electronic component
JPH08335502A (en) * 1995-06-07 1996-12-17 Tdk Corp Voltage nonlinear resistor and manufacture thereof
JPH0992662A (en) * 1995-09-25 1997-04-04 Chochi Sai Silicon semiconductor diode, its circuit module and structure with insulating material and those manufacture
US5661618A (en) * 1995-12-11 1997-08-26 International Business Machines Corporation Magnetic recording device having a improved slider
JP3344684B2 (en) 1996-05-20 2002-11-11 株式会社村田製作所 Electronic components
JPH10233303A (en) * 1996-09-30 1998-09-02 Mitsubishi Materials Corp Ntc thermistor
JPH10335114A (en) * 1997-04-04 1998-12-18 Murata Mfg Co Ltd Thermistor
JP3922761B2 (en) * 1997-06-04 2007-05-30 フクビ化学工業株式会社 Instrument pointer with white highly reflective paint
JPH11116278A (en) * 1997-10-20 1999-04-27 Central Glass Co Ltd Production of fluororesin coated body
JP3331953B2 (en) * 1998-03-19 2002-10-07 株式会社村田製作所 High voltage condenser
JPH11326689A (en) * 1998-05-18 1999-11-26 Asahi Glass Co Ltd Working method for front end part of plastic optical fiber
DE19851869B4 (en) * 1998-11-10 2007-08-02 Epcos Ag Thermistor temperature sensor
US6800176B1 (en) * 1999-06-17 2004-10-05 E. I. Du Pont De Nemours And Company Preservation of paper and textile materials

Also Published As

Publication number Publication date
US20040026106A1 (en) 2004-02-12
US7145430B2 (en) 2006-12-05
JP2011223030A (en) 2011-11-04
ATE298128T1 (en) 2005-07-15
DE50106534D1 (en) 2005-07-21
US20070040646A1 (en) 2007-02-22
AU2001279578A1 (en) 2002-03-13
DE10042636C1 (en) 2002-04-11
EP1314171A1 (en) 2003-05-28
JP5340350B2 (en) 2013-11-13
JP5294528B2 (en) 2013-09-18
JP2004508702A (en) 2004-03-18
US7430797B2 (en) 2008-10-07
WO2002019348A1 (en) 2002-03-07

Similar Documents

Publication Publication Date Title
EP1314171B1 (en) Electrical component and method for production thereof
DE60201329T2 (en) Ceramic component and manufacturing process
DE1640502A1 (en) Method of manufacturing an electrical resistance element
DE2659566A1 (en) ELECTRICALLY INSULATING INTERMEDIATE LAYER FOR ELECTRICAL COMPONENTS AND A METHOD FOR MANUFACTURING ELECTRICAL COMPONENTS WITH SUCH AN INTERMEDIATE LAYER
DE2548402A1 (en) MULTIFUNCTIONAL ELECTROCHEMICAL MINIATURE SENSOR FOR SIMULTANEOUS CO LOW 2 / PH MEASUREMENTS
DE19901183A1 (en) Platinum temperature sensor and manufacturing method for the same
DE3416108A1 (en) HUMIDITY SENSOR
DE3507990C2 (en)
DE3504575A1 (en) Moisture-sensitive material and the use thereof
EP1908082A1 (en) Insulator exhibiting increase insulating properties
DE10020932C5 (en) Temperature sensor and method of making the same
DE102013106810A1 (en) Method for producing a multilayer varistor component and multilayer varistor component
EP0325203A1 (en) Method for making a layer of manganese dioxide of solid electrolyte capacitors
DE3603784A1 (en) PLATINUM RESISTANCE
DE19851869B4 (en) Thermistor temperature sensor
DE19639906C2 (en) insulating paste
DE2513859C2 (en) Method for producing a capacitor-resistor network
DE3305683C2 (en) Humidity sensor
DE3917417C2 (en) Ceramic high voltage capacitor and process for its manufacture
EP1386331B1 (en) Ceramic component comprising an environmentally stable contact system
DE19846936C1 (en) Tantalum electrolytic condenser for use in SMD elements has the increase in residual current under undesirable conditions prevented by inclusion of filler particles in moisture protection layer
DE10215572A1 (en) Ceramic electronic component used in electronics comprises ceramic body, terminal electrodes on body, and connecting clamps for connecting electrodes using tin-containing solder
EP1342250B1 (en) Electrical component and method for producing the same
WO2000025120A1 (en) Capacitive moisture sensor and a method for the production thereof
DE2942722A1 (en) METHOD FOR PRODUCING A GAS DETECTOR FOR FLAMMABLE GASES

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20030225

AK Designated contracting states

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED.

Effective date: 20050615

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20050615

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20050615

Ref country code: IE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20050615

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20050615

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REF Corresponds to:

Ref document number: 50106534

Country of ref document: DE

Date of ref document: 20050721

Kind code of ref document: P

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20050802

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20050802

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20050802

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20050831

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20050831

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20050831

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20050831

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20050915

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20050915

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20050915

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20050926

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 20050922

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20051124

NLV1 Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act
REG Reference to a national code

Ref country code: IE

Ref legal event code: FD4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20060316

BERE Be: lapsed

Owner name: EPCOS A.G.

Effective date: 20050831

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 16

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 17

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 50106534

Country of ref document: DE

Representative=s name: EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHA, DE

Ref country code: DE

Ref legal event code: R081

Ref document number: 50106534

Country of ref document: DE

Owner name: TDK ELECTRONICS AG, DE

Free format text: FORMER OWNER: EPCOS AG, 81669 MUENCHEN, DE

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20180924

Year of fee payment: 18

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20181214

Year of fee payment: 18

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20190821

Year of fee payment: 19

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20190802

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190831

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190802

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 50106534

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210302