AU2001275207A1 - Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system - Google Patents

Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system

Info

Publication number
AU2001275207A1
AU2001275207A1 AU2001275207A AU7520701A AU2001275207A1 AU 2001275207 A1 AU2001275207 A1 AU 2001275207A1 AU 2001275207 A AU2001275207 A AU 2001275207A AU 7520701 A AU7520701 A AU 7520701A AU 2001275207 A1 AU2001275207 A1 AU 2001275207A1
Authority
AU
Australia
Prior art keywords
polishing
memory
phosphate ion
rigid disk
polishing system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001275207A
Other languages
English (en)
Inventor
Homer Chou
Mingming Fang
Shumin Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials Inc
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of AU2001275207A1 publication Critical patent/AU2001275207A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AU2001275207A 2000-06-16 2001-06-04 Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system Abandoned AU2001275207A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09595227 2000-06-16
US09/595,227 US6976905B1 (en) 2000-06-16 2000-06-16 Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system
PCT/US2001/018056 WO2001098201A2 (fr) 2000-06-16 2001-06-04 Procede servant a polir un disque rigide ou memoire au moyen d'un systeme de polissage contenant des ions phosphate

Publications (1)

Publication Number Publication Date
AU2001275207A1 true AU2001275207A1 (en) 2002-01-02

Family

ID=24382321

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001275207A Abandoned AU2001275207A1 (en) 2000-06-16 2001-06-04 Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system

Country Status (4)

Country Link
US (1) US6976905B1 (fr)
JP (1) JP2003535968A (fr)
AU (1) AU2001275207A1 (fr)
WO (1) WO2001098201A2 (fr)

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US20040092103A1 (en) * 2000-07-19 2004-05-13 Shigeo Fujii Polishing fluid composition
JP4231632B2 (ja) 2001-04-27 2009-03-04 花王株式会社 研磨液組成物
JP4095798B2 (ja) * 2001-12-20 2008-06-04 株式会社フジミインコーポレーテッド 研磨用組成物
KR100474537B1 (ko) * 2002-07-16 2005-03-10 주식회사 하이닉스반도체 산화막용 ｃｍｐ 슬러리 조성물 및 이를 이용한 반도체소자의 제조 방법
JP3875156B2 (ja) * 2002-08-07 2007-01-31 花王株式会社 ロールオフ低減剤
US7736405B2 (en) * 2003-05-12 2010-06-15 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for copper and associated materials and method of using same
US20040242449A1 (en) * 2003-06-02 2004-12-02 Joshi Nayan H. Nitric acid and chromic acid-free compositions and process for cleaning aluminum and aluminum alloy surfaces
TWI286679B (en) 2003-06-04 2007-09-11 Kao Corp Removing agent composition
JP4202201B2 (ja) * 2003-07-03 2008-12-24 株式会社フジミインコーポレーテッド 研磨用組成物
CA2532114A1 (fr) * 2003-07-11 2005-01-27 W.R. Grace & Co.-Conn. Particules abrasives pour polissage mecanico-chimique
JP4206313B2 (ja) * 2003-08-08 2009-01-07 花王株式会社 磁気ディスク用研磨液組成物
US7112123B2 (en) * 2004-06-14 2006-09-26 Amcol International Corporation Chemical-mechanical polishing (CMP) slurry containing clay and CeO2 abrasive particles and method of planarizing surfaces
US7998228B2 (en) * 2006-07-19 2011-08-16 Cabot Microelectronics Corporation Tantalum CMP compositions and methods
US7776230B2 (en) * 2006-08-30 2010-08-17 Cabot Microelectronics Corporation CMP system utilizing halogen adduct
US20080081543A1 (en) * 2006-09-29 2008-04-03 Mipox International Corporation Water-based non-organic coolant for texturing hard disk
US20080132150A1 (en) * 2006-11-30 2008-06-05 Gregory John Arserio Polishing method for extreme ultraviolet optical elements and elements produced using the method
JP4523935B2 (ja) * 2006-12-27 2010-08-11 昭和電工株式会社 炭化珪素単結晶基板の研磨用水系研磨スラリー及び研磨法。
US20100087065A1 (en) * 2007-01-31 2010-04-08 Advanced Technology Materials, Inc. Stabilization of polymer-silica dispersions for chemical mechanical polishing slurry applications
KR20090118917A (ko) * 2007-02-08 2009-11-18 폰타나 테크놀로지 입자 제거방법 및 그 조성물
JP5576634B2 (ja) * 2008-11-05 2014-08-20 山口精研工業株式会社 研磨剤組成物及び磁気ディスク基板の研磨方法
US8226841B2 (en) * 2009-02-03 2012-07-24 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous memory disks
JP2011173958A (ja) * 2010-02-23 2011-09-08 Tokyo Electron Ltd スラリー製造方法、スラリー、研磨方法及び研磨装置
JP5617387B2 (ja) 2010-07-06 2014-11-05 富士電機株式会社 垂直磁気記録媒体用基板の製造方法、および、該製造方法により製造される垂直磁気記録媒体用基板
CN102127371B (zh) * 2010-12-16 2015-06-10 苏州天科合达蓝光半导体有限公司 一种碳化硅用抛光液的制备和使用方法
JP5896992B2 (ja) * 2011-04-25 2016-03-30 バンドー化学株式会社 研磨フィルム
US9039914B2 (en) 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks
JP6198740B2 (ja) * 2012-09-18 2017-09-20 株式会社フジミインコーポレーテッド 研磨用組成物
US10066126B2 (en) * 2016-01-06 2018-09-04 Cabot Microelectronics Corporation Tungsten processing slurry with catalyst

