AU2001267906A1 - Molding resin composition and method of molding - Google Patents

Molding resin composition and method of molding

Info

Publication number
AU2001267906A1
AU2001267906A1 AU2001267906A AU6790601A AU2001267906A1 AU 2001267906 A1 AU2001267906 A1 AU 2001267906A1 AU 2001267906 A AU2001267906 A AU 2001267906A AU 6790601 A AU6790601 A AU 6790601A AU 2001267906 A1 AU2001267906 A1 AU 2001267906A1
Authority
AU
Australia
Prior art keywords
molding
resin composition
resin
processing
microscopic structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001267906A
Inventor
Minoru Adachi
Shoji Uesugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cluster Technology Co Ltd
Original Assignee
Cluster Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cluster Technology Co Ltd filed Critical Cluster Technology Co Ltd
Publication of AU2001267906A1 publication Critical patent/AU2001267906A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0013—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor using fillers dispersed in the moulding material, e.g. metal particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2628—Moulds with mould parts forming holes in or through the moulded article, e.g. for bearing cages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14387—Front shooter

Abstract

The present invention provides a resin composition suitable for molding a microscopic structure that has small cure shrinkage, good mold transfer properties and excellent properties for post-processing such as polishing processing and laser processing. Such a resin is a thermosetting resin composition comprising 95 to 35 wt% of a thermosetting resin and 5 to 65 wt% of organic filler having a particle size of 10 mu m or less. From such a resin, an ink ejecting apparatus having a microscopic structure, for example, a nozzle of a diameter of 30 mu m, is integrally molded. <IMAGE>
AU2001267906A 2000-07-03 2001-07-02 Molding resin composition and method of molding Abandoned AU2001267906A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-201564 2000-07-03
JP2000201564 2000-07-03
PCT/JP2001/005729 WO2002002697A1 (en) 2000-07-03 2001-07-02 Molding resin composition and method of molding

Publications (1)

Publication Number Publication Date
AU2001267906A1 true AU2001267906A1 (en) 2002-01-14

Family

ID=18699234

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001267906A Abandoned AU2001267906A1 (en) 2000-07-03 2001-07-02 Molding resin composition and method of molding

Country Status (6)

Country Link
US (1) US7001560B2 (en)
EP (1) EP1300446B1 (en)
JP (2) JP3940766B2 (en)
AT (1) ATE535576T1 (en)
AU (1) AU2001267906A1 (en)
WO (1) WO2002002697A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035701A1 (en) 2004-09-27 2006-04-06 The Furukawa Electric Co., Ltd. Connecting member
JP2006212984A (en) * 2005-02-04 2006-08-17 Fuji Photo Film Co Ltd Liquid discharging port forming method
JP2007161544A (en) * 2005-12-15 2007-06-28 Kobe Steel Ltd Method for manufacturing glassy carbon
US8328330B2 (en) * 2008-06-03 2012-12-11 Lexmark International, Inc. Nozzle plate for improved post-bonding symmetry
JP5059056B2 (en) * 2009-06-17 2012-10-24 キヤノン株式会社 Microstructure manufacturing method and liquid discharge head manufacturing method
DE102010041681A1 (en) 2010-09-29 2012-03-29 BSH Bosch und Siemens Hausgeräte GmbH Injection molding process for the selective production of molded parts with and without breakthrough
CN103865356B (en) * 2014-04-01 2017-10-03 桦甸市惠邦木业有限责任公司 A kind of lackering method of mold pressing resin paint
US20210332364A1 (en) 2020-04-28 2021-10-28 Phyzat Biopharmaceuticals, Lda siNA MOLECULES, METHODS OF PRODUCTION AND USES THEREOF

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA756686A (en) * 1967-04-11 E. Peerman Dwight Thermosetting coating powders from guanamines and epoxy resins
JPS5739925A (en) * 1980-08-22 1982-03-05 Hitachi Chem Co Ltd Manufacture of shape in unsaturated polyester resin with high surface hardness
JPS591526A (en) * 1982-06-28 1984-01-06 Fujitsu Ltd Resin composition for use in nozzle plate
JPS5958018A (en) * 1982-09-28 1984-04-03 Nitto Electric Ind Co Ltd Unsaturated polyester resin composition for molding
JPS5998861A (en) * 1982-11-30 1984-06-07 Seiko Epson Corp Ink jet head
JPS61246227A (en) * 1985-04-24 1986-11-01 Matsushita Electric Works Ltd Epoxy resin composition
JPS6429479A (en) 1987-07-23 1989-01-31 Ibiden Co Ltd Adhesive composition for electroless plating
US5312866A (en) * 1989-11-30 1994-05-17 Mitsui Toatsu Chemicals, Incorporated Polyimide based resin composition
JPH04198274A (en) * 1990-11-27 1992-07-17 Mitsubishi Electric Corp Molding resin for sealing semiconductor
JPH04339658A (en) * 1991-05-17 1992-11-26 Seiko Epson Corp Ink jet recording head
MY129026A (en) * 1992-09-09 2007-03-30 Sumitomo Bakelite Co Phenolic resin molding material
JP2930819B2 (en) * 1992-10-19 1999-08-09 住友ベークライト株式会社 Method for producing phenolic resin molding material
JP3519100B2 (en) * 1993-04-02 2004-04-12 サンスター技研株式会社 Anisotropic conductive adhesive composition
US5385778A (en) * 1993-07-19 1995-01-31 Southwest Research Institute Toughened thermosetting resin composites and process
JPH0874904A (en) * 1994-09-02 1996-03-19 Sumitomo Durez Co Ltd Resin composition for frictional material
JPH08267738A (en) * 1995-03-31 1996-10-15 Seiko Epson Corp Ink jet record head
JPH0940859A (en) * 1995-07-26 1997-02-10 Dainippon Ink & Chem Inc Thermosetting resin composition for friction material and friction material
CN100505977C (en) * 1995-11-10 2009-06-24 揖斐电株式会社 Multilayer printed circuit board and its manufacture method
US5750597A (en) * 1996-06-20 1998-05-12 Plastics Engineering Company Thermosetting resin compositions
JP3296995B2 (en) * 1997-06-12 2002-07-02 イビデン株式会社 Raw material composition for preparing interlayer resin insulator and method for preparing interlayer resin insulator
JPH1158736A (en) * 1997-08-20 1999-03-02 Ricoh Co Ltd Ink jet head and manufacture thereof
JP4084446B2 (en) * 1997-08-26 2008-04-30 ユニチカ株式会社 Phenolic resin molding material
JPH11115194A (en) * 1997-10-16 1999-04-27 Unitika Ltd Nozzle plate for ink-jet head and its manufacture
JP3757055B2 (en) * 1998-04-30 2006-03-22 Ｎｔｎ株式会社 Lubricating rubber composition and seal member
DE60007194T2 (en) * 1999-02-04 2004-08-26 Mitsubishi Denki K.K. Epoxy resin composition for SF6 gas-insulated device and SF6 gas-insulated device

Also Published As

Publication number Publication date
EP1300446B1 (en) 2011-11-30
WO2002002697A1 (en) 2002-01-10
EP1300446A4 (en) 2009-04-29
ATE535576T1 (en) 2011-12-15
US20030109635A1 (en) 2003-06-12
JP2007083736A (en) 2007-04-05
JP4719666B2 (en) 2011-07-06
JP3940766B2 (en) 2007-07-04
EP1300446A1 (en) 2003-04-09
US7001560B2 (en) 2006-02-21

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