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US4588421A (en) * 1984-10-15 1986-05-13 Nalco Chemical Company Aqueous silica compositions for polishing silicon wafers
US4954142A (en) 1989-03-07 1990-09-04 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
US4959113C1 (en) * 1989-07-31 2001-03-13 Rodel Inc Method and composition for polishing metal surfaces
JPH0781132B2 (ja) 1990-08-29 1995-08-30 株式会社フジミインコーポレーテッド 研磨剤組成物
US6069080A (en) 1992-08-19 2000-05-30 Rodel Holdings, Inc. Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
BE1007280A3 (nl) * 1993-07-12 1995-05-09 Philips Electronics Nv Werkwijze voor het polijsten van een oppervlak van een edelmetaal of een in hoofdzaak edelmetaal bevattende legering, magneetkop vervaardigbaar met gebruikmaking van de werkwijze en polijstmiddel geschikt voor toepassing in de werkwijze.
JP3397501B2 (ja) 1994-07-12 2003-04-14 株式会社東芝 研磨剤および研磨方法
US5632667A (en) * 1995-06-29 1997-05-27 Delco Electronics Corporation No coat backside wafer grinding process
US5690539A (en) * 1995-08-07 1997-11-25 Cal-West Equipment Company Inc. Method of abarding using surface abrasion compositions
KR19990064305A (ko) * 1995-10-20 1999-07-26 스프레이그 로버트 월터 무기 포스페이트를 함유하는 연마 용품 및 그것의 제조 방법
JPH09190626A (ja) 1995-11-10 1997-07-22 Kao Corp 研磨材組成物、磁気記録媒体用基板及びその製造方法並びに磁気記録媒体
US5866031A (en) 1996-06-19 1999-02-02 Sematech, Inc. Slurry formulation for chemical mechanical polishing of metals
US5827781A (en) 1996-07-17 1998-10-27 Micron Technology, Inc. Planarization slurry including a dispersant and method of using same
US6152976A (en) * 1996-08-30 2000-11-28 Showa Denko Kabushiki Kaisha Abrasive composition for disc substrate, and process for polishing disc substrate
US5773364A (en) * 1996-10-21 1998-06-30 Motorola, Inc. Method for using ammonium salt slurries for chemical mechanical polishing (CMP)
US5958288A (en) 1996-11-26 1999-09-28 Cabot Corporation Composition and slurry useful for metal CMP
US5954997A (en) 1996-12-09 1999-09-21 Cabot Corporation Chemical mechanical polishing slurry useful for copper substrates
US5922091A (en) 1997-05-16 1999-07-13 National Science Council Of Republic Of China Chemical mechanical polishing slurry for metallic thin film
US6190237B1 (en) * 1997-11-06 2001-02-20 International Business Machines Corporation pH-buffered slurry and use thereof for polishing
JPH11256141A (ja) * 1998-03-12 1999-09-21 Sony Corp 研磨スラリーおよび研磨方法
US6276996B1 (en) * 1998-11-10 2001-08-21 Micron Technology, Inc. Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
US6234875B1 (en) * 1999-06-09 2001-05-22 3M Innovative Properties Company Method of modifying a surface
CN100335580C (zh) 1999-08-13 2007-09-05 卡伯特微电子公司 含有阻化化合物的抛光系统及其使用方法
US6280490B1 (en) * 1999-09-27 2001-08-28 Fujimi America Inc. Polishing composition and method for producing a memory hard disk

Also Published As

Publication number Publication date
WO2001098201A3 (fr) 2002-03-21
JP2003535968A (ja) 2003-12-02
US6976905B1 (en) 2005-12-20
WO2001098201A2 (fr) 2001-12-27

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